SG169314A1 - Method and device for detecting defects in an object - Google Patents
Method and device for detecting defects in an objectInfo
- Publication number
- SG169314A1 SG169314A1 SG201006324-6A SG2010063246A SG169314A1 SG 169314 A1 SG169314 A1 SG 169314A1 SG 2010063246 A SG2010063246 A SG 2010063246A SG 169314 A1 SG169314 A1 SG 169314A1
- Authority
- SG
- Singapore
- Prior art keywords
- incident light
- components
- detecting defects
- detection
- defects
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60P—VEHICLES ADAPTED FOR LOAD TRANSPORTATION OR TO TRANSPORT, TO CARRY, OR TO COMPRISE SPECIAL LOADS OR OBJECTS
- B60P1/00—Vehicles predominantly for transporting loads and modified to facilitate loading, consolidating the load, or unloading
- B60P1/44—Vehicles predominantly for transporting loads and modified to facilitate loading, consolidating the load, or unloading having a loading platform thereon raising the load to the level of the load-transporting element
- B60P1/4492—Design or construction of the moving platform itself
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9505—Wafer internal defects, e.g. microcracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R39/00—Rotary current collectors, distributors or interrupters
- H01R39/02—Details for dynamo electric machines
- H01R39/32—Connections of conductor to commutator segment
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K13/00—Structural associations of current collectors with motors or generators, e.g. brush mounting plates or connections to windings; Disposition of current collectors in motors or generators; Arrangements for improving commutation
- H02K13/04—Connections between commutator segments and windings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/845—Objects on a conveyor
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009039685.3A DE102009039685B4 (de) | 2009-09-02 | 2009-09-02 | Verfahren und Vorrichtung zur Detektion von Defekten in einem Objekt |
Publications (1)
Publication Number | Publication Date |
---|---|
SG169314A1 true SG169314A1 (en) | 2011-03-30 |
Family
ID=43525202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG201006324-6A SG169314A1 (en) | 2009-09-02 | 2010-08-31 | Method and device for detecting defects in an object |
Country Status (6)
Country | Link |
---|---|
US (1) | US8400630B2 (ja) |
JP (2) | JP2011053213A (ja) |
CN (1) | CN102004107B (ja) |
DE (2) | DE102009039685B4 (ja) |
SG (1) | SG169314A1 (ja) |
TW (1) | TWI528027B (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010003112A1 (de) * | 2010-03-22 | 2011-09-22 | Osram Opto Semiconductors Gmbh | Verfahren zur Kontrolle einer zwischen einer Metallschicht und einer Halbleiterschicht ausgebildeten Grenzfläche |
WO2012143753A1 (en) | 2011-04-18 | 2012-10-26 | Kla-Tencor Corporation | Apparatus for illuminating substrates in order to image micro cracks, pinholes and inclusions in monocrystalline and polycrystalline substrates and method therefore |
JP5791101B2 (ja) * | 2011-05-16 | 2015-10-07 | 芝浦メカトロニクス株式会社 | 貼り合せ板状体検査装置及び方法 |
FR2977182B1 (fr) * | 2011-07-01 | 2013-07-12 | Commissariat Energie Atomique | Procede de fabrication d'un composant optique pour supprimer des defauts de surface |
CN102388549B (zh) * | 2011-09-27 | 2014-03-12 | 华为技术有限公司 | 无源光网络中光纤链路的检测方法、***和装置 |
DE102012213793B3 (de) | 2012-08-03 | 2013-10-24 | Solarworld Innovations Gmbh | Untersuchung eines Siliziumsubstrats für eine Solarzelle |
US10315275B2 (en) * | 2013-01-24 | 2019-06-11 | Wisconsin Alumni Research Foundation | Reducing surface asperities |
JP2014190797A (ja) * | 2013-03-27 | 2014-10-06 | Tokushima Densei Kk | シリコンウェハの欠陥検査装置 |
TW201530121A (zh) * | 2014-01-27 | 2015-08-01 | Utechzone Co Ltd | 面板亮點檢測方法及系統 |
JP6248819B2 (ja) * | 2014-06-12 | 2017-12-20 | 株式会社島津製作所 | 検査装置及び検査方法 |
DE102016223306A1 (de) | 2016-11-24 | 2018-05-24 | Bayerische Motoren Werke Aktiengesellschaft | Vorrichtung und Verfahren zur Detektion von Defekten eines Prüfobjekts |
