SG11201906904YA - Removal of process effluents - Google Patents
Removal of process effluentsInfo
- Publication number
- SG11201906904YA SG11201906904YA SG11201906904YA SG11201906904YA SG11201906904YA SG 11201906904Y A SG11201906904Y A SG 11201906904YA SG 11201906904Y A SG11201906904Y A SG 11201906904YA SG 11201906904Y A SG11201906904Y A SG 11201906904YA SG 11201906904Y A SG11201906904Y A SG 11201906904YA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- international
- shields
- pct
- apparatuses
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/002—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being a degassed liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0264—Splash guards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/027—Pump details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 09 August 2018 (09.08.2018) WIP0 I PCT omit VIII °nolo How loon mo lio iflo oimIE (10) International Publication Number WO 2018/145070 Al (51) International Patent Classification: H01L 21/67 (2006.01) HOlL 21/687 (2006.01) H01L 21/02 (2006.01) (21) International Application Number: PCT/US2018/017014 (22) International Filing Date: 06 February 2018 (06.02.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/455,425 06 February 2017 (06.02.2017) US 62/518,297 12 June 2017 (12.06.2017) US (71) Applicant: PLANAR SEMICONDUCTOR, INC. [US/US]; 1759 South Main Street, Suite 120, Milpitas, Cal- ifornia 95035 (US). (72) Inventors: RANDHAWA, Rubinder S.; 3263 Cranbrook Place, Dublin, California 94568 (US). CHRISTOV, Har- ry; 390 Darryl Drive, Campbell, California 95008 (US). (74) Agent: SCHEER, Bradley W. et al.; Schwegman Lund- Published: berg & Woessner, P.A., P.O. Box 2938, Minneapolis, Min- nesota 55402 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — of inventorship (Rule 4.17(iv)) — with international search report (Art. 21(3)) (54) Title: REMOVAL OF PROCESS EFFLUENTS W O 20 18/ 145 07 0 Al (57) : Various embodiments comprise apparatuses and related method for cleaning and drying a substrate. In one embodiment, an appa- ratus includes a vertical substrate holder to hold and rotate the substrate at various speeds. An inner shield and outer shield, when in a closed posi- tion, surround the vertical substrate holder during operation of the apparatus. Each of the shields can operate independently in at least one of rotational speed and direction from the other shield. A front-side and back-side spray jet are arranged to spray at least one fluid onto both sides of the substrate and edges of the substrate substantially concurrently. A gas flow, combined with a high rotational-speed of the shields and substrate, assists in drying the substrate. At least one turbine disk is coupled in proximity to at least one of the shields to remove excess amounts of fluid. Additional apparatuses and methods of forming the apparatuses are disclosed. FIG. 6
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762455425P | 2017-02-06 | 2017-02-06 | |
US201762518297P | 2017-06-12 | 2017-06-12 | |
PCT/US2018/017014 WO2018145070A1 (en) | 2017-02-06 | 2018-02-06 | Removal of process effluents |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201906904YA true SG11201906904YA (en) | 2019-08-27 |
Family
ID=63041164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201906904YA SG11201906904YA (en) | 2017-02-06 | 2018-02-06 | Removal of process effluents |
Country Status (8)
Country | Link |
---|---|
US (1) | US10892172B2 (en) |
EP (1) | EP3577681A4 (en) |
JP (1) | JP6961015B2 (en) |
KR (1) | KR102226086B1 (en) |
