SG11201407845VA - Photoactivated etching paste and its use - Google Patents

Photoactivated etching paste and its use

Info

Publication number
SG11201407845VA
SG11201407845VA SG11201407845VA SG11201407845VA SG11201407845VA SG 11201407845V A SG11201407845V A SG 11201407845VA SG 11201407845V A SG11201407845V A SG 11201407845VA SG 11201407845V A SG11201407845V A SG 11201407845VA SG 11201407845V A SG11201407845V A SG 11201407845VA
Authority
SG
Singapore
Prior art keywords
lllll
international
photo
llll
etching
Prior art date
Application number
SG11201407845VA
Inventor
Jun Nakanowatari
Tomohisa Goto
Original Assignee
Merck Patent Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent Gmbh filed Critical Merck Patent Gmbh
Publication of SG11201407845VA publication Critical patent/SG11201407845VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0006—Apparatus or processes specially adapted for manufacturing conductors or cables for reducing the size of conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/003—Apparatus or processes specially adapted for manufacturing conductors or cables using irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
    • H01L31/1888—Manufacture of transparent electrodes, e.g. TCO, ITO methods for etching transparent electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • ing And Chemical Polishing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Detergent Compositions (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Weting (AREA)
  • Photovoltaic Devices (AREA)

Abstract

(12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 12 December 2013 (12.12.2013) WIPOIPCT (10) International Publication Number WO 2013/182265 A1 (51) International Patent Classification: H01L 31/18 (2006.01) C09K13/04 (2006.01) (21) International Application Number: (22) International Filing Date: (25) Filing Language: (26) Publication Language: PCT/EP2013/001354 7 May 2013 (07.05.2013) English English (30) Priority Data: 12004239.5 4 June 2012 (04.06.2012) EP (71) Applicant: MERCK PATENT GMBH [DE/DE]; Frank­ furter Strasse 250, 64293 Darmstadt (DE). (72) Inventors: NAKANOWATARI, Jun; 3-19-8 Higashi- hasimoto, Kanagawa Pref., Sagamihara-City 229-1104 (JP). GOTO, Tomohisa; 1-5-2 Nishihasimoto, Sagamihara 252-0131 (JP). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). [Continued on next page] (54) Title: PHOTOACTIVATED ETCHING PASTE AND ITS USE Fig. 1 1, Coating photo-etch paste on the TCO substrate 2, Apply UV irradiation through photo mask UV light ^ ^ UV light I I Photo-etch paste *-»— TCO layer Glass or film substrate Photo-mask 3, Cleaning and washing Patterned TCO layer CJ CJ oo i-H o CJ o & [Continued on next page] WO 2013/182265 A11 lllll llllllll II llllll III lllll lllll III III III lllll lllll lllll lllll lllll llll llll lllllll llll llll Published: — with international search report (Art. 21(3)) (57) Abstract: The improved method for the etching of transparent conductive oxide layers placed on flexible polymer substrates, hard substrates like glass or on silicon wafers comprises the use of new etching pastes, which are activated by irradiation.
SG11201407845VA 2012-06-04 2013-05-07 Photoactivated etching paste and its use SG11201407845VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12004239 2012-06-04
PCT/EP2013/001354 WO2013182265A1 (en) 2012-06-04 2013-05-07 Photoactivated etching paste and its use

Publications (1)

Publication Number Publication Date
SG11201407845VA true SG11201407845VA (en) 2014-12-30

Family

ID=48539074

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201407845VA SG11201407845VA (en) 2012-06-04 2013-05-07 Photoactivated etching paste and its use

Country Status (8)

Country Link
US (1) US20150152328A1 (en)
EP (1) EP2856519A1 (en)
JP (1) JP2015526880A (en)
KR (1) KR20150018608A (en)
CN (1) CN104335366B (en)
SG (1) SG11201407845VA (en)
TW (1) TW201400592A (en)
WO (1) WO2013182265A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016096083A1 (en) * 2014-12-19 2016-06-23 Merck Patent Gmbh Agent for increasing etching rates
JP2017139295A (en) * 2016-02-02 2017-08-10 東芝メモリ株式会社 Substrate processing device, substrate processing method, and substrate processing liquid
KR102384001B1 (en) * 2016-03-24 2022-04-08 동우 화인켐 주식회사 Colored Photosensitive Resin Composition and Color Filter Comprising the Same
JP7129167B2 (en) * 2017-01-20 2022-09-01 住友化学株式会社 RESIST COMPOSITION AND RESIST PATTERN MANUFACTURING METHOD
KR102026191B1 (en) * 2017-12-12 2019-09-27 재단법인 나노기반소프트일렉트로닉스연구단 Method for preparing surface modified polymer thin film and method for fabricating organic electronic device comprising the same
US20190189631A1 (en) * 2017-12-15 2019-06-20 Soulbrain Co., Ltd. Composition for etching and manufacturing method of semiconductor device using the same
TWI677106B (en) * 2018-07-25 2019-11-11 元創綠能科技股份有限公司 Circuit board, circuit board manufacturing method and circuit board combined with solar cell
US10867815B2 (en) * 2018-09-04 2020-12-15 Tokyo Electron Limited Photonically tuned etchant reactivity for wet etching
JP2023038824A (en) * 2021-09-07 2023-03-17 株式会社Ｓｃｒｅｅｎホールディングス Wafer processing device and wafer processing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5648196A (en) * 1995-07-14 1997-07-15 Cornell Research Foundation, Inc. Water-soluble photoinitiators
JPH11106935A (en) * 1997-09-30 1999-04-20 Fuji Photo Film Co Ltd Production of metal oxide thin film and metal oxide thin film
DE10120661A1 (en) * 2001-04-27 2002-11-21 Infineon Technologies Ag Photoresist composition for integrated circuit production, comprises film-forming polymer giving alkali-soluble groups by acid-catalyzed elimination and groups reacting with amplifying agent and photo- and thermo-acid generators
DE60234409D1 (en) 2001-06-29 2009-12-31 Jsr Corp Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive composition
JP2004006628A (en) * 2002-03-27 2004-01-08 Hitachi Ltd Method for manufacturing semiconductor device
DE102005033724A1 (en) * 2005-07-15 2007-01-18 Merck Patent Gmbh Printable etching media for silicon dioxide and silicon nitride layers
DE102005035255A1 (en) * 2005-07-25 2007-02-01 Merck Patent Gmbh Etching media for oxide, transparent, conductive layers
US7651830B2 (en) * 2007-06-01 2010-01-26 3M Innovative Properties Company Patterned photoacid etching and articles therefrom
US8617418B2 (en) * 2009-03-30 2013-12-31 Toray Industries, Inc. Conductive film removal agent and conductive film removal method
SG186343A1 (en) * 2010-06-14 2013-01-30 Merck Patent Gmbh Cross-linking and multi-phase etch pastes for high resolution feature patterning
US20140021400A1 (en) * 2010-12-15 2014-01-23 Sun Chemical Corporation Printable etchant compositions for etching silver nanoware-based transparent, conductive film

Also Published As

Publication number Publication date
WO2013182265A1 (en) 2013-12-12
CN104335366B (en) 2017-05-10
US20150152328A1 (en) 2015-06-04
CN104335366A (en) 2015-02-04
EP2856519A1 (en) 2015-04-08
KR20150018608A (en) 2015-02-23
JP2015526880A (en) 2015-09-10
TW201400592A (en) 2014-01-01

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