SG144135A1 - Multi-chips package and method of forming the same - Google Patents

Multi-chips package and method of forming the same

Info

Publication number
SG144135A1
SG144135A1 SG200800131-5A SG2008001315A SG144135A1 SG 144135 A1 SG144135 A1 SG 144135A1 SG 2008001315 A SG2008001315 A SG 2008001315A SG 144135 A1 SG144135 A1 SG 144135A1
Authority
SG
Singapore
Prior art keywords
rdl
die
dielectric layer
forming
formed under
Prior art date
Application number
SG200800131-5A
Other languages
English (en)
Inventor
Yang Wen-Kun
Original Assignee
Advanced Chip Eng Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Chip Eng Tech Inc filed Critical Advanced Chip Eng Tech Inc
Publication of SG144135A1 publication Critical patent/SG144135A1/en

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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
SG200800131-5A 2007-01-03 2008-01-03 Multi-chips package and method of forming the same SG144135A1 (en)

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