JPH04119524A - Rotary surface processor - Google Patents
Rotary surface processorInfo
- Publication number
- JPH04119524A JPH04119524A JP23930990A JP23930990A JPH04119524A JP H04119524 A JPH04119524 A JP H04119524A JP 23930990 A JP23930990 A JP 23930990A JP 23930990 A JP23930990 A JP 23930990A JP H04119524 A JPH04119524 A JP H04119524A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- processed
- surface treatment
- rotary
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims abstract description 56
- 238000004381 surface treatment Methods 0.000 claims description 43
- 239000011148 porous material Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野〕
この発明は、磁気記録媒体を回転させて両面に液体潤滑
剤等の塗布液を塗布したり、半導体ウェハを回転させて
片面を純水で洗浄したりする等の回転表面処理装置に関
する。[Detailed Description of the Invention] [Industrial Application Field] This invention applies a coating liquid such as a liquid lubricant to both sides of a magnetic recording medium by rotating it, or a method of coating one side of a semiconductor wafer with pure water by rotating it. This invention relates to rotary surface treatment equipment for cleaning, etc.
第４図は従来例の縦断面図であり、磁気記録媒体等の被
処理板１は回転軸２．保持具３を介して電動機４によっ
て回転駆動される。被処理板１の両面には塗布液等の表
面処理液５を噴出するノズル６が図示しない移動装置で
被処理板の半径方向にトラバースするようになっている
。そして被処理板１の外周には、板から遠心力で振り切
られる表面処理液を捕捉する固定カバー７が配置され、
下方の排液口から余剰液を排出する。FIG. 4 is a longitudinal cross-sectional view of a conventional example, in which a plate 1 to be processed such as a magnetic recording medium is connected to a rotating shaft 2. It is rotationally driven by an electric motor 4 via a holder 3. Nozzles 6 for ejecting a surface treatment liquid 5 such as a coating liquid are disposed on both sides of the plate 1 to be treated, and are configured to traverse in the radial direction of the plate 1 by means of a moving device (not shown). A fixed cover 7 is arranged around the outer periphery of the plate 1 to be treated, and captures the surface treatment liquid that is shaken off from the plate by centrifugal force.
Drain excess liquid from the lower drain port.
前記の従来の技術では、周囲に飛散した表面処理液は固
定カバーに付着後に滴状となり、再び被処理板の表面に
落下し、せっかく均一に塗布された表面状態を悪化させ
るという問題がある。In the conventional technique described above, there is a problem in that the surface treatment liquid scattered around becomes droplets after adhering to the fixed cover, and falls again onto the surface of the plate to be treated, deteriorating the surface condition that was evenly applied.
この発明の目的は、回転駆動される被処理板から飛散す
る表面処理液が再び被処理板に降りかかって表面状態を
悪化させることがないような回転表面処理装置を提供す
ることにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a rotary surface treatment apparatus in which surface treatment liquid splashed from a rotationally driven plate to be treated does not fall on the plate again and deteriorate the surface condition.
この発明１の回転表面処理装置は、
回転駆動される被処理板と、この被処理板の面に表面処
理液を施す処理液供給手段と、前記被処理板の外周に配
置され回転駆動される円錐台状の回転カバーとからなる
ものである。The rotary surface treatment apparatus according to the first aspect of the present invention includes: a plate to be treated that is rotationally driven; a treatment liquid supply means that applies a surface treatment liquid to the surface of the plate to be treated; It consists of a rotating cover in the shape of a truncated cone.
発明２の回転表面処理装置は、発明１において、前記処
理液供給手段をノズル又は刷毛とするものである。A second aspect of the rotary surface treatment apparatus according to the first aspect is that the treatment liquid supplying means is a nozzle or a brush.
発明３の回転表面処理装置ｉま、発明１又は２において
、
前記回転カバーは多孔性の材料からなり大径部で接合す
る一対の円錐台状部からなるものである。In the rotary surface treatment apparatus of invention 3, in invention 1 or 2, the rotating cover is made of a porous material and consists of a pair of truncated conical parts joined at a large diameter part.
発明４の回転表面処理装置は、発明１．２又は３におい
て、
前記回転カバーの外周に固定カバーを設けるものである
。The rotary surface treatment apparatus of Invention 4 is the one according to Invention 1.2 or 3, in which a fixed cover is provided around the outer periphery of the rotating cover.
