TWM343769U - Heat dissipation apparatus - Google Patents

Heat dissipation apparatus Download PDF

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Publication number
TWM343769U
TWM343769U TW97209627U TW97209627U TWM343769U TW M343769 U TWM343769 U TW M343769U TW 97209627 U TW97209627 U TW 97209627U TW 97209627 U TW97209627 U TW 97209627U TW M343769 U TWM343769 U TW M343769U
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TW
Taiwan
Prior art keywords
heat
component
dissipating device
item
heat dissipating
Prior art date
Application number
TW97209627U
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Chinese (zh)
Inventor
si-mao Wen
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Daywey Co Ltd
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Application filed by Daywey Co Ltd filed Critical Daywey Co Ltd
Priority to TW97209627U priority Critical patent/TWM343769U/en
Publication of TWM343769U publication Critical patent/TWM343769U/en

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Description

M343769 八、新型說明: 【新型所屬之技術領域】 本創作係一種散熱裝置,其係一種藉由互相配合卡扣方式,使一體成塑 之第一、二部件結合成一呈立方體之散熱體,而節省固定焊接之作業時間及達 到最佳之絕緣效果者。 【先前技術】 按’在日常生活上最常接觸之燈光光源有舊式燈泡、石英燈泡、日光燈泡 及水銀燈等,不同於前述之燈源,發光二極體係屬於冷發光,具有耗電量低、 0元件壽命長、不需暖燈時間、反應速度快等優點,再加上其體積小、耐震動、 適合量產、容易配合應用上之需求製作,所以發光二極體(LED)已成為日常生活 上不可或缺之重要元件,但以發光二極體作為照明用之光源,因電-光轉換效率 問題,使用時會產生高熱,而持續之高熱對於電子元件會造成損害。 現今一般作為照明用之發光二極體燈具,其大都設有散熱座,該散熱座一 面上設有複數個排列整齊之散熱鰭片,該等散熱鰭片與散熱座係呈垂直狀,且 該散熱座上則設有一凹框,該凹框上分別固定設有至少一燈座,該等燈座分別 與電路板作電性連接,且該等燈座上分別安裝有一發光二極體,如此一來,雖 可藉由散熱座將電路板所產生之熱排除,而使發光二極體運作正常,惟因其係 •集令在一電路板上,並透過僅有一個散熱座進行散熱,往往會發生熱滯留在電 路板上’無法迅速將熱導散出去,而使燈具過烫,在使用上非常不理想。 再者,請參照第1圖所示,其為一種作為發光二極體散熱用之散熱體10〇, 该散熱體100上設有一底座110,該底座11〇上裝有以扣接方式排成環狀之肋板 120,該等肋板120係作為散熱片之用,且該等肋板12〇係由底端向頂端逐漸擴 張,而在該等肋板120頂端外圍套設有一環圈130,該環圈130以焊接方式與該 等肋板120結合在一起,且該等肋板120頂端内環置設有一盤體14〇,該盤體 140下亦設有開口方向相反之盤體140,該等盤體14〇内係分別供置放發光二極 體與電路板(圖中未示使用時,係先將該整個散熱體1〇〇經過陽極處理,以 M343769 使該散熱體100形成絕緣狀態,再將該等上、下盤體140藉由蟬接方式固定於 該等肋板120之内環;但,如此一來,常常容易造成整個散熱體1〇〇會有部分 不絕緣之狀況,而造成使用者之危險,也因此產生該散熱體1〇〇之不良率過高, 以致增加生產成本,使用上非常不理想。 【新型内容】 創作綱要: 本創作之卿人有祕上叙缺點,目此乃針對其麟所在,開始著手加 ,謀求改善’娜所缺,以期尋求—項合理解決之道,經過無數次之研析、設 計,終於完成本創作之散熱裝置。 本創作之-目的,在提供一種散熱裝置,該裝置係為 發光二__之散_,該《上設有互她合之第—m 第=二部件分職—體細之立體狀,而在第―、二部件分別設有互相配合 ,Γ一、二卡扣件,以令組合時,可藉由第―、二卡扣件之互相卡扣,使第-、 -部件結合在-起,如此—來,不但可節省焊接作#,及增加該散熱裝置之絕 緣效果,且能達到迅速散熱之目的者。 、 t創作之再-目的,在提供一種散熱裝置,其第一、二部件間爽設有至少 一導熱讀,該導熱元件係為導難佳之材料所構成之錄物翻狀物 增加散熱效果。 本創作之另-目的’在提供—種散熱裝置,其導熱元件係與第二部件 緣相接,以增加散熱效果。 料2作之又_目的,在提供—種散熱裝置,其第―、二部件間可配合不同 之發光二鋪_燈具重疊纽林量之導熱元件,以增加散熱 【實施方式】 明參閱第2、3、3a騎示,摘作#,纖絲置,其係 之發光二極雖ED)燈具之雜裝置,該裝置上設有—呈立敵之第—H用 6 M343769 :本貝施例為碗狀’該第—部件1Q係―體沖壓成型,且該第—部件I。封閉端 設有-向内***之中空筒體„,該中空筒體n上分別設有第一卡扣件 實施例為姆觸設之_,且該開槽係置於該中空歸細上),且該第一部 件10周邊設有複數個藉由沖壓而形成透空之散熱孔13;另,在該第一部件1〇 ^開放端爛設有-為_體成型且為立體狀之第二部件2G,於本實施例為一盤 〜,該第—部件2G倾第—部件1G互相配合,且該第二部件如愤有一凹入 之凹槽2i,該凹槽21上設有與第一卡扣件12配合之第二卡扣件^,於本實施 •例為沖壓出來之折片,又,該第二部件2G在該凹槽21周邊平面設有複數個經 沖壓之沖孔23,該等沖孔23中分別設有經沖壓出來之折片所形成之散熱片 _組裝時,请參照第4圖所示,先將第-、二部件10、20靠合在一起,使中 空· U與凹槽21貼靠在一起,藉由第一、二卡扣件12、22之互相卡扣,而 使第-、二部件10、20結合在一起,再將電路板4〇及發光二極體分別固定 在中謂體11及凹槽21中,如此—來,不但可節省目定之焊接健,而達到 最佳之絕緣效果,且能達到迅速散熱之目的。 再者,请參照第5、6圖所示,該第一、二部件1〇、2〇中夾置有至少一導 熱疋件30,該導熱元件3〇係以導熱性佳之材料所構成,如:金 '銀、鋼、鐵、 鋁、或金屬複合材料、或石墨、或石墨之複合材料等;該導熱元件3〇可為片狀 •物或網狀,,且該導熱元件3〇係與該第二部件2〇之内緣相接,以增加散熱效 果’又β亥第、一部件10、2〇間配合不同發光功率之發光二極離狗燈具, 重疊夾設有複數個該導熱元件30 ,以增加散熱效果。 綜上所述,本創作在物品、形狀、構造、裝置上屬首先創作,且可改良習 用技術之各種缺點,在使用上能增進功效,合於實用,充份符合新型專利 實為一理想之創作。 【圖式簡單說明】 第1圖··為習用裝置之示意圖。 第2圖··為本創作之立體示意圖。 M343769 第3圖:為本創作之立體分解示意圖。 第3a圖:為第3圖之立體分解示意圖。 第4圖:為本創作實施時之部分斷面示意圖。 第5圖:為本創作之另一實施例。 第6圖:為本創作之另一實施例之斷面示意圖 【主要元件符號說明】 第一部件 1〇 中空筒體 11 第一卡扣件 12 散熱孔 13 第二部件 20 凹槽 21 第二卡扣件 22 沖孔 23 散熱片 24 導熱元件 30 電路板 40 發光二極體 50M343769 VIII. New description: [New technical field] This creation is a kind of heat dissipating device, which is a kind of heat sink which combines the first and second parts of the integrated plastic into a cube by means of mutual engagement with the buckle. It saves the working time of fixed welding and achieves the best insulation effect. [Prior Art] According to the 'the most common light source in daily life, there are old bulbs, quartz bulbs, daylight bulbs and mercury lamps. Unlike the above-mentioned lamps, the light-emitting diode system is cold-emitting and has low power consumption. 