SG171819A1 - Method of manufacturing chuck plate for use in electrostatic chuck - Google Patents
Method of manufacturing chuck plate for use in electrostatic chuck Download PDFInfo
- Publication number
- SG171819A1 SG171819A1 SG2011037892A SG2011037892A SG171819A1 SG 171819 A1 SG171819 A1 SG 171819A1 SG 2011037892 A SG2011037892 A SG 2011037892A SG 2011037892 A SG2011037892 A SG 2011037892A SG 171819 A1 SG171819 A1 SG 171819A1
- Authority
- SG
- Singapore
- Prior art keywords
- chuck
- wafer
- chuck plate
- manufacturing
- electrostatic
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 33
- 239000002245 particle Substances 0.000 claims abstract description 25
- 238000005498 polishing Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 230000003746 surface roughness Effects 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 6
- 238000005245 sintering Methods 0.000 claims abstract description 6
- 239000002994 raw material Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 14
- 238000005422 blasting Methods 0.000 claims description 7
- 235000012054 meals Nutrition 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 45
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 21
- 239000007789 gas Substances 0.000 description 11
- 238000000227 grinding Methods 0.000 description 8
- 239000011261 inert gas Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008329612 | 2008-12-25 | ||
| PCT/JP2009/006731 WO2010073514A1 (ja) | 2008-12-25 | 2009-12-09 | 静電チャック用のチャックプレートの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG171819A1 true SG171819A1 (en) | 2011-07-28 |
Family
ID=42287172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2011037892A SG171819A1 (en) | 2008-12-25 | 2009-12-09 | Method of manufacturing chuck plate for use in electrostatic chuck |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20110256810A1 (ru) |
| JP (1) | JP5188584B2 (ru) |
| KR (1) | KR101316804B1 (ru) |
| CN (1) | CN102265390B (ru) |
| DE (1) | DE112009003808T5 (ru) |
| RU (1) | RU2486631C2 (ru) |
| SG (1) | SG171819A1 (ru) |
| TW (1) | TWI455791B (ru) |
| WO (1) | WO2010073514A1 (ru) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT521222B1 (de) * | 2018-05-07 | 2020-04-15 | Engel Austria Gmbh | Vorrichtung zum Handhaben und lokalen Fixieren |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2695436B2 (ja) | 1988-06-24 | 1997-12-24 | 富士通株式会社 | 静電チャックの劣化検出回路 |
| US5548470A (en) * | 1994-07-19 | 1996-08-20 | International Business Machines Corporation | Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity |
| JP3602901B2 (ja) * | 1996-01-30 | 2004-12-15 | 京セラ株式会社 | ウェハ保持部材とその製造方法 |
| JPH09219441A (ja) * | 1996-02-08 | 1997-08-19 | Fujitsu Ltd | 静電チャックからの被処理基板離脱方法及び製造装置 |
| JP4236292B2 (ja) * | 1997-03-06 | 2009-03-11 | 日本碍子株式会社 | ウエハー吸着装置およびその製造方法 |
| JP2000021963A (ja) | 1998-07-06 | 2000-01-21 | Nippon Steel Corp | 静電吸着装置 |
| JP2000277598A (ja) * | 1999-03-25 | 2000-10-06 | Ibiden Co Ltd | 静電チャック及びその製造方法 |
| JP2001035817A (ja) * | 1999-07-22 | 2001-02-09 | Toshiba Corp | ウェーハの分割方法及び半導体装置の製造方法 |
| JP2001118664A (ja) * | 1999-08-09 | 2001-04-27 | Ibiden Co Ltd | セラミックヒータ |
| JP3273773B2 (ja) * | 1999-08-12 | 2002-04-15 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ、半導体製造・検査装置用静電チャックおよびウエハプローバ用チャックトップ |
| TW473792B (en) * | 2000-01-20 | 2002-01-21 | Ngk Insulators Ltd | Electrostatic chuck |
| JP3228924B2 (ja) * | 2000-01-21 | 2001-11-12 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
| JP2001244320A (ja) * | 2000-02-25 | 2001-09-07 | Ibiden Co Ltd | セラミック基板およびその製造方法 |
