CA1213988A - Method for encapsulating semiconductor components mounted on a carrier tape - Google Patents
Method for encapsulating semiconductor components mounted on a carrier tapeInfo
- Publication number
- CA1213988A CA1213988A CA000476422A CA476422A CA1213988A CA 1213988 A CA1213988 A CA 1213988A CA 000476422 A CA000476422 A CA 000476422A CA 476422 A CA476422 A CA 476422A CA 1213988 A CA1213988 A CA 1213988A
- Authority
- CA
- Canada
- Prior art keywords
- tape
- polymer
- encapsulating
- carrier tape
- onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
Abstract of the Disclosure In the present publication a method is described for encap-sulating of components (3), in particular of semiconductor components, mounted on a carrier tape (6) by means of a po-lymer in order to prevent access of moisture into the compo-nent (3). According to the invention a polymer film (24, 25) is pressed onto the support area (2) of each component (3) from both sides of the carrier tape (6), and the carrier tape (6) treated in this way is subjected to warm-air blas-ting (14). Thereupon, an encapsulating tape (9) that has been moistened with polymer (13) and subjected to a warm-air treatment (15) is connected to one side of the carrier tape (6), and the combination tape (6, 9) in this way obtained is heated in a pre-heating oven (16). Hereupon, encapsulating polymer (26) is spread by means of a dispensing and sprea-ding device (17, 18), onto the face of the component (3) and then onto its ILB area (19), and the combination tape (6, 9) in this way treated is heated in an oven zone (20) in order to harden the polymer. Finally, the encapsulatig tape (9) is detached from the carrier tape (6) now containing the en-capsulated components (3).
(Fig. 5)
(Fig. 5)
Description
Method for encapsulating semiconductor components mounted on a carrier tape The present invention concerns a method in accordance with the preamble of claim l for encapsulating semiconductor components mounted on a carrier tape.
Owing to an increased packaging density in electronics, owing to defects noteced in wire-bonded components encapsu-lated by ~eans of a polymer, and owing to the requirements on automation, a carrier-tape technique known per se (Tape Automated Bonding) has been developed. Normally, in the met-hods for automatic setting and handling of components, unprotected semiccnductor components mounted on a carrier tape are used. The unprotected components are subject to en-viromental effects and mechanical damage in connection with the handling of the components or of the products including components. This is why it is necessary to encapsulate the semiconductor components on the tape so that the tape and the components can be used in automatic machines, just like uncapsulated components can.
In the methods of protection of carrier-tape components known in prior art, only the face of the semiconductor piece is protected, as disclosed, e.g., in the publication GB A
Owing to an increased packaging density in electronics, owing to defects noteced in wire-bonded components encapsu-lated by ~eans of a polymer, and owing to the requirements on automation, a carrier-tape technique known per se (Tape Automated Bonding) has been developed. Normally, in the met-hods for automatic setting and handling of components, unprotected semiccnductor components mounted on a carrier tape are used. The unprotected components are subject to en-viromental effects and mechanical damage in connection with the handling of the components or of the products including components. This is why it is necessary to encapsulate the semiconductor components on the tape so that the tape and the components can be used in automatic machines, just like uncapsulated components can.
In the methods of protection of carrier-tape components known in prior art, only the face of the semiconductor piece is protected, as disclosed, e.g., in the publication GB A
2,009,504 (H 01 L 21/94), or the semiconductor piece and the conductors extending frorn same are protected, so that the component is difficult to handle in automatic setting machines.
It is an object of the present invention to provide a more practical method for the encapsulation of components mounted on a tape.
The invention is based on the idea that each component and the conductors extending from the component are protected by means of the encapsulation polymer up to a desired distance ~ ~Sd ~
from the component. In the method, the polymer is spread by means of a dispenser device onto the semiconductor componentr The spreading of the encapsulation pol~ner beyond the desired area is prevented by using agents that reduce the surface energy, and an encapsulation tape.
In the method in accordance with the present invention, the spreading of the encapsulating polymer is limited in a cont-rol~ed way. The components encapsulated in accordance with the method are easy to handle, because the encapsulating po-lymer does not contaminate th~ support area functioning as an aligning and handling plane while, however, protecting the conductors extending from it towards the component, which is a great advantage owing to the protection from moisture offered thereby, in particular in the case of high-voltage components. Components encapsulated by means of this method can be used in the same way as surface connection components after the connecting conductors of the component have been bent.
