TW200628514A - Unsaturated group-containing polyimide resin, photosensitive resin composition containing the same and cured resin thereof - Google Patents

Unsaturated group-containing polyimide resin, photosensitive resin composition containing the same and cured resin thereof

Info

Publication number
TW200628514A
TW200628514A TW094144650A TW94144650A TW200628514A TW 200628514 A TW200628514 A TW 200628514A TW 094144650 A TW094144650 A TW 094144650A TW 94144650 A TW94144650 A TW 94144650A TW 200628514 A TW200628514 A TW 200628514A
Authority
TW
Taiwan
Prior art keywords
unsaturated group
resin
polyimide resin
photosensitive resin
group
Prior art date
Application number
TW094144650A
Other languages
English (en)
Inventor
Ryuji Uehara
Ryutaro Tanaka
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of TW200628514A publication Critical patent/TW200628514A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/145—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW094144650A 2004-12-16 2005-12-16 Unsaturated group-containing polyimide resin, photosensitive resin composition containing the same and cured resin thereof TW200628514A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004363858 2004-12-16

Publications (1)

Publication Number Publication Date
TW200628514A true TW200628514A (en) 2006-08-16

Family

ID=36587921

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094144650A TW200628514A (en) 2004-12-16 2005-12-16 Unsaturated group-containing polyimide resin, photosensitive resin composition containing the same and cured resin thereof

Country Status (7)

Country Link
US (1) US20080146692A1 (zh)
EP (1) EP1826230A1 (zh)
JP (1) JP5038721B2 (zh)
KR (1) KR20070093056A (zh)
CN (1) CN101068852A (zh)
TW (1) TW200628514A (zh)
WO (1) WO2006064867A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822976B (zh) * 2019-03-15 2023-11-21 日商日本化藥股份有限公司 聚醯胺酸樹脂、聚醯亞胺樹脂及含有該等的樹脂組成物

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI383251B (zh) * 2008-01-16 2013-01-21 Eternal Chemical Co Ltd 感光型聚醯亞胺
CN103524735A (zh) * 2008-01-25 2014-01-22 长兴化学工业股份有限公司 感光型聚酰亚胺
JP2010070604A (ja) * 2008-09-17 2010-04-02 Hitachi Chem Co Ltd 反応性二重結合を有する溶剤可溶性イミド化合物、この化合物を含む樹脂組成物及びこれらを用いた電子材料
CN102532544B (zh) * 2008-12-11 2013-10-09 长兴化学工业股份有限公司 感光型聚酰亚胺
TWI534529B (zh) * 2010-03-01 2016-05-21 長興材料工業股份有限公司 感光性樹脂組合物及其應用
ES2436892T3 (es) * 2010-04-16 2014-01-07 Nexam Chemical Ab Reticulante novedoso
JP6051653B2 (ja) * 2012-07-24 2016-12-27 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミド樹脂硬化物およびポリイミドフィルム
CN106164132B (zh) * 2014-01-31 2019-08-23 富士胶片电子材料美国有限公司 聚酰亚胺组合物
CN105273614B (zh) * 2015-10-12 2017-08-22 广东省宜华木业股份有限公司 室温反应制备用于木质材料表面uv超疏水聚酰亚胺涂料
KR102262502B1 (ko) * 2018-02-28 2021-06-07 주식회사 엘지화학 감광성 수지 조성물 및 경화막
CN111393379B (zh) * 2020-04-22 2021-09-28 深圳先进电子材料国际创新研究院 二胺化合物及感光性树脂
CN112390950B (zh) * 2020-11-18 2023-06-16 安徽国风新材料股份有限公司 一种聚酰亚胺、聚酰亚胺薄膜和聚酰亚胺薄膜的制备方法
JPWO2022118620A1 (zh) * 2020-12-02 2022-06-09
US20240085789A1 (en) * 2020-12-02 2024-03-14 Mitsubishi Gas Chemical Company, Inc. Photosensitive polyimide resin composition, resin film, and electronic device
US20240027907A1 (en) * 2020-12-02 2024-01-25 Mitsubishi Gas Chemical Company, Inc. Method for producing patterned substrate
CN114524938B (zh) * 2021-10-28 2024-02-09 江苏三月科技股份有限公司 一种聚合物、感光树脂组合物及其制备的固化膜与电子元件
CN114989428A (zh) * 2022-05-11 2022-09-02 深圳市志邦科技有限公司 一种水性树脂的制备方法及树脂
WO2024090567A1 (ja) * 2022-10-27 2024-05-02 旭化成株式会社 ネガ型感光性樹脂組成物、並びにこれを用いたポリイミド硬化膜の製造方法及びポリイミド硬化膜
CN117701233A (zh) * 2023-12-22 2024-03-15 明士(北京)新材料开发有限公司 一种适用于涂布的光敏聚酰亚胺胶液及其涂布方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5114826A (en) * 1989-12-28 1992-05-19 Ibm Corporation Photosensitive polyimide compositions
US5851736A (en) * 1991-03-05 1998-12-22 Nitto Denko Corporation Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern
JP3318035B2 (ja) * 1993-04-07 2002-08-26 三井化学株式会社 フレキシブル両面金属積層板の製造法
US5616448A (en) * 1995-01-27 1997-04-01 Shin-Etsu Chemical Co., Ltd. Photosensitive resin composition and a process for forming a patterned polyimide film using the same
JPH11181089A (ja) * 1997-12-24 1999-07-06 Toray Ind Inc 感光性耐熱性樹脂前駆体組成物
JP2001220442A (ja) * 2000-02-10 2001-08-14 Kansai Research Institute フッ素含有共重合体及びそれを用いた低誘電率材料
JP4084597B2 (ja) * 2002-05-07 2008-04-30 群栄化学工業株式会社 アミノ基含有フェノール誘導体
JP4337481B2 (ja) * 2002-09-17 2009-09-30 東レ株式会社 ネガ型感光性樹脂前駆体組成物およびそれを用いた電子部品ならびに表示装置
JP2004315815A (ja) * 2003-04-03 2004-11-11 Nippon Kayaku Co Ltd ポリアミド酸及び可溶性ポリイミド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822976B (zh) * 2019-03-15 2023-11-21 日商日本化藥股份有限公司 聚醯胺酸樹脂、聚醯亞胺樹脂及含有該等的樹脂組成物

Also Published As

Publication number Publication date
CN101068852A (zh) 2007-11-07
US20080146692A1 (en) 2008-06-19
JPWO2006064867A1 (ja) 2008-06-12
EP1826230A1 (en) 2007-08-29
JP5038721B2 (ja) 2012-10-03
WO2006064867A1 (ja) 2006-06-22
KR20070093056A (ko) 2007-09-17

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