TW200739165A - Lens module of camera and its fabricating method - Google Patents
Lens module of camera and its fabricating methodInfo
- Publication number
- TW200739165A TW200739165A TW095112761A TW95112761A TW200739165A TW 200739165 A TW200739165 A TW 200739165A TW 095112761 A TW095112761 A TW 095112761A TW 95112761 A TW95112761 A TW 95112761A TW 200739165 A TW200739165 A TW 200739165A
- Authority
- TW
- Taiwan
- Prior art keywords
- camera
- lens
- fabricating method
- lens module
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 3
- 239000005357 flat glass Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Lens Barrels (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095112761A TW200739165A (en) | 2006-04-11 | 2006-04-11 | Lens module of camera and its fabricating method |
JP2007042616A JP2007282195A (ja) | 2006-04-11 | 2007-02-22 | カメラレンズモジュールおよびその製造方法 |
KR1020070030659A KR20070101125A (ko) | 2006-04-11 | 2007-03-29 | 카메라 렌즈 모듈 및 그 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095112761A TW200739165A (en) | 2006-04-11 | 2006-04-11 | Lens module of camera and its fabricating method |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200739165A true TW200739165A (en) | 2007-10-16 |
Family
ID=38683140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095112761A TW200739165A (en) | 2006-04-11 | 2006-04-11 | Lens module of camera and its fabricating method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2007282195A (ja) |
KR (1) | KR20070101125A (ja) |
TW (1) | TW200739165A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102313959A (zh) * | 2007-11-21 | 2012-01-11 | Lg伊诺特有限公司 | 摄像模块 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI416193B (zh) * | 2007-12-31 | 2013-11-21 | Hon Hai Prec Ind Co Ltd | 測試鏡頭模組組裝元件之方法 |
TWI512961B (zh) * | 2013-08-16 | 2015-12-11 | Azurewave Technologies Inc | 用於降低整體厚度的影像感測模組及其製作方法 |
CN106817522A (zh) * | 2015-12-01 | 2017-06-09 | 安徽昌硕光电子科技有限公司 | 摄像模块的结构 |
KR102033313B1 (ko) * | 2016-03-02 | 2019-10-18 | 주식회사 탑 엔지니어링 | 카메라 모듈 제조 설비 |
WO2021128178A1 (zh) * | 2019-12-26 | 2021-07-01 | 诚瑞光学(常州)股份有限公司 | 一种镜头模组及终端设备 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3127584B2 (ja) * | 1992-06-23 | 2001-01-29 | ソニー株式会社 | 樹脂製中空パッケージを用いた半導体装置 |
JP2001250889A (ja) * | 2000-03-06 | 2001-09-14 | Matsushita Electric Ind Co Ltd | 光素子の実装構造体およびその製造方法 |
JP3600147B2 (ja) * | 2000-10-12 | 2004-12-08 | 三洋電機株式会社 | 固体撮像素子の実装方法 |
JP2003059952A (ja) * | 2001-08-16 | 2003-02-28 | Sony Corp | 半導体装置、半導体素子チップ及びその製造方法 |
JP2004080704A (ja) * | 2002-08-22 | 2004-03-11 | Toshiba Corp | 撮像装置及びその製造方法 |
JP2004173028A (ja) * | 2002-11-21 | 2004-06-17 | Olympus Corp | 固体撮像装置 |
JP4174664B2 (ja) * | 2003-01-14 | 2008-11-05 | セイコーエプソン株式会社 | 光モジュール及びその製造方法並びに電子機器 |
JP2004274165A (ja) * | 2003-03-05 | 2004-09-30 | Seiko Epson Corp | 光モジュール及びその製造方法並びに電子機器 |
JP2005316127A (ja) * | 2004-04-28 | 2005-11-10 | Matsushita Electric Ind Co Ltd | カメラモジュール |
JP2005353810A (ja) * | 2004-06-10 | 2005-12-22 | Seiko Precision Inc | 受光装置、測距装置及びカメラモジュール並びにこれらの製造方法 |
JP2006074464A (ja) * | 2004-09-02 | 2006-03-16 | Seiko Epson Corp | 光モジュール及びその製造方法 |
-
2006
- 2006-04-11 TW TW095112761A patent/TW200739165A/zh unknown
-
2007
- 2007-02-22 JP JP2007042616A patent/JP2007282195A/ja active Pending
- 2007-03-29 KR KR1020070030659A patent/KR20070101125A/ko not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102313959A (zh) * | 2007-11-21 | 2012-01-11 | Lg伊诺特有限公司 | 摄像模块 |
Also Published As
Publication number | Publication date |
---|---|
KR20070101125A (ko) | 2007-10-16 |
JP2007282195A (ja) | 2007-10-25 |
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