CN101431858A

CN101431858A - All-metal ultra-high conducting CTP circuit board

Info

Publication number: CN101431858A
Application number: CNA2008102121471A
Authority: CN
Inventors: 秦玉行; 宋立峰; 张京平; 高相起
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-09-09
Filing date: 2008-09-09
Publication date: 2009-05-13

Abstract

Along with the development of high-power LED encapsulation and chip adhered to base board directly, not only heat dissipation should be considered on selecting base board material, but also matching with coefficient of heat expansion of chip be considered. We research and develop ultra-high conducting surface Porcelain material and design circuit pattern directly on it because traditional aluminum base PCB cannot satisfy the demand. The coefficient of heat expansion of all-metal CTP circuit board is between 4-8 PPM/K and matches with LED chip (about 6 PPM/K) perfectly, which satisfies demand of LED encapsulation. The process flow of the all-metal ultra-high conducting CTP circuit board is as following: base board blanking--superficial treatment--baking--checking--pattern transfer--sintering--molding. Compared with traditional process, the process described in the invention has following features: short process flow; manufacturing process friendly to environment; energy and consumption saving; great improvement on product performance index compared with traditional aluminum base PCB besides advanced technology.

Description

All-metal ultra-high conducting CTP circuit board

Aluminium base copper-clad plate is SANYO GS company research invention in 1969, through the development of decades, has reached 10,000,000,000 Yen to the Japanese aluminium base output value in 2007.And China was responsible for development and production in 1988 by 704 factories, finished the ministerial level design typification in 1996, and annual production is but very low.The present domestic manufacturer that the aluminium base copper-clad plates of tens tame professional production also occur, but production technology tradition, properties of product are relatively poor.Common aluminium base copper-clad plate has two kinds: a kind of is universal aluminium base copper-clad plate, and insulating barrier is made of the epoxy glass fabric sticky piece; Another kind is high heat radiation aluminium-based copper-clad plate, and insulating barrier is made of the epoxy resin of high heat conduction or other resin, mixes some heat-conducting metal fibers in the resin, thereby reaches the purpose of heat radiation.These two kinds of aluminium base copper-clad plates have had very big improvement with respect to traditional FR-4 copper-clad plate from the heat radiation aspect, so the circuit board of producing with aluminium base copper-clad plate has obtained using more widely.But because the LED development of technology, LED uses also diversification day by day, and the LED power output is more and more higher, the heat transferred that led chip produces be gone out, and must take into account structural strength and radiating requirements on material is selected.In addition, along with directly the adhere development of substrate of high-power LED encapsulation and chip, the selection of substrate material also will be considered to be complementary with the thermal coefficient of expansion of chip except considering heat radiation.And traditional aluminum base PCB can't satisfy this requirement, has has Given this researched and developed the ultra-high conducting surface porcelain formed material, directly does circuitous pattern on material.The thermal coefficient of expansion of this all-metal ultra-high conducting CTP circuit board is between 4-8PPM/K, and (about 6PPM/K) just is complementary with led chip, has satisfied the demand of LED encapsulation technology fully.

Our Metal Substrate PCB direct imaging technology that began one's study in 2005, its technological process is: the substrate blanking, and------baking--is checked--figure transfer--sintering---moulding in surperficial porcelain processing in surface treatment.Compare with traditional handicraft, this technology possesses following characteristics: 1) technological process is short: be equivalent to 1/2 of traditional handicraft, thereby improved production efficiency greatly.2) manufacturing process environmental protection: removed the electrochemical treatments in the traditional handicraft, Acidity of Aikalinity etch process, alkaline solder mask imaging process, this several roads technology all exists metal and COD to pollute, and is serious to environmental disruption, thereby realized the manufacturing process greenization.3) energy-conservation joint consumption: flow process is short, the utilization rate of equipment and installations height, belongs to continuous productive process, and energy consumption is lower, and direct imaging technology has reduced manufactured materials and artificial waste.Except the technology advanced person, its product performance index is compared also with traditional aluminum base PCB and is greatly improved.We have solved following key point to this technology technically: 1) aluminium surface porcelain technology: common oxidation technology aluminium sheet oxide-film is very thin, and stereovision is stronger, withstand voltage lower, under the normality 1000V/AC, it only is 400V/AC that humidity surpasses at 70% o'clock, for a long time use or bigger in the outdoor utility risk.We directly form hard ALO or the ALN porcelain layer of one deck on the aluminium surface through a series of electrochemical reactions, and withstand voltage reaching more than the 3000V/AC can be satisfied the demand of high-power radiating element.2) metallic conductor forming technique: metal paste forms conductive pattern by silk screen printing, again through 600 high temperature sinterings of spending, through up to a hundred times practice, we have summed up the scientific and reasonable sintering temperature curve of a cover, thereby have avoided the problem of image drift and insulating barrier be full of cracks.Solved above two technological difficulties, the aluminum base PCB direct imaging technology is achieved commercial application.

The performance index of all-metal ultra-high conducting CTP circuit board are as follows:

1) thermal resistance 0.27

2) conductor resistance 00033

3) maximum operation temperature 195

4) conductive coefficient 135

5) withstand voltage 2000V/AC

6) peel strength 40 newton

7) cold shock testing-50--180,20 circulations, pulling force: 35 newton

8) fire-retardant index does not have flammability

Accompanying drawing is the all-metal ultra-high conducting CTP circuit board internal anatomy

Claims

1. the surface of aluminum plate electrochemical treatments forms AL2O3 or ALN ceramic layer technology or the technique for applying of this technology on PCB.

2. the sintering process behind surface of aluminum plate screen-printed metal conductor.

3. super-high heat-conductive direct imaging printed circuit board (pcb) title protection.

4. all-metal ultra-high conducting CTP circuit board title protection.

5. the surperficial solder mask process technology after the metallic conduction figure is finished.

6. the surface of aluminium base circuit board (PCB) is the conductive circuit technology directly.

7. super-high heat-conductive insulation CTP circuit board streamline equipment process design technology and manufacturing technology.