SG11201405972TA - Additive for preparing suede on polycrystalline silicon chip and use method thereof - Google Patents
Additive for preparing suede on polycrystalline silicon chip and use method thereofInfo
- Publication number
- SG11201405972TA SG11201405972TA SG11201405972TA SG11201405972TA SG11201405972TA SG 11201405972T A SG11201405972T A SG 11201405972TA SG 11201405972T A SG11201405972T A SG 11201405972TA SG 11201405972T A SG11201405972T A SG 11201405972TA SG 11201405972T A SG11201405972T A SG 11201405972TA
- Authority
- SG
- Singapore
- Prior art keywords
- additive
- polycrystalline silicon
- silicon chip
- use method
- preparing suede
- Prior art date
Links
- 239000000654 additive Substances 0.000 title 1
- 230000000996 additive effect Effects 0.000 title 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Photovoltaic Devices (AREA)
- Silicon Compounds (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310394703.2A CN103409808B (en) | 2013-09-04 | 2013-09-04 | Polycrystalline silicon texturing additive and using method thereof |
PCT/CN2013/089693 WO2015032154A1 (en) | 2013-09-04 | 2013-12-17 | Polycrystalline silicon wafer texturizing additive and use thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201405972TA true SG11201405972TA (en) | 2015-04-29 |
Family
ID=49602845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201405972TA SG11201405972TA (en) | 2013-09-04 | 2013-12-17 | Additive for preparing suede on polycrystalline silicon chip and use method thereof |
Country Status (11)
Country | Link |
---|---|
US (1) | US9935233B2 (en) |
EP (1) | EP2891733B1 (en) |
JP (1) | JP2016531835A (en) |
KR (1) | KR101687767B1 (en) |
CN (1) | CN103409808B (en) |
ES (1) | ES2591133T3 (en) |
LT (1) | LT2891733T (en) |
MY (1) | MY170621A (en) |
SG (1) | SG11201405972TA (en) |
TW (1) | TWI526522B (en) |
WO (1) | WO2015032154A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103409808B (en) * | 2013-09-04 | 2015-10-21 | 常州时创能源科技有限公司 | Polycrystalline silicon texturing additive and using method thereof |
CN103668467B (en) * | 2013-12-20 | 2016-08-31 | 常州时创能源科技有限公司 | A kind of polycrystalline silicon texturing additive and application thereof |
CN103696021A (en) * | 2013-12-23 | 2014-04-02 | 泰通(泰州)工业有限公司 | Polycrystalline velvet additive-matched surface treatment technology after felting |
CN104241449A (en) * | 2014-09-18 | 2014-12-24 | 百力达太阳能股份有限公司 | Technology for manufacturing polycrystalline silicon solar cells |
CN104294369A (en) * | 2014-11-13 | 2015-01-21 | 苏州润阳光伏科技有限公司 | Acid texturing additive for polysilicon film and use method thereof |
CN104328504A (en) * | 2014-11-13 | 2015-02-04 | 苏州润阳光伏科技有限公司 | Polycrystal texturing auxiliary and application method thereof |
CN104651949B (en) * | 2015-02-11 | 2017-09-29 | 常州君合科技股份有限公司 | A kind of polycrystalline silicon texturing additive |
CN105040108B (en) * | 2015-08-21 | 2017-11-17 | 浙江启鑫新能源科技股份有限公司 | The etching method of polysilicon solar cell |
CN105304734A (en) * | 2015-11-03 | 2016-02-03 | 苏州旭环光伏科技有限公司 | Polycrystalline silicon wafer texturing auxiliary and application method thereof |
CN108630786A (en) * | 2016-06-27 | 2018-10-09 | 苏州阿特斯阳光电力科技有限公司 | A kind of preparation method of crystal silicon solar energy battery suede structure |