CN (1) | CN110603628B (en) |
SG (1) | SG11201906904YA (en) |
TW (1) | TWI770115B (en) |
WO (1) | WO2018145070A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI770115B (en) | 2017-02-06 | 2022-07-11 | 新加坡商平面半導體公司 | Removal of process effluents |
SG11201906903PA (en) | 2017-02-06 | 2019-08-27 | Planar Semiconductor Inc | Sub-nanometer-level substrate cleaning mechanism |
JP6786730B2 (en) | 2017-02-06 | 2020-11-18 | プレイナー・セミコンダクター・インコーポレイテッド | Sub-nanometer level optical-based substrate cleaning mechanism |
US11139183B2 (en) * | 2018-05-24 | 2021-10-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for dry wafer transport |
KR102387088B1 (en) * | 2019-10-31 | 2022-04-15 | 세메스 주식회사 | Substrate treatment apparatus |
CN114453359A (en) * | 2022-01-21 | 2022-05-10 | 株洲时代新材料科技股份有限公司 | Device and method for removing residual glue of glue scraping box through rapid heating |
CN114700306B (en) * | 2022-04-02 | 2022-12-16 | 南通东西洗轮机机械有限公司 | Washing unit is used in automobile parts processing |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3849906A (en) * | 1973-11-07 | 1974-11-26 | Ibm | Rotary fluid applicator |
US5531857A (en) | 1988-07-08 | 1996-07-02 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation from a high energy source |
JPH04119524A (en) | 1990-09-10 | 1992-04-21 | Fuji Electric Co Ltd | Rotary surface processor |
US5516816A (en) | 1993-02-12 | 1996-05-14 | Alliedsignal Inc. | Friction composition and friction element fabricated therefrom |
JPH07192996A (en) | 1993-12-27 | 1995-07-28 | Dainippon Screen Mfg Co Ltd | Ultraviolet irradiation apparatus |
JPH1064864A (en) | 1996-08-21 | 1998-03-06 | Nikon Corp | Cleaning device |
JPH10242098A (en) | 1997-03-03 | 1998-09-11 | Miyazaki Oki Electric Co Ltd | Wafer cleaning equipment and wafer cleaning method |
JPH1126410A (en) | 1997-06-30 | 1999-01-29 | Nikon Corp | Cleaning apparatus |
JPH11189499A (en) | 1997-12-25 | 1999-07-13 | Japan Energy Corp | Production of compound semiconductor single crystal |
JPH11242098A (en) | 1998-02-25 | 1999-09-07 | Sumitomo Metal Ind Ltd | Device and method for melting and ingot-making |
JP2000124181A (en) | 1998-10-13 | 2000-04-28 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
US6516816B1 (en) | 1999-04-08 | 2003-02-11 | Applied Materials, Inc. | Spin-rinse-dryer |
JP2001113163A (en) | 1999-10-20 | 2001-04-24 | Hoya Schott Kk | Ultraviolet light irradiation device and method |
JP3620016B2 (en) | 1999-10-25 | 2005-02-16 | 東京エレクトロン株式会社 | Substrate processing equipment |
US6225235B1 (en) * | 2000-02-18 | 2001-05-01 | Horst Kunze-Concewitz | Method and device for cleaning and etching individual wafers using wet chemistry |
KR100348701B1 (en) | 2001-12-07 | 2002-08-13 | 주식회사 아이엠티 | Apparatus for dry surface-cleaning of materials |
KR100457053B1 (en) | 2002-07-30 | 2004-11-10 | 삼성전자주식회사 | Apparatus for cleaning a wafer |
CN100342498C (en) | 2003-01-06 | 2007-10-10 | 富士通株式会社 | Method and equipment for manufacturing semiconductor device |
US20050170653A1 (en) | 2003-01-06 | 2005-08-04 | Fujitsu Limited | Semiconductor manufacturing method and apparatus |
US20040224508A1 (en) | 2003-05-06 | 2004-11-11 | Applied Materials Israel Ltd | Apparatus and method for cleaning a substrate using a homogenized and non-polarized radiation beam |
US20050026455A1 (en) | 2003-05-30 | 2005-02-03 | Satomi Hamada | Substrate processing apparatus and substrate processing method |
EP1783822A4 (en) | 2004-06-21 | 2009-07-15 | Nikon Corp | Exposure device, exposure device member cleaning method, exposure device maintenance method, maintenance device, and device manufacturing method |
