GB0108751D0 - Polishing apparatus and method - Google Patents

Polishing apparatus and method

Info

Publication number
GB0108751D0
GB0108751D0 GBGB0108751.9A GB0108751A GB0108751D0 GB 0108751 D0 GB0108751 D0 GB 0108751D0 GB 0108751 A GB0108751 A GB 0108751A GB 0108751 D0 GB0108751 D0 GB 0108751D0
Authority
GB
United Kingdom
Prior art keywords
polishing apparatus
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0108751.9A
Other versions
GB2363350A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB0108751D0 publication Critical patent/GB0108751D0/en
Publication of GB2363350A publication Critical patent/GB2363350A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
GB0108751A 2000-04-06 2001-04-06 Slurry feed for wafer polishing Withdrawn GB2363350A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000104579A JP2001287154A (en) 2000-04-06 2000-04-06 Polisher and polishing method

Publications (2)

Publication Number Publication Date
GB0108751D0 true GB0108751D0 (en) 2001-05-30
GB2363350A GB2363350A (en) 2001-12-19

Family

ID=18618096

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0108751A Withdrawn GB2363350A (en) 2000-04-06 2001-04-06 Slurry feed for wafer polishing

Country Status (5)

Country Link
US (1) US20020022440A1 (en)
JP (1) JP2001287154A (en)
KR (1) KR20010098453A (en)
CN (1) CN1316768A (en)
GB (1) GB2363350A (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6722943B2 (en) * 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US6953391B1 (en) * 2002-03-30 2005-10-11 Lam Research Corporation Methods for reducing slurry usage in a linear chemical mechanical planarization system
US20040214508A1 (en) * 2002-06-28 2004-10-28 Lam Research Corporation Apparatus and method for controlling film thickness in a chemical mechanical planarization system
CN1305115C (en) * 2002-09-29 2007-03-14 台湾积体电路制造股份有限公司 Magma flow control method and system utilizing compound control mode
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US20040162007A1 (en) * 2003-02-19 2004-08-19 Ky Phan Chemical mechanical polishing atomizing rinse system
US6872128B1 (en) * 2003-09-30 2005-03-29 Lam Research Corporation System, method and apparatus for applying liquid to a CMP polishing pad
US6929533B2 (en) * 2003-10-08 2005-08-16 Taiwan Semiconductor Manufacturing Co., Ltd Methods for enhancing within-wafer CMP uniformity
JP2005262406A (en) * 2004-03-19 2005-09-29 Toshiba Corp Polishing apparatus, and method for manufacturing semiconductor device
US7770535B2 (en) * 2005-06-10 2010-08-10 Semiconductor Energy Laboratory Co., Ltd. Chemical solution application apparatus and chemical solution application method
JP5422245B2 (en) * 2009-04-01 2014-02-19 株式会社荏原製作所 Polishing apparatus and polishing method
JP2014050955A (en) * 2009-04-01 2014-03-20 Ebara Corp Polishing device and polishing method
KR102333209B1 (en) * 2015-04-28 2021-12-01 삼성디스플레이 주식회사 Substrate polishing apparatus
KR102493016B1 (en) * 2015-12-31 2023-01-31 주식회사 케이씨텍 Chemical mechanical polishing apparatus and control method thereof
CN112930248B (en) * 2019-04-01 2023-05-02 株式会社村田制作所 Polishing agent supply device, polishing device, and polishing agent supply method
KR20210081898A (en) * 2019-12-24 2021-07-02 에스케이하이닉스 주식회사 Apparatus of chemical mechanical polishing And Method of driving the same
CN115890456A (en) * 2022-12-29 2023-04-04 西安奕斯伟材料科技有限公司 Polishing liquid supply device, polishing equipment and polishing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3334139B2 (en) * 1991-07-01 2002-10-15 ソニー株式会社 Polishing equipment
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
JP3734289B2 (en) * 1995-01-24 2006-01-11 株式会社荏原製作所 Polishing device
US6139406A (en) * 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
US5816900A (en) * 1997-07-17 1998-10-06 Lsi Logic Corporation Apparatus for polishing a substrate at radially varying polish rates
US6338669B1 (en) * 1997-12-26 2002-01-15 Ebara Corporation Polishing device
US6429131B2 (en) * 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity

Also Published As

Publication number Publication date
GB2363350A (en) 2001-12-19
US20020022440A1 (en) 2002-02-21
CN1316768A (en) 2001-10-10
JP2001287154A (en) 2001-10-16
KR20010098453A (en) 2001-11-08

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)