発明５の回転表面処理装置は、発明４において、前記固
定カバーの上方に排気口を下方に排液口を設けるもので
ある。The rotary surface treatment apparatus of invention 5 is the rotary surface treatment apparatus of invention 4, in which an exhaust port is provided above the fixed cover and a drain port is provided below.
発明６０回転表面処理装置は、発明１．２．３４又は５
において、
前記処理液供給手段を被処理板の両面に配置し、前記回
転カバーの外周を複数のローラで支持して駆動するもの
である。Invention 60 Rotary surface treatment device is Invention 1.2.34 or 5
In the present invention, the processing liquid supply means are arranged on both sides of the plate to be processed, and the outer periphery of the rotating cover is supported and driven by a plurality of rollers.
〔作用］
発明１において、回転駆動される磁気記録媒体又は半導
体ウェハ等の被処理板の面上に施された処理液が遠心力
で被処理板から飛散して回転カバーに付着すると、回転
カバーは円錐台状をしているので、付着した液は遠心力
で内側の斜面を大径部側へ流れ、大径部から振り切られ
、再び被処理板に滴が落下することがない。処理槽の天
井等から落下する滴があっても回転カバーが被処理板を
覆っているので被処理板に落下することがない。[Function] In invention 1, when the processing liquid applied on the surface of a rotationally driven magnetic recording medium or a processing target plate such as a semiconductor wafer is scattered from the processing target board due to centrifugal force and adheres to the rotating cover, the rotating cover Since it has a truncated conical shape, the attached liquid flows down the inner slope toward the large diameter part due to centrifugal force, is shaken off from the large diameter part, and no droplets fall onto the plate to be treated again. Even if there are drops that fall from the ceiling of the processing tank, they will not fall onto the processing board because the rotating cover covers the processing board.
発明２において、処理液供給装置はノズル又は刷毛を使
用することができる。In invention 2, a nozzle or a brush can be used as the treatment liquid supply device.
発明３において、板に孔を多数設けたり、フィルタ状の
材料を用いたりして一対の円錐台状の回転カバーを形成
すれば、この回転カバー８の内側に被処理板１から振り
切られて来て付着した表面処理液５は、遠心力により回
転カバー８の内側から外側に流れ、ここから遠心力で振
り切られて再び被処理液板１に滴が落下することがない
。多孔性であるので表面処理液５の捕捉性がよ（、表面
処理液の粘性によっては都合のよい作用を示す。In invention 3, if a pair of truncated cone-shaped rotating covers are formed by providing a large number of holes in the plate or using a filter-like material, the particles that are shaken off from the plate 1 to be processed can be placed inside the rotating cover 8. The surface treatment liquid 5 that has adhered thereto flows from the inside to the outside of the rotary cover 8 due to centrifugal force, and is shaken off from here by the centrifugal force to prevent drops from falling onto the liquid plate 1 to be treated again. Since it is porous, it has a good ability to trap the surface treatment liquid 5 (although it exhibits an advantageous effect depending on the viscosity of the surface treatment liquid).
その際、捕捉された液は中央の大径部に集る傾向があり
、捕捉された表面処理液５の回収性がよい。At this time, the captured liquid tends to collect in the central large diameter portion, and the captured surface treatment liquid 5 can be easily recovered.
発明４において固定カバーを設けたり、発明５において
排気口と排液口を設けたりするものは表面処理液や、そ
こから生じるガス（溶剤ガス）の回収性がよい。Invention 4 in which a fixed cover is provided and invention 5 in which an exhaust port and a drain port are provided have good recovery of the surface treatment liquid and the gas (solvent gas) generated therefrom.
発明６において、両面に表面処理をする場合には、ノズ
ル等の処理液供給手段が回転カバーの中央部に干渉する
ので、回転カバーの中央部の円板に回転軸を設けること
ができないが、複数のローラがそれを解決する。In invention 6, when performing surface treatment on both sides, the processing liquid supply means such as a nozzle interferes with the center of the rotating cover, so it is not possible to provide a rotating shaft on the disk at the center of the rotating cover. Multiple rollers solve it.
（実施例〕
第１図は実施例１の縦断面図、第２図は第１図の回転カ
バーの部分斜視図、第３図は実施例２の縦断面図であり
、従来例及び各図と同一符号を付けるものはおよそ同一
機能を持ち、以下では説明を省（こともある。(Example) Fig. 1 is a longitudinal sectional view of Embodiment 1, Fig. 2 is a partial perspective view of the rotating cover of Fig. 1, and Fig. 3 is a longitudinal sectional view of Embodiment 2. Items with the same reference numerals have approximately the same functions, and their explanations may be omitted below.
第１図及び第２図において、磁気記録媒体等の被処理板
１は回転軸２．保持具３を介して電動機４によって回転
駆動される。被処理板１の両面には塗布液等の表面処理
液５を噴出するノズル６が図示しない移動装置で被処理
板の半径方向にトラバースするようになっている。In FIGS. 1 and 2, a processing target plate 1 such as a magnetic recording medium is connected to a rotating shaft 2. It is rotationally driven by an electric motor 4 via a holder 3. Nozzles 6 for ejecting a surface treatment liquid 5 such as a coating liquid are disposed on both sides of the plate 1 to be treated, and are configured to traverse in the radial direction of the plate 1 by means of a moving device (not shown).
被処理板■の外周には、回転カバー８がその外周を３個
のローラ９で回転自在に支持され、このローラ９の１つ
は回転軸２を介して電動機４で駆動される。ローラ２個
で回転カバー８の下方を支持してもよい。そして前記回
転カバー８は多数の孔８ａを設けた板からなり大径部で
接合する一対の円錐台状部からなる。孔８ａを設ける代
りに金網で支持されるフィルタのような多孔質のもので
もよい。A rotating cover 8 is rotatably supported around the outer periphery of the plate to be processed by three rollers 9, one of which is driven by an electric motor 4 via a rotating shaft 2. The lower part of the rotating cover 8 may be supported by two rollers. The rotary cover 8 is made of a plate provided with a large number of holes 8a, and consists of a pair of truncated conical parts joined at a large diameter part. Instead of providing the holes 8a, a porous filter such as a filter supported by a wire mesh may be used.
前記回転カバー８の外周には更に、上方に排気口１０、
下方に排液口１１を設けた固定カバー１２が設けられ、
前記ローラ９の支持もする。The outer periphery of the rotary cover 8 further includes an exhaust port 10 located above.
A fixed cover 12 with a drain port 11 provided at the bottom is provided,
It also supports the roller 9.
このような構造によれば、前記回転カバー８の内側に被
処理板１から振り切られて来て付着した表面処理液５は
、遠心力により回転カバー８の内側から外側に流れ、こ
こから遠心力で振り切られて再び被処理液板１に滴が落
下することがない。According to this structure, the surface treatment liquid 5 that has been shaken off from the plate 1 to be treated and attached to the inside of the rotary cover 8 flows from the inside of the rotary cover 8 to the outside due to centrifugal force, and from there, the surface treatment liquid 5 is absorbed by the centrifugal force. The droplets will not be shaken off and fall onto the liquid plate 1 to be treated again.
多孔性であるので表面処理液５の捕捉性がよく、表面処
理液の粘性によっては都合のよい作用を示す。その際、
捕捉された液は中央の大径部に集る傾向があり、捕捉さ
れた表面処理液５の回収性がよい。Since it is porous, it has a good ability to trap the surface treatment liquid 5, and depending on the viscosity of the surface treatment liquid, it exhibits an advantageous effect. that time,
The captured liquid tends to collect in the central large diameter portion, and the captured surface treatment liquid 5 can be easily recovered.
そして表面処理液５は回転する回転カバー８から更に遠
心力で振り切られ固定カバー１２に捕捉され、ガス分は
排気口１０から、液体は排液口１１から排出される。固
定カバー１２の形状によっては滴が回転カバー８に振り
かかるが、被処理板１に及ぶことはない。The surface treatment liquid 5 is further shaken off by the centrifugal force from the rotating cover 8 and captured by the fixed cover 12, and the gas component is discharged from the exhaust port 10 and the liquid is discharged from the drain port 11. Depending on the shape of the fixed cover 12, drops may sprinkle on the rotating cover 8, but they will not reach the plate 1 to be processed.
第３図に示す実施例２において、回転駆動される被処理
板１の外周には、電動機１４で中央円板部１８ａを駆動
される単一な円錐台状の回転カバー１８が設けられる。In the second embodiment shown in FIG. 3, a single truncated conical rotary cover 18 is provided around the outer periphery of the plate 1 to be rotationally driven to be processed, the central disk portion 18a of which is driven by an electric motor 14.
被処理板１は例えば半導体ウェハであって、片面のみが
ノズル６から噴出する純水等の表面処理液５で清浄化さ
れる。なお、回転カバー１８を電動機４で被処理板１と
一体駆動してもよい。The plate 1 to be processed is, for example, a semiconductor wafer, and only one side thereof is cleaned with a surface treatment liquid 5 such as pure water jetted from a nozzle 6 . Note that the rotating cover 18 may be driven integrally with the processing target plate 1 by the electric motor 4.
このような構造によれば、被処理板の面上に施された処
理液が遠心力で被処理板から飛散して回転カバーに付着
すると、回転カバーは円錐台状をしているので、付着し
た液は遠心力で内側の斜面を大径部側へ流れ、大径部か
ら振り切られ、再び被処理板に滴が落下することがない
。処理槽の天井等から落下する滴があっても回転カバー
が被処理板を覆っているので被処理板に落下することが
ない。According to this structure, if the processing liquid applied on the surface of the plate to be processed scatters from the plate due to centrifugal force and adheres to the rotating cover, the rotating cover has a truncated cone shape, so that the liquid will not stick to the plate. The liquid flows down the inner slope toward the large diameter part due to centrifugal force, is shaken off from the large diameter part, and no droplets fall onto the plate to be processed again. Even if there are drops that fall from the ceiling of the processing tank, they will not fall onto the processing board because the rotating cover covers the processing board.
なお表面処理液の性質や被処理板の回転数等によっては
、回転カバー１８を回転させずに固定して被処理板の外
周を囲んでも、その円錐台状のカバーに振り切られて来
る液は急斜面で捕捉されて飛び散ることがなく、また捕
捉された液はそのカバーの上方では大径部から小径部へ
、下方では小径部から大径部へと重力で伝って流れ、下
方から排出することができる。Note that depending on the properties of the surface treatment liquid, the rotation speed of the plate to be treated, etc., even if the rotating cover 18 is fixed without rotating and surrounds the outer periphery of the plate to be treated, the liquid that is shaken off by the truncated conical cover may be It is trapped on a steep slope and does not scatter, and the trapped liquid flows by gravity from the large diameter part to the small diameter part above the cover and from the small diameter part to the large diameter part below, and is discharged from below. I can do it.
この発明群の回転表面処理装置は、
回転駆動される被処理板と、この被処理板の面に表面処
理液を施す処理液供給手段と、前記被処理板の外周に配
置され回転駆動される円錐台状の回転カバーとからなる
ようにしたので、磁気記録媒体や半導体ウェハ等の回転
する被処理板の片面又は両面から飛び散る塗布液や純水
等の表面処理液は、その外周の円錐台状の回転カバーの
内周で捕捉され、滴が再び被処理板に振りかかることが
ないようになり、ノズル等の処理液供給手段で均一に表
面処理された表面状態がそのまま維持されて悪化するこ
とがないという効果がある。The rotary surface treatment apparatus of this group of inventions includes: a plate to be treated that is rotationally driven; a treatment liquid supply means that applies a surface treatment liquid to the surface of the plate to be treated; Since the rotating cover has a truncated cone shape, surface treatment liquid such as coating liquid or pure water that is splashed from one or both sides of a rotating processing target plate such as a magnetic recording medium or a semiconductor wafer is removed from the outer periphery of the truncated cone. The droplets are captured by the inner periphery of the rotating cover, preventing the droplets from being sprinkled onto the plate to be treated again, and the surface condition that has been uniformly treated by the treatment liquid supply means such as the nozzle is maintained, resulting in deterioration. It has the effect of never happening.
表面処理供給手段にはノズル又は刷毛等が使用でき、一
対の円錐台状の多孔性の回転カバーは捕捉した液を内側
から外側へ速に流すので、粘性等、表面処理液の性質に
よっては更に捕捉性が良く表面状態を良好に保つという
効果があり、固定カッ・−やその排気口、排液口は更に
捕捉性を改善する。A nozzle or a brush can be used as the surface treatment supply means, and a pair of truncated cone-shaped porous rotating covers allow the captured liquid to flow quickly from the inside to the outside, so depending on the properties of the surface treatment liquid such as viscosity, It has the effect of keeping the surface condition good with good trapping ability, and the fixed cup, its exhaust port, and drain port further improve the trapping ability.