JP2006066501A (en) | 2004-08-25 | 2006-03-09 | Tokyo Seimitsu Co Ltd | Spin cleaning/drying device and method therefor |
US10179351B2 (en) | 2005-02-07 | 2019-01-15 | Planar Semiconductor, Inc. | Method and apparatus for cleaning flat objects with pulsed liquid jet |
US20090075060A1 (en) | 2005-02-16 | 2009-03-19 | Miller James R | Adsorptive coating formulation |
KR100749543B1 (en) | 2006-03-28 | 2007-08-14 | 세메스 주식회사 | A method and apparatus for cleaning substrates |
KR100787996B1 (en) | 2006-06-16 | 2007-12-21 | 세메스 주식회사 | Apparatus for treating substrate and method for recycling treating liquid from the same |
KR100757848B1 (en) | 2006-06-16 | 2007-09-11 | 세메스 주식회사 | Apparatus of treating a substrate in a single wafer type |
US9418831B2 (en) * | 2007-07-30 | 2016-08-16 | Planar Semiconductor, Inc. | Method for precision cleaning and drying flat objects |
JP2009147061A (en) * | 2007-12-13 | 2009-07-02 | Realize Advanced Technology Ltd | Substrate processing method |
CN101540268B (en) | 2008-03-20 | 2012-12-05 | 盛美半导体设备(上海)有限公司 | Method and device for cleaning semiconductor chip |
JP5151629B2 (en) * | 2008-04-03 | 2013-02-27 | 東京エレクトロン株式会社 | Substrate cleaning method, substrate cleaning apparatus, developing method, developing apparatus, and storage medium |
US20110083696A1 (en) | 2009-10-08 | 2011-04-14 | Nuventys Inc. | Laser Induced Shockwave Surface Cleaning |
US8415587B2 (en) | 2010-12-03 | 2013-04-09 | Uvtech Systems, Inc. | Fiber-optic beam delivery system for wafer edge processing |
US9638179B2 (en) * | 2012-12-04 | 2017-05-02 | General Electric Company | Hydraulic control system for a reverse osmosis hydraulic pump |
US20140367898A1 (en) * | 2013-06-12 | 2014-12-18 | Firth Rixson Limited | Cooling systems for heat-treated parts and methods of use |
JP6234736B2 (en) | 2013-08-30 | 2017-11-22 | 芝浦メカトロニクス株式会社 | Spin processing device |
JP6341035B2 (en) * | 2014-09-25 | 2018-06-13 | 東京エレクトロン株式会社 | Substrate liquid processing method, substrate liquid processing apparatus, and storage medium |
SG11201906903PA (en) | 2017-02-06 | 2019-08-27 | Planar Semiconductor Inc | Sub-nanometer-level substrate cleaning mechanism |
TWI770115B (en) | 2017-02-06 | 2022-07-11 | 新加坡商平面半導體公司 | Removal of process effluents |
JP6786730B2 (en) | 2017-02-06 | 2020-11-18 | プレイナー・セミコンダクター・インコーポレイテッド | Sub-nanometer level optical-based substrate cleaning mechanism |
-
2018
- 2018-02-05 TW TW107104052A patent/TWI770115B/en active
- 2018-02-06 JP JP2019563336A patent/JP6961015B2/en active Active
- 2018-02-06 CN CN201880023301.2A patent/CN110603628B/en active Active
- 2018-02-06 EP EP18748256.7A patent/EP3577681A4/en active Pending
- 2018-02-06 KR KR1020197026006A patent/KR102226086B1/en active IP Right Grant
- 2018-02-06 US US16/478,407 patent/US10892172B2/en active Active
- 2018-02-06 WO PCT/US2018/017014 patent/WO2018145070A1/en active Application Filing
- 2018-02-06 SG SG11201906904YA patent/SG11201906904YA/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN110603628A (en) | 2019-12-20 |
US20190378729A1 (en) | 2019-12-12 |
TW201842609A (en) | 2018-12-01 |
EP3577681A1 (en) | 2019-12-11 |
KR20200011407A (en) | 2020-02-03 |
CN110603628B (en) | 2023-11-07 |
US10892172B2 (en) | 2021-01-12 |
WO2018145070A1 (en) | 2018-08-09 |
JP2020507936A (en) | 2020-03-12 |
TWI770115B (en) | 2022-07-11 |
JP6961015B2 (en) | 2021-11-05 |
EP3577681A4 (en) | 2020-11-25 |
KR102226086B1 (en) | 2021-03-09 |
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