SG77704A1 - Semiconductor device and method of fabricating the same - Google Patents
Semiconductor device and method of fabricating the sameInfo
- Publication number
- SG77704A1 SG77704A1 SG1999003757A SG1999003757A SG77704A1 SG 77704 A1 SG77704 A1 SG 77704A1 SG 1999003757 A SG1999003757 A SG 1999003757A SG 1999003757 A SG1999003757 A SG 1999003757A SG 77704 A1 SG77704 A1 SG 77704A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor chip
- semiconductor device
- major surface
- fabricating
- same
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 8
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000002390 adhesive tape Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10245406A JP2000077435A (ja) | 1998-08-31 | 1998-08-31 | 半導体装置及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
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SG77704A1 true SG77704A1 (en) | 2001-01-16 |
Family
ID=17133188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1999003757A SG77704A1 (en) | 1998-08-31 | 1999-08-04 | Semiconductor device and method of fabricating the same |
Country Status (7)
Country | Link |
---|---|
US (3) | US6340837B1 (ja) |
JP (1) | JP2000077435A (ja) |
KR (1) | KR100674548B1 (ja) |
CN (1) | CN1204622C (ja) |
MY (1) | MY123034A (ja) |
SG (1) | SG77704A1 (ja) |
TW (1) | TW508702B (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000077435A (ja) * | 1998-08-31 | 2000-03-14 | Hitachi Ltd | 半導体装置及びその製造方法 |
KR100350046B1 (ko) * | 1999-04-14 | 2002-08-24 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 방열판이 부착된 반도체패키지 |
KR100381892B1 (ko) * | 1999-11-24 | 2003-04-26 | 삼성전자주식회사 | 듀얼-리드 타입 정방형 반도체 패키지 및 그를 사용한양면 실장형 메모리 모듈 |
JP2001291720A (ja) * | 2000-04-05 | 2001-10-19 | Hitachi Ltd | 半導体集積回路装置および半導体集積回路装置の製造方法 |
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-
1998
- 1998-08-31 JP JP10245406A patent/JP2000077435A/ja active Pending
-
1999
- 1999-08-04 SG SG1999003757A patent/SG77704A1/en unknown
- 1999-08-05 TW TW088113382A patent/TW508702B/zh not_active IP Right Cessation
- 1999-08-10 MY MYPI99003416A patent/MY123034A/en unknown
- 1999-08-30 KR KR1019990036219A patent/KR100674548B1/ko not_active IP Right Cessation
- 1999-08-31 US US09/387,052 patent/US6340837B1/en not_active Expired - Lifetime
- 1999-08-31 CN CNB99118338XA patent/CN1204622C/zh not_active Expired - Fee Related
-
2002
- 2002-01-22 US US10/051,009 patent/US6476479B2/en not_active Expired - Fee Related
- 2002-01-22 US US10/051,077 patent/US6441400B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20020056905A1 (en) | 2002-05-16 |
KR20000017634A (ko) | 2000-03-25 |
JP2000077435A (ja) | 2000-03-14 |
KR100674548B1 (ko) | 2007-01-26 |
US20020056904A1 (en) | 2002-05-16 |
CN1204622C (zh) | 2005-06-01 |
US6340837B1 (en) | 2002-01-22 |
TW508702B (en) | 2002-11-01 |
CN1246729A (zh) | 2000-03-08 |
US6441400B1 (en) | 2002-08-27 |
US6476479B2 (en) | 2002-11-05 |
MY123034A (en) | 2006-05-31 |
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