DE102016224767B4 (de) | 2016-12-13 | 2019-08-08 | Bayerische Motoren Werke Aktiengesellschaft | Vorrichtung und Verfahren zur Detektion von Defekten eines Prüfobjekts |
CN109425619B (zh) * | 2017-08-31 | 2021-12-28 | 深圳中科飞测科技股份有限公司 | 光学测量***及方法 |
US10724965B2 (en) * | 2018-02-09 | 2020-07-28 | Massachusetts Institute Of Technology | Systems and methods for crack detection |
CN109297984B (zh) * | 2018-11-13 | 2021-02-19 | 正大天晴药业集团股份有限公司 | 一种泡罩包装缺陷检测方法、装置及设备 |
CN112179916B (zh) * | 2020-08-19 | 2024-04-19 | 宁波赫兹光电科技有限公司 | 一种太阳能硅片光学隐裂检测装置 |
TWI797689B (zh) * | 2021-05-24 | 2023-04-01 | 馬來西亞商正齊科技有限公司 | 檢查電子元件內部缺陷的裝置及方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0424541A (ja) * | 1990-05-21 | 1992-01-28 | Mitsui Mining & Smelting Co Ltd | 内部欠陥測定方法および装置 |
DE4139094A1 (de) * | 1991-11-28 | 1993-06-03 | Wolf & Beck Gmbh Dr | Messverfahren und messgeraet zur erkennung von stoerstellen bei flachglaesern |
JPH06294749A (ja) * | 1993-04-09 | 1994-10-21 | Nippon Electric Glass Co Ltd | 板ガラスの欠点検査方法 |
JPH09145611A (ja) * | 1995-11-24 | 1997-06-06 | Fujitsu Ltd | 半導体ウェーハの分析方法及び装置 |
JP3187759B2 (ja) * | 1997-12-09 | 2001-07-11 | 株式会社アドバンテスト | 有機汚染検出・除去装置及びその有機汚染検出・除去方法並びに化学汚染検出・除去装置及びその化学汚染検出・除去方法 |
JP3261362B2 (ja) * | 1998-05-28 | 2002-02-25 | 株式会社アドバンテスト | 表面状態測定方法及び装置 |
JPH11352072A (ja) * | 1998-06-04 | 1999-12-24 | Advantest Corp | 表面検査装置および方法 |
JP2001194320A (ja) * | 2000-01-06 | 2001-07-19 | Advantest Corp | 表面状態測定装置及び方法 |
JP2001305072A (ja) * | 2000-04-25 | 2001-10-31 | Advantest Corp | 基板の欠陥検出方法及び装置 |
JP2002168774A (ja) * | 2000-11-28 | 2002-06-14 | Advantest Corp | 表面状態測定方法及び装置 |
JP2003156440A (ja) * | 2001-11-21 | 2003-05-30 | Advantest Corp | 化学物質検出方法及び装置 |
WO2005064321A1 (en) * | 2003-12-30 | 2005-07-14 | Agency For Science, Technology And Research | Method and apparatus for detection of inclusions in glass |
KR101117826B1 (ko) * | 2005-02-18 | 2012-06-05 | 호야 가부시키가이샤 | 투광성 물품의 검사 방법, 마스크 블랭크용 투광성 기판의 제조 방법, 마스크 블랭크의 제조 방법, 노광용 마스크의 제조 방법, 반도체 장치의 제조 방법 및 위상 시프트 마스크의 제조 방법 |
JP4792267B2 (ja) * | 2005-09-21 | 2011-10-12 | 株式会社アドバンテスト | 表面状態測定方法及び装置 |
DE102005061785B4 (de) * | 2005-12-23 | 2008-04-03 | Basler Ag | Verfahren und Vorrichtung zum Erkennen von Rissen in Silizium-Wafern |
JP4575886B2 (ja) * | 2006-02-14 | 2010-11-04 | シャープ株式会社 | 多結晶半導体ウエハの割れ検査装置および割れ検査方法 |
JP2008058270A (ja) * | 2006-09-04 | 2008-03-13 | Mitsubishi Electric Corp | 多結晶シリコン基板の検査方法および太陽電池セルの検査方法、並びに赤外線検査装置 |
DE102007006525B4 (de) * | 2007-02-06 | 2009-05-14 | Basler Ag | Verfahren und Vorrichtung zur Detektierung von Defekten |
JP2009210476A (ja) * | 2008-03-05 | 2009-09-17 | Sharp Corp | クラック検査装置およびクラック検査方法 |
CN101299016A (zh) * | 2008-05-23 | 2008-11-05 | 厦门大学 | 一种基于多重内反射红外光谱的混凝土渗透性的检测方法 |
DE102009050711A1 (de) * | 2009-10-26 | 2011-05-05 | Schott Ag | Verfahren und Vorrichtung zur Detektion von Rissen in Halbleitersubstraten |
-
2009
- 2009-09-02 DE DE102009039685.3A patent/DE102009039685B4/de not_active Revoked
- 2009-09-02 DE DE202009017691U patent/DE202009017691U1/de not_active Expired - Lifetime
-
2010
- 2010-08-13 TW TW099127089A patent/TWI528027B/zh active
- 2010-08-26 CN CN201010262848.3A patent/CN102004107B/zh active Active
- 2010-08-31 SG SG201006324-6A patent/SG169314A1/en unknown
- 2010-09-01 JP JP2010195271A patent/JP2011053213A/ja not_active Withdrawn
- 2010-09-02 US US12/874,516 patent/US8400630B2/en active Active
-
2017
- 2017-03-06 JP JP2017041391A patent/JP6295353B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN102004107A (zh) | 2011-04-06 |
JP2017102129A (ja) | 2017-06-08 |
TW201118369A (en) | 2011-06-01 |
TWI528027B (zh) | 2016-04-01 |
US8400630B2 (en) | 2013-03-19 |
JP6295353B2 (ja) | 2018-03-14 |
DE202009017691U1 (de) | 2010-05-20 |
JP2011053213A (ja) | 2011-03-17 |
DE102009039685A8 (de) | 2011-06-01 |
US20110058161A1 (en) | 2011-03-10 |
CN102004107B (zh) | 2015-06-24 |
DE102009039685A1 (de) | 2011-03-03 |
DE102009039685B4 (de) | 2015-07-16 |
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