SG105478A1 - Semiconductor device and process for producing the same. - Google Patents

Semiconductor device and process for producing the same.

Info

Publication number
SG105478A1
SG105478A1 SG200007620A SG200007620A SG105478A1 SG 105478 A1 SG105478 A1 SG 105478A1 SG 200007620 A SG200007620 A SG 200007620A SG 200007620 A SG200007620 A SG 200007620A SG 105478 A1 SG105478 A1 SG 105478A1
Authority
SG
Singapore
Prior art keywords
producing
same
semiconductor device
semiconductor
Prior art date
Application number
SG200007620A
Other languages
English (en)
Inventor
Hayasaki Yoshiki
Takano Hitoichi
Suzumura Masahiko
Suzuki Yuji
Shirai Yoshifumi
Kishida Takashi
Yoshida Takeshi
Yoshihara Takaaki
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of SG105478A1 publication Critical patent/SG105478A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7816Lateral DMOS transistors, i.e. LDMOS transistors
    • H01L29/7824Lateral DMOS transistors, i.e. LDMOS transistors with a substrate comprising an insulating layer, e.g. SOI-LDMOS transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843Source or drain regions of field-effect devices
    • H01L29/0847Source or drain regions of field-effect devices of field-effect transistors with insulated gate
    • H01L29/0852Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
    • H01L29/0873Drain regions
    • H01L29/0878Impurity concentration or distribution
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66674DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/66681Lateral DMOS transistors, i.e. LDMOS transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • H01L29/78621Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
    • H01L29/78624Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile the source and the drain regions being asymmetrical

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Junction Field-Effect Transistors (AREA)
SG200007620A 1999-12-22 2000-12-22 Semiconductor device and process for producing the same. SG105478A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36491999 1999-12-22

Publications (1)

Publication Number Publication Date
SG105478A1 true SG105478A1 (en) 2004-08-27

Family

ID=18482988

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200007620A SG105478A1 (en) 1999-12-22 2000-12-22 Semiconductor device and process for producing the same.

Country Status (7)

Country Link
US (1) US6448620B2 (zh)
EP (1) EP1111687B1 (zh)
JP (1) JP4106869B2 (zh)
KR (1) KR100412338B1 (zh)
CN (1) CN1220270C (zh)
SG (1) SG105478A1 (zh)
TW (1) TW564557B (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6635544B2 (en) 2001-09-07 2003-10-21 Power Intergrations, Inc. Method of fabricating a high-voltage transistor with a multi-layered extended drain structure
US7786533B2 (en) 2001-09-07 2010-08-31 Power Integrations, Inc. High-voltage vertical transistor with edge termination structure
US7221011B2 (en) * 2001-09-07 2007-05-22 Power Integrations, Inc. High-voltage vertical transistor with a multi-gradient drain doping profile
US20030107050A1 (en) * 2001-12-10 2003-06-12 Koninklijke Philips Electronics N.V. High frequency high voltage silicon-on-insulator device with mask variable inversion channel and method for forming the same
JP3634830B2 (ja) 2002-09-25 2005-03-30 株式会社東芝 電力用半導体素子
CN100388442C (zh) * 2003-05-23 2008-05-14 上海宏力半导体制造有限公司 可改善组件特性的高压组件的制造方法
GB0418573D0 (en) * 2004-08-20 2004-09-22 Koninkl Philips Electronics Nv Semiconductor devices and the manufacture thereof
JP2006202948A (ja) * 2005-01-20 2006-08-03 Toshiba Corp 半導体素子
JP4857590B2 (ja) * 2005-04-19 2012-01-18 サンケン電気株式会社 半導体素子
KR101201496B1 (ko) * 2005-12-23 2012-11-14 매그나칩 반도체 유한회사 수평 확산형 모스 트랜지스터 및 그 제조방법
JP5479671B2 (ja) 2007-09-10 2014-04-23 ローム株式会社 半導体装置
USRE45449E1 (en) * 2007-12-27 2015-04-07 Infineon Technologies Ag Power semiconductor having a lightly doped drift and buffer layer
CN101751595B (zh) * 2008-12-04 2011-12-07 北京中电华大电子设计有限责任公司 一种提高io速度的电路
KR101128694B1 (ko) * 2009-11-17 2012-03-23 매그나칩 반도체 유한회사 반도체 장치
WO2012049872A1 (ja) * 2010-10-15 2012-04-19 三菱電機株式会社 半導体装置およびその製造方法
US8860132B2 (en) * 2011-11-30 2014-10-14 Infineon Technologies Austria Ag Semiconductor device arrangement comprising a semiconductor device with a drift region and a drift control region
TWI467766B (zh) * 2012-08-31 2015-01-01 Nuvoton Technology Corp 金氧半場效電晶體及其製造方法
US9202910B2 (en) * 2013-04-30 2015-12-01 Infineon Technologies Austria Ag Lateral power semiconductor device and method for manufacturing a lateral power semiconductor device
JP6327747B2 (ja) * 2014-04-23 2018-05-23 株式会社 日立パワーデバイス 半導体装置
KR102286014B1 (ko) 2015-11-23 2021-08-06 에스케이하이닉스 시스템아이씨 주식회사 개선된 온저항 및 브레이크다운전압을 갖는 고전압 집적소자
CN107768424B (zh) * 2017-09-11 2021-06-18 西安电子科技大学 一种具有多环电场调制衬底的宽带隙半导体横向超结双扩散晶体管
CN107808902B (zh) * 2017-09-11 2021-06-18 西安电子科技大学 一种具有多环电场调制衬底的宽带隙半导体横向双扩散晶体管
CN107681004B (zh) * 2017-09-11 2021-08-20 西安电子科技大学 一种具有多环电场调制衬底的元素半导体横向双扩散晶体管
CN110690267B (zh) * 2018-07-06 2023-03-24 立锜科技股份有限公司 高压元件及其制造方法
CN111524962B (zh) * 2020-04-29 2022-02-08 电子科技大学 降低高压互连影响的器件结构及制造方法
CN111524964B (zh) * 2020-04-29 2021-09-24 电子科技大学 降低高压互连影响的横向器件及制备方法
CN111524965B (zh) * 2020-04-29 2021-09-24 电子科技大学 降低高压互连影响的横向器件及制备方法
CN111524963B (zh) * 2020-04-29 2021-09-24 电子科技大学 降低高压互连影响的器件结构及制造方法
CN111524966B (zh) * 2020-04-29 2021-08-03 电子科技大学 一种降低高压互连影响的横向高压器件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300448A (en) * 1991-02-01 1994-04-05 North American Philips Corporation High voltage thin film transistor having a linear doping profile and method for making
US5780900A (en) * 1996-01-26 1998-07-14 Matsushita Electric Works, Inc. Thin film silicon-on-insulator transistor having an improved power dissipation, a high break down voltage, and a low on resistance
US5844272A (en) * 1996-07-26 1998-12-01 Telefonaktiebolaet Lm Ericsson Semiconductor component for high voltage

