SG177321A1 - Water-soluble working fluid for fixed abrasive grain wire saw - Google Patents

Water-soluble working fluid for fixed abrasive grain wire saw Download PDF

Info

Publication number: SG177321A1
Authority: SG; Singapore
Prior art keywords: water; working fluid; mass; abrasive grain; wire saw
Prior art date: 2009-07-15

Application number

SG2011095171A

Other languages

English (en)

Inventor

Naoki Maruo

Yasunori Numata

Hiroaki Takahashi

Original Assignee

Yushiro Chem Ind

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-07-15

Filing date

2010-02-12

Publication date

2012-02-28

2010-02-12 Application filed by Yushiro Chem Ind filed Critical Yushiro Chem Ind

2012-02-28 Publication of SG177321A1 publication Critical patent/SG177321A1/en

Links

239000012530 fluid Substances 0.000 title claims abstract description 113
239000006061 abrasive grain Substances 0.000 title claims abstract description 40
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 32
150000002334 glycols Chemical class 0.000 claims abstract description 29
238000005520 cutting process Methods 0.000 claims description 43
150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 40
150000001875 compounds Chemical class 0.000 claims description 14
238000004090 dissolution Methods 0.000 claims description 12
125000004432 carbon atom Chemical group C* 0.000 claims description 7
239000002210 silicon-based material Substances 0.000 claims description 3
229910052710 silicon Inorganic materials 0.000 abstract description 51
239000010703 silicon Substances 0.000 abstract description 51
238000012545 processing Methods 0.000 abstract description 16
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 50
150000007514 bases Chemical class 0.000 description 16
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 15
KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 15
239000000463 material Substances 0.000 description 10
239000000203 mixture Substances 0.000 description 8
KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 8
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
239000000126 substance Substances 0.000 description 6
235000012431 wafers Nutrition 0.000 description 6
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
239000000654 additive Substances 0.000 description 5
238000000034 method Methods 0.000 description 5
150000003839 salts Chemical class 0.000 description 5
239000004034 viscosity adjusting agent Substances 0.000 description 5
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
229910052783 alkali metal Inorganic materials 0.000 description 4
238000011156 evaluation Methods 0.000 description 4
-1 polyethylene Polymers 0.000 description 4
239000001384 succinic acid Substances 0.000 description 4
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
239000002202 Polyethylene glycol Substances 0.000 description 3
239000002253 acid Substances 0.000 description 3
230000000052 comparative effect Effects 0.000 description 3
239000003002 pH adjusting agent Substances 0.000 description 3
229920001223 polyethylene glycol Polymers 0.000 description 3
ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 3
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
150000003973 alkyl amines Chemical class 0.000 description 2
229910021529 ammonia Inorganic materials 0.000 description 2
239000003963 antioxidant agent Substances 0.000 description 2
230000003078 antioxidant effect Effects 0.000 description 2
229920001577 copolymer Polymers 0.000 description 2
238000010790 dilution Methods 0.000 description 2
239000012895 dilution Substances 0.000 description 2
SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
230000000694 effects Effects 0.000 description 2
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
229940113115 polyethylene glycol 200 Drugs 0.000 description 2
229940068886 polyethylene glycol 300 Drugs 0.000 description 2
229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 2
229920001451 polypropylene glycol Polymers 0.000 description 2
BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
239000011347 resin Substances 0.000 description 2
229920005989 resin Polymers 0.000 description 2
239000002002 slurry Substances 0.000 description 2
BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
101100491335 Caenorhabditis elegans mat-2 gene Proteins 0.000 description 1
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
239000004698 Polyethylene Substances 0.000 description 1
229920000604 Polyethylene Glycol 200 Polymers 0.000 description 1
229920002556 Polyethylene Glycol 300 Polymers 0.000 description 1
239000001361 adipic acid Substances 0.000 description 1
235000011037 adipic acid Nutrition 0.000 description 1
239000003513 alkali Substances 0.000 description 1
BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
239000002518 antifoaming agent Substances 0.000 description 1
239000002585 base Substances 0.000 description 1
150000001735 carboxylic acids Chemical class 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
238000001816 cooling Methods 0.000 description 1
238000005260 corrosion Methods 0.000 description 1
230000007797 corrosion Effects 0.000 description 1
230000000593 degrading effect Effects 0.000 description 1
229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
238000002845 discoloration Methods 0.000 description 1
239000006185 dispersion Substances 0.000 description 1
238000004070 electrodeposition Methods 0.000 description 1
XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
150000007529 inorganic bases Chemical class 0.000 description 1
239000004310 lactic acid Substances 0.000 description 1
235000014655 lactic acid Nutrition 0.000 description 1
238000005461 lubrication Methods 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
239000001630 malic acid Substances 0.000 description 1
235000011090 malic acid Nutrition 0.000 description 1
150000007522 mineralic acids Chemical class 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
150000007524 organic acids Chemical class 0.000 description 1
150000007530 organic bases Chemical class 0.000 description 1
235000006408 oxalic acid Nutrition 0.000 description 1
JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
229920000573 polyethylene Polymers 0.000 description 1
229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
235000015497 potassium bicarbonate Nutrition 0.000 description 1
239000011736 potassium bicarbonate Substances 0.000 description 1
229910000027 potassium carbonate Inorganic materials 0.000 description 1
235000011181 potassium carbonates Nutrition 0.000 description 1
TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
229940086066 potassium hydrogencarbonate Drugs 0.000 description 1
230000002265 prevention Effects 0.000 description 1
229910052761 rare earth metal Inorganic materials 0.000 description 1
150000002910 rare earth metals Chemical class 0.000 description 1
230000001105 regulatory effect Effects 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
235000017557 sodium bicarbonate Nutrition 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
230000006641 stabilisation Effects 0.000 description 1
238000011105 stabilization Methods 0.000 description 1
JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
239000002699 waste material Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
- C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/02—Hydroxy compounds
- C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
- C10M2207/0225—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups used as base material
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
- C10M2209/1045—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only used as base material
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/02—Pour-point; Viscosity index
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2040/00—Specified use or application for which the lubricating composition is intended
- C10N2040/20—Metal working
- C10N2040/22—Metal working with essential removal of material, e.g. cutting, grinding or drilling