The use of a fluoropolymer of low surface ener~y in order to limit the spreading of the encapsulating polymer is known per se, e.g., from the publication SE B 11 401,056 (H 01 L
21/56), wherein it is used in the drop protection of a semi-conductor wire-connected onto a substrate. In the present invention, the large moistening angle due to the low surface energy, and a suitable encapsulating tape have been applied for the preparation of an encapsulation of specified shape and dimension for carrier-tape components before their connection to the component plate.
More specifically, the method in accordance with the inven-tion is characterized by what is stated in the character-izing part of claim 1.
By means of the method in accordance with the invention, it is possible to prevent access of moisture into the component in a highly efficient manner.
The invention will be examined in the following in more de-tail by means of the exemplifying embodiment in accordance with the attached drawings.
Figure la shows an encapsulated component as viewed from above.
Figure lb is sectional view of the component of Figure la, taken along the line A-A.
Figure 2 is a sectional view of an apparatus for the application of the polymer film limiting the spreading of the encapsulation polymerO
Figure 3a shows a component being encapsulated, as viewed from above.
Figure 3b is a sectional view of the component of Figure 3a, taken along the line B-B.
Figure 4 is a sectional view of a final component.
Figure 5 shows one embodiment of the method in accordance with the invention as an operating diagram.
By means of the encapsulating polymer coating 1, the area 19 inside the annular support area 2 of the carrier tape 6 tthe so-called ILB area) is protected. This area 2 comprises the TAB (Tape Automatic Bonding) component 3 and its connecting conductors. The encapsulating method comprises nine steps Pl to P9 (Fig. 5) as follows:
Into the encapsulating apparatus, a TAB or carrier tape reel 5 is inserted, the carrier tape 6 is taken off the reel, and the carrier tape 6 is fed forwards, and the spacer tape 7 is removed. The carrier tape 6 may be made of, eg., a polyimi-de, a polyester, or glass fibre epoxy. The other reel 8 in the apparatus is provided for the encapsulating tape 9. The .
B
function of the encapsulating tape 9 is to prevent spreading of the polymer to underneath the component 3 and the annular suppor~ area 2. The encapsulating tape 9 moves forwards si-multaneously with the carrier tape 6.
The surface energies of the support area 2 of the carrier tape 6 and of the encapsulating tape 9 must be sufficiently low in order that the encapsulating polymer 26, 13 should not moisten them. This prevents spreading of the polymer 26 to underneath and onto the support area 2. The support area 2 is "stamped" from above and from underneath by means of stamps 10, 11, whose cross-sectional shape is similar to the shape of the annular support area 2 (Fig. 2)o By means of the stamps 10, 11, a polymer film 24, 25 of a low surface energy is pressed on both sides of the support area ~ (fig. 2).
The polymer to be absorbed onto the stamps 10, 11 has been dissolved into the readily volatile solvent. The en-capsulating tape 9 is guided through a basin 12 containing said polymer solution 13, whereby the tape 9 becomes coated with the polymer. Alternatively, it is possible to use a tape whose surface energy is sufficiently low, in which case the tape need not be coated.
The carrier tape 6 and the encapsulating tape 9 pass through a warm-air blast 14, 15. In the warm-air blast 14, 15 the solvent of the polymer used in the preceding step is evapo-rated. The blast 14, 15 also removes any loose paticles possibly present on the semiconductor component 3.
The encapsulating tape 9 is guided to underneath the carrier tape 6 so that it is pressed evenly against the bottom of the semiconductor piece 3. From this step up to step 8, the encapsulating tape 9 is tightly fixed on the bottom of the semiconductor piece 3. The encapsulating tape 9 prevents 5'~
flow of encapsulating polymer 25 to a level lower than the bottom face level of the semiconductor piece 3 (Fig. 3b).
The encapsulating tape 9 and the carrier tape 6 above it are heated in the first oven zone 16. The encapsulating polymer 26 moistens the face of the component 3 better when it is warm.
