TWI455791B - 靜電吸盤用之吸盤平板的製造方法 - Google Patents

靜電吸盤用之吸盤平板的製造方法 Download PDF

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Publication number
TWI455791B
TWI455791B TW098144477A TW98144477A TWI455791B TW I455791 B TWI455791 B TW I455791B TW 098144477 A TW098144477 A TW 098144477A TW 98144477 A TW98144477 A TW 98144477A TW I455791 B TWI455791 B TW I455791B
Authority
TW
Taiwan
Prior art keywords
chuck
electrostatic chuck
manufacturing
wet blasting
sintered body
Prior art date
Application number
TW098144477A
Other languages
English (en)
Other versions
TW201032943A (en
Inventor
Takahiro Nanba
Naoki Morimoto
Kouji Sogabe
Masahiko Ishida
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW201032943A publication Critical patent/TW201032943A/zh
Application granted granted Critical
Publication of TWI455791B publication Critical patent/TWI455791B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)

Claims (2)

  1. 一種靜電吸盤用之吸盤平板的製造方法，係為將具備有電極之吸盤本體的表面作覆蓋之由介電質所成的靜電吸盤用之吸盤平板之製造方法，其特徵為，包含有：將原料粉末壓縮成形為特定之形狀，而後進行燒結並得到燒結體之工程：和對於前述燒結體中之與應吸著的基板相抵接之表面，藉由研磨加工而形成為特定之表面粗度以及平坦度之工程；和施加僅將伴隨著前述研磨加工而在前述表面上所產生之即將脫粒的粒子作選擇性除去的濕噴砂處理之工程，將藉由濕噴砂而噴吹之水壓設定為0.01~0.05MPa，並且將壓縮空氣之壓力設定為0.1~0.3MPa。
  2. 如申請專利範圍第1項所記載之靜電吸盤用之吸盤平板的製造方法，其中，將在濕噴砂中所使用之砥粒的粒徑，設為前述燒結體之平均粒徑以下。
TW098144477A 2008-12-25 2009-12-23 靜電吸盤用之吸盤平板的製造方法 TWI455791B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008329612 2008-12-25

Publications (2)

Publication Number Publication Date
TW201032943A TW201032943A (en) 2010-09-16
TWI455791B true TWI455791B (zh) 2014-10-11

Family

ID=42287172

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098144477A TWI455791B (zh) 2008-12-25 2009-12-23 靜電吸盤用之吸盤平板的製造方法

Country Status (9)

Country Link
US (1) US20110256810A1 (zh)
JP (1) JP5188584B2 (zh)
KR (1) KR101316804B1 (zh)
CN (1) CN102265390B (zh)
DE (1) DE112009003808T5 (zh)
RU (1) RU2486631C2 (zh)
SG (1) SG171819A1 (zh)
TW (1) TWI455791B (zh)
WO (1) WO2010073514A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT521222B1 (de) * 2018-05-07 2020-04-15 Engel Austria Gmbh Vorrichtung zum Handhaben und lokalen Fixieren

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TW472500B (en) * 1999-08-12 2002-01-11 Ibiden Co Ltd Ceramic substrate, ceramic heater, electrostatic chuck and wafer probe for semiconductor manufacturing and checking device
TW527264B (en) * 2001-06-28 2003-04-11 Lam Res Corp Ceramic electrostatic chuck assembly and method of making
TW200423250A (en) * 2003-02-03 2004-11-01 Octec Inc Plasma processing device, electrode plate for the same, and manufacturing method for electrode plate
TWI247646B (en) * 2003-10-29 2006-01-21 Taiwan Semiconductor Mfg Disassembling device
TW200715357A (en) * 2005-07-21 2007-04-16 Sumitomo Heavy Industries Stage device

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TW472500B (en) * 1999-08-12 2002-01-11 Ibiden Co Ltd Ceramic substrate, ceramic heater, electrostatic chuck and wafer probe for semiconductor manufacturing and checking device
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TW200423250A (en) * 2003-02-03 2004-11-01 Octec Inc Plasma processing device, electrode plate for the same, and manufacturing method for electrode plate
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TW200715357A (en) * 2005-07-21 2007-04-16 Sumitomo Heavy Industries Stage device

Also Published As

Publication number Publication date
JP5188584B2 (ja) 2013-04-24
SG171819A1 (en) 2011-07-28
US20110256810A1 (en) 2011-10-20
KR101316804B1 (ko) 2013-10-11
RU2486631C2 (ru) 2013-06-27
JPWO2010073514A1 (ja) 2012-06-07
CN102265390A (zh) 2011-11-30
RU2011130815A (ru) 2013-01-27
KR20110107796A (ko) 2011-10-04
WO2010073514A1 (ja) 2010-07-01
TW201032943A (en) 2010-09-16
CN102265390B (zh) 2014-10-15
DE112009003808T5 (de) 2012-06-06

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