CN106119976B (en) * | 2016-08-19 | 2018-08-14 | 常州时创能源科技有限公司 | Additive and its application of the black silicon making herbs into wool of polycrystalline with reaming acid solution |
CN107177890A (en) * | 2017-06-12 | 2017-09-19 | 通威太阳能(合肥)有限公司 | The etching method and cell piece preparation technology of a kind of Buddha's warrior attendant wire cutting polysilicon chip |
CN107245761B (en) * | 2017-08-10 | 2020-01-14 | 常州时创能源科技有限公司 | Diamond wire polycrystalline silicon slice texturing auxiliary agent and application thereof |
CN109427930B (en) * | 2017-09-04 | 2022-02-25 | 苏州易益新能源科技有限公司 | Method for selectively preparing suede on surface of crystal silicon wafer |
TWI636156B (en) * | 2017-09-08 | 2018-09-21 | 常州時創能源科技有限公司 | Polycrystalline silicon chips velvet auxiliary additive, velvet liquid and method for making velvet |
CN108004597A (en) * | 2017-11-09 | 2018-05-08 | 润峰电力有限公司 | A kind of polysilicon flocking additive and its etching method |
CN108250363B (en) * | 2018-01-19 | 2020-04-10 | 温岭汉德高分子科技有限公司 | Monocrystalline silicon texturing additive |
CN109537058B (en) * | 2018-09-30 | 2021-01-05 | 江苏顺风新能源科技有限公司 | Wet black silicon preparation process |
CN109680337A (en) * | 2018-12-25 | 2019-04-26 | 浙江晶科能源有限公司 | A kind of etching method of Buddha's warrior attendant wire cutting polysilicon |
CN110137079B (en) * | 2019-05-22 | 2021-08-13 | 苏州晶瑞化学股份有限公司 | Diamond wire cutting polycrystalline silicon wafer texturing regulating agent and texturing agent containing regulating agent |
CN113817472B (en) * | 2021-11-23 | 2022-02-11 | 绍兴拓邦电子科技有限公司 | Texturing process of solar cell silicon wafer |
CN114420774A (en) * | 2021-11-29 | 2022-04-29 | 江苏科来材料科技有限公司 | Texturing process of crystalline silicon battery |
CN116004233A (en) * | 2022-12-12 | 2023-04-25 | 嘉兴市小辰光伏科技有限公司 | Etching additive for improving uniformity of textured surface of silicon wafer and use method |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51123739A (en) * | 1975-04-22 | 1976-10-28 | Mitsubishi Electric Corp | Silicon etching process |
US4171242A (en) * | 1976-12-17 | 1979-10-16 | International Business Machines Corporation | Neutral pH silicon etchant for etching silicon in the presence of phosphosilicate glass |
US20020147300A1 (en) * | 2000-12-18 | 2002-10-10 | Hiroshi Matsumoto | Dampening water composition for lithographic printing plate |
JP4159334B2 (en) * | 2002-09-30 | 2008-10-01 | 新日本製鐵株式会社 | Discoloration removal cleaning agent and discoloration removal cleaning method for titanium and titanium alloy building materials |
JP2006130905A (en) * | 2004-10-08 | 2006-05-25 | Fuji Photo Film Co Ltd | Lithographic printing method |
KR20100125448A (en) * | 2008-03-25 | 2010-11-30 | 어플라이드 머티어리얼스, 인코포레이티드 | Surface cleaning texturing process for crystalline solar cells |
CN101735891B (en) * | 2009-12-24 | 2011-11-30 | 浙江向日葵光能科技股份有限公司 | Solar cell silicon slice detergent and method for using same |
JP2012238849A (en) * | 2011-04-21 | 2012-12-06 | Rohm & Haas Electronic Materials Llc | Improved polycrystalline texturing composition and method |
CN102330091B (en) * | 2011-07-27 | 2012-07-04 | 常州时创能源科技有限公司 | Additive for polycrystalline silicon wafer acidity texture preparation liquid and use method thereof |
CN102330154B (en) * | 2011-07-27 | 2012-08-01 | 常州时创能源科技有限公司 | Acidic texturing solution for texturing of polycrystalline silicon chip and using method thereof |