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Oil, Petroleum & Natural Gas (AREA)
Organic Chemistry (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Lubricants (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)

SG2011095171A 2009-07-15 2010-02-12 Water-soluble working fluid for fixed abrasive grain wire saw SG177321A1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2009166962A JP5679642B2 (ja)	2009-07-15	2009-07-15	固定砥粒ワイヤソー用水溶性加工液
PCT/JP2010/052095 WO2011007590A1 (ja)	2009-07-15	2010-02-12	固定砥粒ワイヤソー用水溶性加工液

Publications (1)

Publication Number	Publication Date
SG177321A1 true SG177321A1 (en)	2012-02-28

Family

ID=43449200

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG2011095171A SG177321A1 (en)	2009-07-15	2010-02-12	Water-soluble working fluid for fixed abrasive grain wire saw

Country Status (5)

Country	Link
JP (1)	JP5679642B2 (ja)
KR (1)	KR20120049216A (ja)
CN (1)	CN102471723B (ja)
SG (1)	SG177321A1 (ja)
WO (1)	WO2011007590A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US9522481B2 (en)	2009-08-31	2016-12-20	Sanyo Chemical Industries, Ltd.	Water-soluble cutting fluid for slicing silicon ingots
JP5624904B2 (ja) *	2011-01-31	2014-11-12	三洋化成工業株式会社	シリコンインゴット用水溶性切削液
JP2012172117A (ja) *	2011-02-23	2012-09-10	Yushiro Chemical Industry Co Ltd	固定砥粒ワイヤソー用水溶性加工液
JP5755479B2 (ja) *	2011-03-31	2015-07-29	三洋化成工業株式会社	含水切削液組成物およびその製造方法
CN103013638B (zh) *	2011-09-20	2014-09-17	浙江瑞翌新材料科技有限公司	一种用于固定磨料线切割的水溶性冷却液及其制备方法
JP6039935B2 (ja) *	2012-06-29	2016-12-07	出光興産株式会社	水性加工液
JP6204029B2 (ja)	2013-03-06	2017-09-27	出光興産株式会社	水性加工液
TWI640619B (zh) *	2015-02-10	2018-11-11	達興材料股份有限公司	一種切割製程用的水性切割液的添加劑及其製備方法
JP6232480B2 (ja) *	2016-08-31	2017-11-15	出光興産株式会社	水性加工液
JP6819619B2 (ja) *	2018-01-22	2021-01-27	信越半導体株式会社	ワーク切断方法及びワイヤソー