0 components long life, no need for warming time, fast response, etc., coupled with its small size, vibration resistance, suitable for mass production, easy to match the needs of the application, so the light-emitting diode (LED) has become a daily An important component that is indispensable in life, but a light-emitting diode is used as a light source for illumination. Due to the problem of electro-optical conversion efficiency, high heat is generated during use, and continuous high heat causes damage to electronic components. Generally, as a light-emitting diode lamp for lighting, most of the heat-dissipating sockets are provided with a plurality of heat-dissipating fins arranged on one side, and the heat-dissipating fins are perpendicular to the heat-dissipating block, and the heat-dissipating fins are vertical. The heat sink is provided with a concave frame, and the concave frame is respectively fixed with at least one lamp socket, the lamp sockets are respectively electrically connected to the circuit board, and the light sockets are respectively mounted on the lamp sockets, In addition, although the heat generated by the circuit board can be removed by the heat sink, the light emitting diode can be operated normally, because the system is assembled on a circuit board and radiated through only one heat sink. Heat stagnation often occurs on the board. 'The heat can not be quickly dissipated, and the lamp is too hot, which is very unsatisfactory in use. In addition, as shown in FIG. 1 , it is a heat dissipating body 10 散热 for heat dissipation of a light-emitting diode. The heat sink 100 is provided with a base 110 , and the base 11 is mounted on the raft to be fastened. The annular ribs 120 are used as the heat sinks, and the ribs 12 are gradually expanded from the bottom end to the top end, and a loop 130 is sleeved around the top end of the ribs 120. The ring 130 is welded to the ribs 120, and a ring body 14 is disposed on the inner ring of the top end of the ribs 120. The disk body 140 is also provided with a disk 140 having an opposite opening direction. The inner body of the disk body 14 is provided with a light-emitting diode and a circuit board respectively (when not shown in the figure, the whole heat-dissipating body 1 is first subjected to anodization, and the heat-dissipating body 100 is formed by M343769. In the insulated state, the upper and lower disc bodies 140 are fixed to the inner ring of the ribs 120 by means of splicing; however, as a result, the entire heat dissipating body 1 常常 is often partially uninsulated. The situation, which poses a danger to the user, and the resulting defect rate of the heat sink is too high. As a result, the production cost is increased, and the use is very unsatisfactory. [New Content] Creation Outline: The author of this creation has the secrets of the secret, and this is aimed at the location of the Lin, and began to work to improve the 'Na's lack, in the hope of seeking - A reasonable solution, after numerous studies and designs, finally completed the heat sink of this creation. The purpose of this creation is to provide a heat sink, which is a light-emitting __ _ _ On the other hand, the first and second parts are divided into three parts, and the first and second parts are respectively matched with each other, and one or two fasteners are used to make the combination. By the mutual snapping of the first and second snap members, the first and the - components are combined in the same manner, so that not only the welding can be saved, but also the insulation effect of the heat sink can be increased, and the heat can be quickly dissipated. The purpose of the present invention is to provide a heat dissipating device in which at least one heat-conducting reading is provided between the first and second parts, and the heat-conducting element is a material-turned material composed of a material that is difficult to guide. Increase the heat dissipation effect. Another-purpose 'providing a kind of heat-dissipating