SG86364A1 - Planarization apparatus and method - Google Patents

Planarization apparatus and method

Info

Publication number
SG86364A1
SG86364A1 SG200000074A SG200000074A SG86364A1 SG 86364 A1 SG86364 A1 SG 86364A1 SG 200000074 A SG200000074 A SG 200000074A SG 200000074 A SG200000074 A SG 200000074A SG 86364 A1 SG86364 A1 SG 86364A1
Authority
SG
Singapore
Prior art keywords
planarization apparatus
planarization
Prior art date
Application number
SG200000074A
Other languages
English (en)
Inventor
Ishikawa Toshihiko
Katagiri Yasushi
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of SG86364A1 publication Critical patent/SG86364A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG200000074A 1999-01-06 2000-01-05 Planarization apparatus and method SG86364A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP131799 1999-01-06
JP32143299A JP2000254857A (ja) 1999-01-06 1999-11-11 平面加工装置及び平面加工方法

Publications (1)

Publication Number Publication Date
SG86364A1 true SG86364A1 (en) 2002-02-19

Family

ID=26334526

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200000074A SG86364A1 (en) 1999-01-06 2000-01-05 Planarization apparatus and method

Country Status (8)

Country Link
US (2) US6431964B1 (de)
EP (2) EP1541284B1 (de)
JP (1) JP2000254857A (de)
KR (1) KR100650703B1 (de)
DE (2) DE60033866T2 (de)
MY (1) MY123347A (de)
SG (1) SG86364A1 (de)
TW (1) TW426582B (de)

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JP2002028073A (ja) * 2000-07-13 2002-01-29 Disco Abrasive Syst Ltd 伸縮自在カーテン
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JP4455750B2 (ja) * 2000-12-27 2010-04-21 株式会社ディスコ 研削装置
JP4594545B2 (ja) * 2001-03-28 2010-12-08 株式会社ディスコ 研磨装置及びこれを含んだ研削・研磨機
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JP4580118B2 (ja) * 2001-03-28 2010-11-10 株式会社ディスコ 研磨方法及び研削・研磨方法
JP2002343756A (ja) * 2001-05-21 2002-11-29 Tokyo Seimitsu Co Ltd ウェーハ平面加工装置
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JP4790322B2 (ja) * 2005-06-10 2011-10-12 株式会社ディスコ 加工装置および加工方法
JP2007123687A (ja) * 2005-10-31 2007-05-17 Tokyo Seimitsu Co Ltd 半導体ウェーハ裏面の研削方法及び半導体ウェーハ研削装置
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JP6523872B2 (ja) * 2015-08-27 2019-06-05 株式会社ディスコ 研削装置
JP2017054872A (ja) * 2015-09-08 2017-03-16 株式会社東京精密 ウェーハ研削方法及びウェーハ研削装置
CN106041706B (zh) * 2016-07-20 2018-02-23 华侨大学 蓝宝石晶片腐蚀抛光复合加工机床
JP6283081B1 (ja) * 2016-09-28 2018-02-21 株式会社東京精密 加工装置のセッティング方法
JP6803187B2 (ja) * 2016-10-05 2020-12-23 株式会社ディスコ 研削砥石のドレッシング方法
JP6635003B2 (ja) * 2016-11-02 2020-01-22 株式会社Sumco 半導体ウェーハの両面研磨方法
CN106625158A (zh) * 2017-01-24 2017-05-10 王文胜 一种石材磨光机
JP6379232B2 (ja) * 2017-01-30 2018-08-22 株式会社東京精密 研削装置
JP6909598B2 (ja) * 2017-03-13 2021-07-28 光洋機械工業株式会社 平面研削方法及び平面研削装置
CN107263267A (zh) * 2017-07-05 2017-10-20 北京中电科电子装备有限公司 一种晶圆减薄抛光装置
TWI633281B (zh) 2017-11-17 2018-08-21 財團法人工業技術研究院 量測夾持裝置及量測方法
JP2018142717A (ja) * 2018-04-20 2018-09-13 株式会社東京精密 ウェハ加工方法及びウェハ加工システム
JP2018133593A (ja) * 2018-05-22 2018-08-23 株式会社東京精密 ウェハ加工方法及びウェハ加工システム
JP6911950B2 (ja) * 2020-01-10 2021-07-28 株式会社Sumco 半導体ウェーハの洗浄装置および半導体ウェーハの洗浄方法
CN111633520B (zh) * 2020-06-10 2021-06-18 清华大学 一种高度集成化的减薄设备
CN115592550B (zh) * 2022-12-14 2023-04-28 杭州中欣晶圆半导体股份有限公司 一种晶片抛光用抽排装置及其抽排方法

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Also Published As

Publication number Publication date
EP1018400B1 (de) 2005-06-08
EP1541284A1 (de) 2005-06-15
EP1541284B1 (de) 2007-03-07
DE60020614T2 (de) 2005-12-01
DE60020614D1 (de) 2005-07-14
MY123347A (en) 2006-05-31
US6910943B2 (en) 2005-06-28
US6431964B1 (en) 2002-08-13
US20020160691A1 (en) 2002-10-31
DE60033866D1 (de) 2007-04-19
JP2000254857A (ja) 2000-09-19
EP1018400A3 (de) 2003-02-05
EP1018400A2 (de) 2000-07-12
DE60033866T2 (de) 2007-07-05
KR20000052631A (ko) 2000-08-25
KR100650703B1 (ko) 2006-11-28
TW426582B (en) 2001-03-21

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