| US6483690B1 (en) * | 2001-06-28 | 2002-11-19 | Lam Research Corporation | Ceramic electrostatic chuck assembly and method of making |
| US6669783B2 (en) * | 2001-06-28 | 2003-12-30 | Lam Research Corporation | High temperature electrostatic chuck |
| KR20040030803A (ko) * | 2001-07-19 | 2004-04-09 | 이비덴 가부시키가이샤 | 세라믹 접합체 및 그 접합방법, 세라믹 구조체 |
| JP2003224180A (ja) * | 2002-01-28 | 2003-08-08 | Kyocera Corp | ウエハ支持部材 |
| JP4472372B2 (ja) * | 2003-02-03 | 2010-06-02 | 株式会社オクテック | プラズマ処理装置及びプラズマ処理装置用の電極板 |
| US7102871B2 (en) * | 2003-10-29 | 2006-09-05 | Taiwan Semiconductor Manufacturing Co,, Ltd. | Electrostatic chuck assembly having disassembling device |
| JP4189373B2 (ja) * | 2003-10-31 | 2008-12-03 | 株式会社トクヤマ | 窒化アルミニウム接合体及びその製造方法 |
| CN100470756C (zh) * | 2004-06-28 | 2009-03-18 | 京瓷株式会社 | 静电卡盘 |
| JP2007088411A (ja) * | 2005-06-28 | 2007-04-05 | Hitachi High-Technologies Corp | 静電吸着装置およびウエハ処理装置ならびにプラズマ処理方法 |
| JP4664142B2 (ja) * | 2005-07-21 | 2011-04-06 | 住友重機械工業株式会社 | ステージ装置 |
| US7672110B2 (en) * | 2005-08-29 | 2010-03-02 | Applied Materials, Inc. | Electrostatic chuck having textured contact surface |
| US7869184B2 (en) * | 2005-11-30 | 2011-01-11 | Lam Research Corporation | Method of determining a target mesa configuration of an electrostatic chuck |
| US7589025B2 (en) * | 2005-12-02 | 2009-09-15 | Rohm And Haas Electronic Materials Llc | Semiconductor processing |
| US7646581B2 (en) * | 2006-01-31 | 2010-01-12 | Sumitomo Osaka Cement Co., Ltd. | Electrostatic chuck |
| JP4936925B2 (ja) * | 2006-03-03 | 2012-05-23 | 日本碍子株式会社 | ブラスト処理方法 |
| US7589950B2 (en) * | 2006-10-13 | 2009-09-15 | Applied Materials, Inc. | Detachable electrostatic chuck having sealing assembly |
| JP2008160093A (ja) * | 2006-11-29 | 2008-07-10 | Toto Ltd | 静電チャック、静電チャックの製造方法および基板処理装置 |
| JP5116330B2 (ja) * | 2007-03-26 | 2013-01-09 | 株式会社東京精密 | 電解加工ユニット装置及び電解加工洗浄乾燥方法 |
| JP2009060035A (ja) * | 2007-09-03 | 2009-03-19 | Shinko Electric Ind Co Ltd | 静電チャック部材、その製造方法及び静電チャック装置 |
| JP2009081223A (ja) * | 2007-09-26 | 2009-04-16 | Tokyo Electron Ltd | 静電チャック部材 |
| TWI475594B (zh) * | 2008-05-19 | 2015-03-01 | Entegris Inc | 靜電夾頭 |
| DE112009002400T5 (de) * | 2008-10-07 | 2012-01-19 | Ulvac, Inc. | Verfahren zum Handhaben eines Substrats |
| JP4761334B2 (ja) * | 2009-02-23 | 2011-08-31 | 株式会社ソディック | 着色セラミック真空チャックおよびその製造方法 |
| JP5510411B2 (ja) * | 2010-08-11 | 2014-06-04 | Ｔｏｔｏ株式会社 | 静電チャック及び静電チャックの製造方法 |
-
2009
- 2009-12-09 JP JP2010543796A patent/JP5188584B2/ja active Active
- 2009-12-09 US US13/130,595 patent/US20110256810A1/en not_active Abandoned
- 2009-12-09 WO PCT/JP2009/006731 patent/WO2010073514A1/ja active Application Filing
- 2009-12-09 CN CN200980151941.2A patent/CN102265390B/zh active Active
- 2009-12-09 SG SG2011037892A patent/SG171819A1/en unknown
- 2009-12-09 KR KR1020117013611A patent/KR101316804B1/ko active IP Right Grant
- 2009-12-09 RU RU2011130815/28A patent/RU2486631C2/ru active
- 2009-12-09 DE DE112009003808T patent/DE112009003808T5/de not_active Ceased
- 2009-12-23 TW TW098144477A patent/TWI455791B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP5188584B2 (ja) | 2013-04-24 |
| US20110256810A1 (en) | 2011-10-20 |
| KR101316804B1 (ko) | 2013-10-11 |
| RU2486631C2 (ru) | 2013-06-27 |
| TWI455791B (zh) | 2014-10-11 |
| JPWO2010073514A1 (ja) | 2012-06-07 |
| CN102265390A (zh) | 2011-11-30 |
| RU2011130815A (ru) | 2013-01-27 |
| KR20110107796A (ko) | 2011-10-04 |
| WO2010073514A1 (ja) | 2010-07-01 |
| TW201032943A (en) | 2010-09-16 |
| CN102265390B (zh) | 2014-10-15 |
| DE112009003808T5 (de) | 2012-06-06 |
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