The encapsulating polymer 26, eOg., epoxy, polyurethane, or silicon, is spread first onto the face of the semiconductor piece 3, thereupon onto the ILB area 19. The dosage of the polymer 26 is carried out by means of a dispenser 17, and the spreadig by shifting the dispensing tip 18 relative the area to he protected~ Some encapsulating materials require preheating in order that they should spread evenly onto the face to be protected. The viscosity of the encapsulating polymer is reduced and its moistening capacity increased if the dispensing tip 18 or the polymer container (not shown) is heated.
The encapsulating polymer 26 is hardened in the second oven zone 20.
The encapsulating tape 9 is removed from underneath the en-capsulated TAB components mounted on the carrier tape 6 onto the reel 21. At this stage, if necessary, a hot air blast 22 is used to heat the encapsulating tape 9. On heating, the tape 9 becomes softer, whereby it becomes detached more readily from the encapsulating TAB components 3.
The carrier tape 6, provided with the encapsulating TAB com-ponents 3, and the spacer tape 7 are passed onto the reel 23 one above the other.
It is an object of the present invention to provide a more practical method for the encapsulation of components mounted on a tape.
The invention is based on the idea that each component and the conductors extending from the component are protected by means of the encapsulation polymer up to a desired distance ~ ~Sd ~
from the component. In the method, the polymer is spread by means of a dispenser device onto the semiconductor componentr The spreading of the encapsulation pol~ner beyond the desired area is prevented by using agents that reduce the surface energy, and an encapsulation tape.
In the method in accordance with the present invention, the spreading of the encapsulating polymer is limited in a cont-rol~ed way. The components encapsulated in accordance with the method are easy to handle, because the encapsulating po-lymer does not contaminate th~ support area functioning as an aligning and handling plane while, however, protecting the conductors extending from it towards the component, which is a great advantage owing to the protection from moisture offered thereby, in particular in the case of high-voltage components. Components encapsulated by means of this method can be used in the same way as surface connection components after the connecting conductors of the component have been bent.
The use of a fluoropolymer of low surface ener~y in order to limit the spreading of the encapsulating polymer is known per se, e.g., from the publication SE B 11 401,056 (H 01 L
21/56), wherein it is used in the drop protection of a semi-conductor wire-connected onto a substrate. In the present invention, the large moistening angle due to the low surface energy, and a suitable encapsulating tape have been applied for the preparation of an encapsulation of specified shape and dimension for carrier-tape components before their connection to the component plate.
More specifically, the method in accordance with the inven-tion is characterized by what is stated in the character-izing part of claim 1.
By means of the method in accordance with the invention, it is possible to prevent access of moisture into the component in a highly efficient manner.
The invention will be examined in the following in more de-tail by means of the exemplifying embodiment in accordance with the attached drawings.
Figure la shows an encapsulated component as viewed from above.
Figure lb is sectional view of the component of Figure la, taken along the line A-A.
Figure 2 is a sectional view of an apparatus for the application of the polymer film limiting the spreading of the encapsulation polymerO
Figure 3a shows a component being encapsulated, as viewed from above.
Figure 3b is a sectional view of the component of Figure 3a, taken along the line B-B.
Figure 4 is a sectional view of a final component.
Figure 5 shows one embodiment of the method in accordance with the invention as an operating diagram.
By means of the encapsulating polymer coating 1, the area 19 inside the annular support area 2 of the carrier tape 6 tthe so-called ILB area) is protected. This area 2 comprises the TAB (Tape Automatic Bonding) component 3 and its connecting conductors. The encapsulating method comprises nine steps Pl to P9 (Fig. 5) as follows:
Into the encapsulating apparatus, a TAB or carrier tape reel 5 is inserted, the carrier tape 6 is taken off the reel, and the carrier tape 6 is fed forwards, and the spacer tape 7 is removed. The carrier tape 6 may be made of, eg., a polyimi-de, a polyester, or glass fibre epoxy. The other reel 8 in the apparatus is provided for the encapsulating tape 9. The .
B
function of the encapsulating tape 9 is to prevent spreading of the polymer to underneath the component 3 and the annular suppor~ area 2. The encapsulating tape 9 moves forwards si-multaneously with the carrier tape 6.