Family Cites Families (13)

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Publication number	Priority date	Publication date	Assignee	Title
JPH04216897A (ja) *	1990-12-19	1992-08-06	Nippon Steel Corp	ワイヤソーによる切断法および加工液
JPH04218594A (ja) *	1990-12-19	1992-08-10	Nippon Steel Corp	ワイヤソーによる切断法および加工液
JP2000160185A (ja) *	1998-12-02	2000-06-13	Kyodo Yushi Co Ltd	切断加工用水溶性油剤
JP2002096251A (ja) *	1999-09-17	2002-04-02	Sumitomo Special Metals Co Ltd	希土類合金の切断方法および切断装置
JP4497767B2 (ja) *	2001-09-06	2010-07-07	ユシロ化学工業株式会社	固定砥粒ワイヤソー用水溶性加工液組成物
JP4601221B2 (ja) *	2001-09-06	2010-12-22	ユシロ化学工業株式会社	固定砥粒ワイヤソー用不水溶性加工油剤組成物
JP4601220B2 (ja) *	2001-09-06	2010-12-22	ユシロ化学工業株式会社	固定砥粒ワイヤソー用不水溶性加工油剤組成物
JP4497768B2 (ja) *	2001-09-06	2010-07-07	ユシロ化学工業株式会社	固定砥粒ワイヤソー用水溶性加工液組成物
JP4656804B2 (ja) *	2001-10-17	2011-03-23	日立金属株式会社	ワイヤソーを用いる切断方法および希土類磁石の製造方法
JP2006096951A (ja) *	2004-09-30	2006-04-13	Kyodo Yushi Co Ltd	水溶性切断加工用油剤、スラリー、及び切断加工方法
JP4481898B2 (ja) *	2005-07-25	2010-06-16	ユシロ化学工業株式会社	水性砥粒分散媒組成物
JP5639996B2 (ja) *	2009-03-31	2014-12-10	出光興産株式会社	脆性材料用加工液及び硬質材料用加工液
JP2010275537A (ja) *	2009-04-28	2010-12-09	Sanyo Chem Ind Ltd	水溶性切削液

2009
- 2009-07-15 JP JP2009166962A patent/JP5679642B2/ja active Active
2010
- 2010-02-12 CN CN201080030425.7A patent/CN102471723B/zh active Active
- 2010-02-12 KR KR1020127000416A patent/KR20120049216A/ko active Search and Examination
- 2010-02-12 SG SG2011095171A patent/SG177321A1/en unknown
- 2010-02-12 WO PCT/JP2010/052095 patent/WO2011007590A1/ja active Application Filing

Also Published As

Publication number	Publication date
WO2011007590A1 (ja)	2011-01-20
KR20120049216A (ko)	2012-05-16
JP5679642B2 (ja)	2015-03-04
JP2011021096A (ja)	2011-02-03
CN102471723B (zh)	2015-06-03
CN102471723A (zh)	2012-05-23

Publication	Publication Date	Title
SG177321A1 (en)	2012-02-28	Water-soluble working fluid for fixed abrasive grain wire saw
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KR101589764B1 (ko)	2016-01-28	수성 절삭액 및 수성 절삭제
JP4497767B2 (ja)	2010-07-07	固定砥粒ワイヤソー用水溶性加工液組成物
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JP2016211000A (ja)	2016-12-15	水性加工液