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5246870A (en) 1991-02-01 1993-09-21 North American Philips Corporation Method for making an improved high voltage thin film transistor having a linear doping profile
US5371394A (en) * 1993-11-15 1994-12-06 Motorola, Inc. Double implanted laterally diffused MOS device and method thereof
JPH08181321A (ja) * 1994-12-26 1996-07-12 Matsushita Electric Works Ltd Soi基板及びその製造方法
KR100225411B1 (ko) * 1997-03-24 1999-10-15 김덕중 LDMOS(a lateral double-diffused MOS) 트랜지스터 소자 및 그의 제조 방법
KR100244282B1 (ko) * 1997-08-25 2000-02-01 김영환 고전압 트랜지스터의 구조 및 제조 방법
JP3315356B2 (ja) * 1997-10-15 2002-08-19 株式会社東芝 高耐圧半導体装置
JPH11204786A (ja) * 1998-01-14 1999-07-30 Mitsubishi Electric Corp 高耐圧絶縁ゲート型電界効果トランジスタを有する半導体装置およびその製造方法
JP2000332247A (ja) * 1999-03-15 2000-11-30 Toshiba Corp 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300448A (en) * 1991-02-01 1994-04-05 North American Philips Corporation High voltage thin film transistor having a linear doping profile and method for making
US5780900A (en) * 1996-01-26 1998-07-14 Matsushita Electric Works, Inc. Thin film silicon-on-insulator transistor having an improved power dissipation, a high break down voltage, and a low on resistance
US5844272A (en) * 1996-07-26 1998-12-01 Telefonaktiebolaet Lm Ericsson Semiconductor component for high voltage

Also Published As

Publication number Publication date
KR20010062630A (ko) 2001-07-07
US20010013624A1 (en) 2001-08-16
CN1220270C (zh) 2005-09-21
EP1111687A2 (en) 2001-06-27
JP4106869B2 (ja) 2008-06-25
EP1111687B1 (en) 2011-06-22
TW564557B (en) 2003-12-01
CN1301044A (zh) 2001-06-27
EP1111687A3 (en) 2005-07-06
US6448620B2 (en) 2002-09-10
KR100412338B1 (ko) 2003-12-31
JP2001244472A (ja) 2001-09-07

Similar Documents

Publication Publication Date Title
SG105478A1 (en) Semiconductor device and process for producing the same.
GB2353404B (en) Semiconductor device and method for manufacturing the same
EP1120818A4 (en) SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR DEVICE COMPRISING SUCH A SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME
HK1029443A1 (en) Semiconductor device.
TWI315741B (en) A-isomaltosyltransferase, process for producing the same and use thereof
PL351148A1 (en) 5-pyridyl-1,3-azole compounds, process for producing the same and use thereof
EP1037272A4 (en) SILICON ON ISOLATOR (SOI) SUBSTRATE AND SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
ZA974261B (en) Photovoltaic device and process for the production thereof.
HK1038439A1 (zh) 半導體器件及其制造方法
SG54470A1 (en) Semiconductor device and process for manufacturing the same
EP1146555A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
EP1122769A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
HK1037425A1 (en) Method for manufacturing semiconductor device.
EP1173885A4 (en) DOUBLE PROCESS SEMICONDUCTOR HETEROSTRUCTURES AND METHODS
AU2001287141A1 (en) Semiconductor device and process for forming the same
EP0862222A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
SG82695A1 (en) Process for producing semiconductor device and semiconductor device produced thereby
HK1053012A1 (en) Semiconductor device and forming method thereof
EP1262509A4 (en) IMIDE-BENZOXAZOLE POLYCONDENSATE AND PROCESS FOR PRODUCING THE SAME
SG77707A1 (en) Semiconductor device and method for manufacturing the same
AU2001276981A1 (en) Semiconductor device and a process for forming the same
EP1261040A4 (en) SEMICONDUCTOR ARRANGEMENT AND ITS MANUFACTURING METHOD
SG98005A1 (en) Semiconductor device and process therefor
AU2001257346A1 (en) Semiconductor device and method for manufacturing the same
EP1081769A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME