SE8501172L - Sett att inkapsla pa ett berarband monterade halvledarkomponenter - Google Patents

Sett att inkapsla pa ett berarband monterade halvledarkomponenter

Info

Publication number
SE8501172L
SE8501172L SE8501172A SE8501172A SE8501172L SE 8501172 L SE8501172 L SE 8501172L SE 8501172 A SE8501172 A SE 8501172A SE 8501172 A SE8501172 A SE 8501172A SE 8501172 L SE8501172 L SE 8501172L
Authority
SE
Sweden
Prior art keywords
tape
polymer
way
encapsulating
carrier tape
Prior art date
Application number
SE8501172A
Other languages
Unknown language ( )
English (en)
Other versions
SE466473B (sv
SE8501172D0 (sv
Inventor
S Pienimaa
Original Assignee
Lohja Ab Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lohja Ab Oy filed Critical Lohja Ab Oy
Publication of SE8501172D0 publication Critical patent/SE8501172D0/sv
Publication of SE8501172L publication Critical patent/SE8501172L/sv
Publication of SE466473B publication Critical patent/SE466473B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
SE8501172A 1984-03-09 1985-03-08 Saett att inkapsla elektroniska komponenter, som aer monterade paa ett baerarband SE466473B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI840981A FI72409C (sv) 1984-03-09 1984-03-09 Förfarande för inkapsling av på en bärremsa anordnade halvledarkompone nter.

Publications (3)

Publication Number Publication Date
SE8501172D0 SE8501172D0 (sv) 1985-03-08
SE8501172L true SE8501172L (sv) 1985-09-10
SE466473B SE466473B (sv) 1992-02-17

Family

ID=8518705

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8501172A SE466473B (sv) 1984-03-09 1985-03-08 Saett att inkapsla elektroniska komponenter, som aer monterade paa ett baerarband

Country Status (8)

Country Link
US (1) US4711688A (sv)
BE (1) BE901890A (sv)
CH (1) CH668526A5 (sv)
DE (1) DE3508385A1 (sv)
FI (1) FI72409C (sv)
FR (1) FR2561040B1 (sv)
GB (1) GB2155688B (sv)
SE (1) SE466473B (sv)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI76220C (sv) * 1984-09-17 1988-09-09 Elkotrade Ag Förfarande för inkapsling av på ett bärarband anordnade halvledarkompo nenter
US4754544A (en) * 1985-01-30 1988-07-05 Energy Conversion Devices, Inc. Extremely lightweight, flexible semiconductor device arrays
US5144412A (en) * 1987-02-19 1992-09-01 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
US4965227A (en) * 1987-05-21 1990-10-23 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
DE3731787C2 (de) * 1987-09-22 2000-11-16 Aeg Ges Moderne Inf Sys Mbh Anordnung von mehreren IC's auf einem Bandstreifen aus Isoliermaterial
WO1989004552A1 (en) * 1987-10-30 1989-05-18 Lsi Logic Corporation Method and means of fabricating a semiconductor device package
JPH0322543A (ja) * 1989-06-05 1991-01-30 Siemens Ag 電子デバイスの被覆方法及び装置
US5344600A (en) * 1989-06-07 1994-09-06 Motorola, Inc. Method for encapsulating semiconductor devices with package bodies
US5218759A (en) * 1991-03-18 1993-06-15 Motorola, Inc. Method of making a transfer molded semiconductor device
DE4116321A1 (de) * 1991-05-16 1991-11-28 Ermic Gmbh Verfahren zur selektiven haeusung von sensor-halbleiterbauelementen in chip-on -boardtechnik
US5478517A (en) * 1994-02-28 1995-12-26 Gennum Corporation Method for molding IC chips
US5583370A (en) * 1994-03-04 1996-12-10 Motorola Inc. Tab semiconductor device having die edge protection and method for making the same
DE9413550U1 (de) * 1994-08-23 1996-01-11 Dylec Ltd., Saint Peter Port, Guernsey Halbleiteranordnung mit wenigstens einem Halbleiterbauelement
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor
US7030504B2 (en) * 2003-05-30 2006-04-18 Asm Technology Singapore Pte Ltd. Sectional molding system
KR101633785B1 (ko) * 2014-07-24 2016-06-27 스테코 주식회사 Tcp/cof 패키지 인라인 경화장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2969300A (en) * 1956-03-29 1961-01-24 Bell Telephone Labor Inc Process for making printed circuits
US3754070A (en) * 1970-08-03 1973-08-21 Motorola Inc Flash free molding
US4079509A (en) * 1972-01-29 1978-03-21 Ferranti Limited Method of manufacturing semi-conductor devices
US4143456A (en) * 1976-06-28 1979-03-13 Citizen Watch Commpany Ltd. Semiconductor device insulation method
US4069931A (en) * 1976-09-30 1978-01-24 Saylors James P Capacitor removal device and method
FR2404992A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats
US4238528A (en) * 1978-06-26 1980-12-09 International Business Machines Corporation Polyimide coating process and material
FR2438339A1 (fr) * 1978-10-05 1980-04-30 Suisse Horlogerie Liaison electrique d'un circuit integre
US4374080A (en) * 1981-01-13 1983-02-15 Indy Electronics, Inc. Method and apparatus for encapsulation casting
JPS5887834A (ja) * 1981-11-20 1983-05-25 Ricoh Elemex Corp 半導体装置の樹脂封止方法
FR2524707B1 (fr) * 1982-04-01 1985-05-31 Cit Alcatel Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus
JPS58204547A (ja) * 1982-05-25 1983-11-29 Citizen Watch Co Ltd Ｉｃの封止方法