回転カバーを単一な円錐台状とすれば構造は簡単になる
という効果がある。If the rotating cover has a single truncated conical shape, the structure will be simpler.
第１図は実施例１の縦断面図、第２図は第１図の回転カ
バーの部分斜視図、第３図は実施例２の縦断面図であり
、第４図は従来例の縦断面図である。
■・・・被処理板、５・・・表面処理液、６・・・ノズ
ル、７．１２・・・固定カバー ８．Ｉ８・・・回転カ
バー９・・・ローラ、１０・・・排気口、１１・・・排
液口。
ｆＸＪ１人升理士 山 口 巌
第
図
第
図Fig. 1 is a longitudinal sectional view of the first embodiment, Fig. 2 is a partial perspective view of the rotating cover of Fig. 1, Fig. 3 is a longitudinal sectional view of the second embodiment, and Fig. 4 is a longitudinal sectional view of the conventional example. It is a diagram. ■...Plate to be treated, 5...Surface treatment liquid, 6...Nozzle, 7.12...Fixed cover 8. I8... Rotating cover 9... Roller, 10... Exhaust port, 11... Drain port. fXJ 1 person mathematician Iwao Yamaguchi diagram diagram
Claims (1)
面処理液を施す処理液供給手段と、前記被処理板の外周
に配置され回転駆動される円錐台状の回転カバーとから
なることを特徴とする回転表面処理装置。 ２）請求項１記載の回転表面処理装置において、前記処
理液供給手段をノズル又は刷毛とすることを特徴とする
回転表面処理装置。 ３）請求項１又は２記載の回転表面処理装置において、 前記回転カバーは多孔性の材料からなり大径部で接合す
る一対の円錐台状部からなることを特徴とする回転表面
処理装置。 ４）請求項１、２又は３記載の回転表面処理装置におい
て、 前記回転カバーの外周に固定カバーを設けることを特徴
とする回転表面処理装置。 ５）請求項４記載の回転表面処理装置において、前記固
定カバーの上方に排気口を下方に排液口を設けることを
特徴とする回転表面処理装置。 ６）請求項１、２、３、４又は５記載の回転表面処理装
置において、 前記処理液供給手段を被処理板の両面に配置し、前記回
転カバーの外周を複数のローラで支持して駆動すること
を特徴とする回転表面処理装置。[Scope of Claims] 1) A plate to be treated that is rotationally driven, a treatment liquid supply means that applies a surface treatment liquid to the surface of the plate to be treated, and a truncated cone that is arranged around the outer periphery of the plate to be treated and is driven to rotate. A rotary surface treatment device comprising: a rotary cover shaped like a rotary cover; 2) The rotary surface treatment apparatus according to claim 1, wherein the treatment liquid supply means is a nozzle or a brush. 3) The rotary surface treatment apparatus according to claim 1 or 2, wherein the rotary cover comprises a pair of truncated conical parts made of a porous material and joined at a large diameter part. 4) The rotary surface treatment apparatus according to claim 1, 2 or 3, wherein a fixed cover is provided around the outer periphery of the rotary cover. 5) The rotary surface treatment apparatus according to claim 4, wherein an exhaust port is provided above the fixed cover and a drain port is provided below. 6) The rotary surface treatment apparatus according to claim 1, 2, 3, 4, or 5, wherein the treatment liquid supply means is arranged on both sides of the plate to be treated, and the outer periphery of the rotary cover is supported and driven by a plurality of rollers. A rotary surface treatment device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23930990A JPH04119524A (en) | 1990-09-10 | 1990-09-10 | Rotary surface processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23930990A JPH04119524A (en) | 1990-09-10 | 1990-09-10 | Rotary surface processor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04119524A true JPH04119524A (en) | 1992-04-21 |
Family
ID=17042801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23930990A Pending JPH04119524A (en) | 1990-09-10 | 1990-09-10 | Rotary surface processor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04119524A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5993547A (en) * | 1997-01-09 | 1999-11-30 | Nec Corporation | Edge rinse mechanism for removing a peripheral portion of a resist film formed on a wafer |