device, the heat-conducting component is connected with the edge of the second component to increase the heat-dissipating effect. The material 2 is used for the purpose of providing a heat-dissipating device between the first and second parts. It can be used with different light-emitting two-station _ luminaires to overlap the heat-conducting components of Newlin to increase heat dissipation. [Embodiment] See paragraphs 2, 3, and 3a for riding, pick #, fibril, and the light-emitting diodes of the system. ED) Miscellaneous device for luminaires, which is provided with - the enemy's first - H with 6 M343769: This is a bowl-shaped 'this first-part 1Q-body-body stamping, and the first part I. The closed end is provided with a hollow cylinder „inwardly bulging, and the hollow cylinder n is respectively provided with a first snap member 为, and the slot is placed on the hollow compaction) And the first component 10 is provided with a plurality of heat dissipation holes 13 formed by punching through the periphery; and the first component 1 is open at the open end of the first component 1 - the body is formed into a three-dimensional shape The two parts 2G, in this embodiment, are a disk ~, the first part 2G tilting - the part 1G cooperates with each other, and the second part has an indented groove 2i, and the groove 21 is provided with The second fastening component of the fastening component 12 is a punched piece in the embodiment, and the second component 2G is provided with a plurality of punched punching holes 23 in the peripheral plane of the groove 21. The heat sinks formed by the punched flaps are respectively provided in the punching holes 23. When assembling, please refer to Fig. 4, firstly press the first and second members 10 and 20 together to make the hollow · U is in close contact with the groove 21, and the first and second members 12 and 20 are coupled to each other by the first and second fastening members 12 and 22, and then the circuit board is assembled. 4〇 and the light-emitting diodes are respectively fixed in the middle body 11 and the groove 21, so that not only can save the intended welding strength, but also achieve the best insulation effect, and can achieve the purpose of rapid heat dissipation. Referring to Figures 5 and 6, the first and second members 1 and 2 are sandwiched by at least one heat transfer element 30, and the heat conductive element 3 is made of a material having good thermal conductivity, such as gold. 'Silver, steel, iron, aluminum, or metal composite material, or a composite material of graphite or graphite; the heat conducting element 3〇 may be a sheet-like object or a mesh, and the heat-conducting element 3 is connected to the first The inner edges of the two parts are connected to each other to increase the heat dissipation effect, and the light-emitting two-pole off-dog lamps with different luminous powers are arranged between the components 10 and 2, and the plurality of thermal conductive elements 30 are overlapped and sandwiched. In order to increase the heat dissipation effect, in summary, the creation is first created in the article, shape, structure and device, and can improve various shortcomings of the conventional technology, can enhance the effect in use, is practical, and fully conforms to the new patent. Really an ideal creation. [Simple diagram Fig. 1 is a schematic diagram of a conventional device. Fig. 2 is a three-dimensional diagram of the creation. M343769 Fig. 3 is a three-dimensional exploded view of the creation. Fig. 3a is a perspective exploded view of Fig. 3. Fig. 4 is a partial cross-sectional view showing the implementation of the present invention. Fig. 5 is another embodiment of the present invention. Fig. 6 is a schematic cross-sectional view showing another embodiment of the present invention. First member 1 hollow cylinder 11 first fastening member 12 heat dissipation hole 13 second member 20 recess 21 second fastening member 22 punching 23 heat sink 24 heat conducting member 30 circuit board 40 light emitting diode 50