Also Published As

Publication number Publication date
FR2561040A1 (fr) 1985-09-13
FI840981A (fi) 1985-09-10
GB2155688B (en) 1987-12-23
SE466473B (sv) 1992-02-17
FI840981A0 (fi) 1984-03-09
CH668526A5 (de) 1988-12-30
GB8506111D0 (en) 1985-04-11
US4711688A (en) 1987-12-08
BE901890A (fr) 1985-07-01
FR2561040B1 (fr) 1989-04-28
SE8501172D0 (sv) 1985-03-08
DE3508385A1 (de) 1985-09-26
FI72409B (fi) 1987-01-30
GB2155688A (en) 1985-09-25
FI72409C (sv) 1987-05-11

Similar Documents

Publication Publication Date Title
SE8501172L (sv) Sett att inkapsla pa ett berarband monterade halvledarkomponenter
SG44626A1 (en) Method of bonding circuir boards
DE69414338D1 (de) Behandlung von nahrungsmitteln durch infrarotstrahlung
IT8319669A0 (it) Dispositivo fermapedale per calzature da ciclismo.
SE8504295D0 (sv) Sett att inkapsla pa ett berarband monterade halvledarekomponenter
KR900002087B1 (en) Semiconductor intergruted circuit device
TW328631B (en) Susceptor, apparatus of heat-treating semiconductor wafer, and method of heat-treating the same
GB8311831D0 (en) Apparatus for heat treating semiconductor wafer
SE9500546L (sv) Sätt och anordning för att torka ett fuktigt skikt med hjälp av mikrovågor
DK67683D0 (da) Fremgangsmade til fremstilling af 2,3-diaryl-5-halogen-thio-phener
JPS56166950A (en) Device for drying or heating and crushing treating granular substance
SE8100788L (sv) Torkanleggning (uv-stralar)
SE8406122D0 (sv) Polymerbelagt tygskikt, produkt utnyttjande skiktet, samt sett att framstella detsamma
CS632787A2 (en) Device for heat treatment,esp. drying of leather and similar materials
JPS5411696A (en) Sealing method of electronic components
CA1213988A (en) Method for encapsulating semiconductor components mounted on a carrier tape
JPS5753933A (ja) Handotaisoshinoseizohoho
NO813304L (no) Fremgangsmaate for behandling av poroese, jernholdige partikler, spesielt jernsvamp
GB1426122A (en) Method and apparatus for bonding a brake lining to a brake shoe
ES280058Y (es) Dispositivo calefactor de pastillas que contienen substancias evaporables y volatiles
JPS5340272A (en) Apparatus for diffusing semiconductor substrate
JPS5650544A (en) Resin sealing structure for ic
JPS51126068A (en) Manufacturing method of semi-conductor equipment
JPS6388726A (ja) ケ−ス密封型電気機器のシ−ル方法
JPS57104231A (en) Attaching method of dice

Legal Events

Date Code Title Description
NAV Patent application has lapsed

Ref document number: 8501172-4

Effective date: 19921001

Format of ref document f/p: F