CN102516878B (en) * | 2011-12-12 | 2016-08-03 | 上海新安纳电子科技有限公司 | A kind of polishing fluid improving phase-change material surface of polished quality |
US8986559B2 (en) * | 2012-02-29 | 2015-03-24 | Avantor Performance Materials, Inc. | Compositions and methods for texturing polycrystalline silicon wafers |
CN102586888A (en) * | 2012-03-15 | 2012-07-18 | 苏州先拓光伏科技有限公司 | Non-alcoholic monocrystalline silicon flock making additive |
CN102978710A (en) * | 2012-08-13 | 2013-03-20 | 杭州道乐太阳能技术有限公司 | Silicon solar cell surface light trapping structure and preparation method thereof |
CN102888656B (en) * | 2012-09-28 | 2015-04-08 | 绍兴拓邦电子科技有限公司 | High-boiling point monocrystalline silicon wafer surface texturing additive and using method thereof |
CN102912450B (en) * | 2012-10-22 | 2015-07-01 | 江苏荣马新能源有限公司 | Monocrystalline silicon flocking additive |
CN102888657B (en) * | 2012-10-22 | 2015-04-15 | 江苏荣马新能源有限公司 | Additive for fluffing agent of crystalline silicon solar cell |
CN102943307A (en) * | 2012-11-27 | 2013-02-27 | 韩华新能源(启东)有限公司 | Single crystal silicon alcohol-free wool making additive |
CN103132079B (en) * | 2013-02-07 | 2015-07-08 | 睿纳能源科技(上海)有限公司 | Additive for acid texturing of diamond-wire-cutting polycrystalline silicon slices and application method thereof |
CN103151423B (en) * | 2013-02-28 | 2015-09-16 | 常州捷佳创精密机械有限公司 | A kind of polycrystalline silicon texturing cleaning process |
CN103266355B (en) * | 2013-04-27 | 2016-03-23 | 宁波富星太阳能有限公司 | A kind of etching method of polysilicon chip |
CN103205815A (en) * | 2013-05-03 | 2013-07-17 | 上海交通大学 | Solar energy mono-crystalline silicon piece flocking solution and application method thereof |
CN103258918A (en) * | 2013-05-31 | 2013-08-21 | 英利集团有限公司 | Silicon wafer texturing method, solar battery piece and manufacturing method of solar battery piece |
CN103409808B (en) * | 2013-09-04 | 2015-10-21 | 常州时创能源科技有限公司 | Polycrystalline silicon texturing additive and using method thereof |
-
2013
- 2013-09-04 CN CN201310394703.2A patent/CN103409808B/en active Active
- 2013-12-17 WO PCT/CN2013/089693 patent/WO2015032154A1/en active Application Filing
- 2013-12-17 EP EP13893094.6A patent/EP2891733B1/en not_active Not-in-force
- 2013-12-17 KR KR1020147030500A patent/KR101687767B1/en active IP Right Grant
- 2013-12-17 SG SG11201405972TA patent/SG11201405972TA/en unknown
- 2013-12-17 LT LTEP13893094.6T patent/LT2891733T/en unknown
- 2013-12-17 MY MYPI2014702516A patent/MY170621A/en unknown
- 2013-12-17 JP JP2016539393A patent/JP2016531835A/en active Pending
- 2013-12-17 ES ES13893094.6T patent/ES2591133T3/en active Active
- 2013-12-17 US US14/376,502 patent/US9935233B2/en not_active Expired - Fee Related
- 2013-12-24 TW TW102148008A patent/TWI526522B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US9935233B2 (en) | 2018-04-03 |
CN103409808B (en) | 2015-10-21 |
ES2591133T3 (en) | 2016-11-25 |
KR101687767B1 (en) | 2016-12-19 |
WO2015032154A1 (en) | 2015-03-12 |
MY170621A (en) | 2019-08-21 |
EP2891733B1 (en) | 2016-07-13 |
TW201416418A (en) | 2014-05-01 |
KR20150039128A (en) | 2015-04-09 |
TWI526522B (en) | 2016-03-21 |
US20160247957A1 (en) | 2016-08-25 |
EP2891733A4 (en) | 2015-09-09 |
CN103409808A (en) | 2013-11-27 |
JP2016531835A (en) | 2016-10-13 |
LT2891733T (en) | 2016-10-10 |
EP2891733A1 (en) | 2015-07-08 |
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