Claims (1)

M343769 九、申請專利範圍: 1·一種散熱裝置,其主要係一種應用於發光二極體&Ε〇)燈具上之散熱裝置,其 包括有: -第-部件,其具有導熱效果,該第—部件其係呈—體成型之立體狀,且該 第一部件上設有第一》^扣件; 第一部件’其係與第一部件互相配合,該第二部件亦呈一體成型之立體狀, 且該第二部件上設有與第一__^扣件配合之第二卡扣件; 、、且曰牯可藉由第一、二卡扣件之互相卡扣,使第一、二部件結合在一起, 如此來,可節省固定焊接之作業時間及達到最佳之絕緣效果。 2·如申請專概圍第丨項所述之散織置,其第—部件為碗狀。 3·如申請專利麵第丨撕述之散熱裝置,其第二部件為麵。 4·如申請專利範圍第i項所述之散熱裝置,其第—卡扣件為開槽。 • 5.如申請專利範圍第]項所述之散熱裝置,其第二卡扣件為經沖壓之折片。 6·如申料纖圍第1項所狀散齡置,其第—部件上設有透空之散熱孔。 7.如申明專利乾圍第1項所述之散熱裝置,其第二部件上設有經沖壓出來之折片 所形成之散熱片。 如申明專利範圍第1項所述之散熱裝置,其第一、二部件間夾設有一導熱元 鲁件’、該導熱元件係為片狀物或網狀物,且該導熱辑係以導熱性佳之材料所 構成。 9·如申請專利範圍第8項所述之散熱裝置,其導熱元件係以金銀銅、铭或 金屬複合材料、或石墨或石墨複合材料等所構成。 10·如申請專利範圍第8項所述之散熱裝置’其導熱元件係與該第二部件之内緣 相接,以增加散熱效果。 U·如申請專利範圍第8項所述之散熱裝置,其第一、二部件間係配合不同發光 功率之發光二極體(LED)燈具,夾設有複數個導熱元件,以增加散熱效果。 9M343769 IX. Patent application scope: 1. A heat dissipating device, which is mainly a heat dissipating device applied to a light-emitting diode & luminaire, comprising: - a first component having a heat conducting effect, the first The component is formed in a three-dimensional shape, and the first component is provided with a first fastener; the first component is coupled to the first component, and the second component is also integrally formed. And the second component is provided with the second fastening component matched with the first __^ fastener; and the first and the second fastening component are mutually buckled, so that the first component is The two components are combined to save the working time of the fixed welding and achieve the best insulation effect. 2. If the application is as described in the general item, the first part is bowl-shaped. 3. The second component of the heat sink as described in the patent application section is a face. 4. The heat-dissipating device of claim i, wherein the first fastening member is slotted. 5. The heat sink of claim 4, wherein the second fastening component is a stamped flap. 6. If the first item of the application material is placed in the first place, the first part is provided with a venting hole. 7. The heat sink of claim 1, wherein the second component is provided with a heat sink formed by the stamped flap. The heat dissipating device according to claim 1, wherein the first and second members are provided with a heat conducting element, wherein the heat conducting element is a sheet or a mesh, and the heat conducting layer is thermally conductive. The composition of the material. 9. The heat dissipating device according to item 8 of the patent application, wherein the heat conducting element is composed of gold, silver, copper, metal or metal composite material, or graphite or graphite composite material. 10. The heat dissipating device of claim 8 wherein the heat dissipating member is in contact with the inner edge of the second member to increase the heat dissipating effect. U. The heat-dissipating device according to item 8 of the patent application, wherein the first and second components are combined with light-emitting diode (LED) lamps of different luminous powers, and a plurality of heat-conducting elements are interposed to increase the heat dissipation effect. 9
TW97209627U 2008-06-02 2008-06-02 Heat dissipation apparatus TWM343769U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425167B (en) * 2009-07-06 2014-02-01 Sumitomo Light Metal Ind LED ball with heat dissipation components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425167B (en) * 2009-07-06 2014-02-01 Sumitomo Light Metal Ind LED ball with heat dissipation components

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