| JP2005530605A (en) * | 2002-06-25 | 2005-10-13 | エスイーゼツト・アクチエンゲゼルシヤフト | Apparatus for liquid treatment of disk-like objects |
| JP2010051899A (en) * | 2008-08-28 | 2010-03-11 | Tokyo Ohka Kogyo Co Ltd | Coating device |
| JP2010269263A (en) * | 2009-05-22 | 2010-12-02 | Tokyo Ohka Kogyo Co Ltd | Coating machine and coating method |
| JP2011035380A (en) * | 2009-07-06 | 2011-02-17 | Tokyo Ohka Kogyo Co Ltd | Substrate processing system |
| JP2011035379A (en) * | 2009-07-06 | 2011-02-17 | Tokyo Ohka Kogyo Co Ltd | Coating device and method of managing nozzle |
| CN103077911A (en) * | 2008-08-28 | 2013-05-01 | 东京应化工业株式会社 | Coating device |
| US8567342B2 (en) | 2009-05-22 | 2013-10-29 | Tokyo Ohka Kogyo Co., Ltd. | Coating device and coating method |
| US8919756B2 (en) | 2008-08-28 | 2014-12-30 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device, and coating device |
| US9214372B2 (en) | 2008-08-28 | 2015-12-15 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device and coating device |
| US10892172B2 (en) | 2017-02-06 | 2021-01-12 | Planar Semiconductor, Inc. | Removal of process effluents |
| US10985039B2 (en) | 2017-02-06 | 2021-04-20 | Planar Semiconductor, Inc. | Sub-nanometer-level substrate cleaning mechanism |
| US11069521B2 (en) | 2017-02-06 | 2021-07-20 | Planar Semiconductor, Inc. | Subnanometer-level light-based substrate cleaning mechanism |
-
1990
- 1990-09-10 JP JP23930990A patent/JPH04119524A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5993547A (en) * | 1997-01-09 | 1999-11-30 | Nec Corporation | Edge rinse mechanism for removing a peripheral portion of a resist film formed on a wafer |
| JP2005530605A (en) * | 2002-06-25 | 2005-10-13 | エスイーゼツト・アクチエンゲゼルシヤフト | Apparatus for liquid treatment of disk-like objects |
| US8919756B2 (en) | 2008-08-28 | 2014-12-30 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device, and coating device |
| JP2010051899A (en) * | 2008-08-28 | 2010-03-11 | Tokyo Ohka Kogyo Co Ltd | Coating device |
| US9214372B2 (en) | 2008-08-28 | 2015-12-15 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device and coating device |
| CN103077911A (en) * | 2008-08-28 | 2013-05-01 | 东京应化工业株式会社 | Coating device |
| JP2010269263A (en) * | 2009-05-22 | 2010-12-02 | Tokyo Ohka Kogyo Co Ltd | Coating machine and coating method |
| US8567342B2 (en) | 2009-05-22 | 2013-10-29 | Tokyo Ohka Kogyo Co., Ltd. | Coating device and coating method |
| US8617655B2 (en) | 2009-05-22 | 2013-12-31 | Tokyo Ohka Kogyo Co., Ltd. | Coating device and coating method |
| JP2011035380A (en) * | 2009-07-06 | 2011-02-17 | Tokyo Ohka Kogyo Co Ltd | Substrate processing system |
| US8667924B2 (en) | 2009-07-06 | 2014-03-11 | Tokyo Ohka Kogyo Co., Ltd. | Coating device and nozzle managing method |
| JP2011035379A (en) * | 2009-07-06 | 2011-02-17 | Tokyo Ohka Kogyo Co Ltd | Coating device and method of managing nozzle |
| US10892172B2 (en) | 2017-02-06 | 2021-01-12 | Planar Semiconductor, Inc. | Removal of process effluents |
| US10985039B2 (en) | 2017-02-06 | 2021-04-20 | Planar Semiconductor, Inc. | Sub-nanometer-level substrate cleaning mechanism |
| US11069521B2 (en) | 2017-02-06 | 2021-07-20 | Planar Semiconductor, Inc. | Subnanometer-level light-based substrate cleaning mechanism |
| US11830726B2 (en) | 2017-02-06 | 2023-11-28 | Planar Semiconductor Corporation Pte. Ltd. | Subnanometer-level light-based substrate cleaning mechanism |
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