The surface energies of the support area 2 of the carrier tape 6 and of the encapsulating tape 9 must be sufficiently low in order that the encapsulating polymer 26, 13 should not moisten them. This prevents spreading of the polymer 26 to underneath and onto the support area 2. The support area 2 is "stamped" from above and from underneath by means of stamps 10, 11, whose cross-sectional shape is similar to the shape of the annular support area 2 (Fig. 2)o By means of the stamps 10, 11, a polymer film 24, 25 of a low surface energy is pressed on both sides of the support area ~ (fig. 2).
The polymer to be absorbed onto the stamps 10, 11 has been dissolved into the readily volatile solvent. The en-capsulating tape 9 is guided through a basin 12 containing said polymer solution 13, whereby the tape 9 becomes coated with the polymer. Alternatively, it is possible to use a tape whose surface energy is sufficiently low, in which case the tape need not be coated.
The carrier tape 6 and the encapsulating tape 9 pass through a warm-air blast 14, 15. In the warm-air blast 14, 15 the solvent of the polymer used in the preceding step is evapo-rated. The blast 14, 15 also removes any loose paticles possibly present on the semiconductor component 3.
The encapsulating tape 9 is guided to underneath the carrier tape 6 so that it is pressed evenly against the bottom of the semiconductor piece 3. From this step up to step 8, the encapsulating tape 9 is tightly fixed on the bottom of the semiconductor piece 3. The encapsulating tape 9 prevents 5'~
flow of encapsulating polymer 25 to a level lower than the bottom face level of the semiconductor piece 3 (Fig. 3b).
The encapsulating tape 9 and the carrier tape 6 above it are heated in the first oven zone 16. The encapsulating polymer 26 moistens the face of the component 3 better when it is warm.
The encapsulating polymer 26, eOg., epoxy, polyurethane, or silicon, is spread first onto the face of the semiconductor piece 3, thereupon onto the ILB area 19. The dosage of the polymer 26 is carried out by means of a dispenser 17, and the spreadig by shifting the dispensing tip 18 relative the area to he protected~ Some encapsulating materials require preheating in order that they should spread evenly onto the face to be protected. The viscosity of the encapsulating polymer is reduced and its moistening capacity increased if the dispensing tip 18 or the polymer container (not shown) is heated.
The encapsulating polymer 26 is hardened in the second oven zone 20.
The encapsulating tape 9 is removed from underneath the en-capsulated TAB components mounted on the carrier tape 6 onto the reel 21. At this stage, if necessary, a hot air blast 22 is used to heat the encapsulating tape 9. On heating, the tape 9 becomes softer, whereby it becomes detached more readily from the encapsulating TAB components 3.
The carrier tape 6, provided with the encapsulating TAB com-ponents 3, and the spacer tape 7 are passed onto the reel 23 one above the other.
Claims (7)
1. Method for encapsulating electronic components (3), e.g., semiconductor components, mounted on a carrier tape (6) and provided with an annular support area (2) by means of a polymer (26), c h a r a c t e r i z e d in that - onto the support area (2) of each component (3) a mixture of a solvent and of a polymer of low sur-face energy is pressed from both sides of the carrier tape (6), which mixture prevents spreading of the encapsulating polymer (261, - the carrier tape (6) treated in this way is sub-jected to warm-air blasting (14), during which the solvent evaporates such that polymer films (24, 25) of low surface energy remain on both si-des of the support area (2), - an encapsulating tape (9) which has been moistened with polymer (13) of low surface energy and dried by means of warm-air treatment (15) is connected to the bottom side of the carrier tape (S), - the combination tape (6, 9) obtained in this way is heated in a first heating zone (16), - encapsulating polymer (26) is spread onto the face of the component (3) and onto an/area (19) defined by the support area (2) by means of a dispensing and spreading device (17, 18), - the combination tape (6, 9) treated in this way is heated in a second heating zone (20) in order to harden the polymer (26, 13), whereupon - the encapsulating tape (9) is detached from the carrier tape (6) now containing the encapsulated components (3).
2. Method as claimed in Claim 1, c h a r a c t e r-i z e d in that hot-air blasting (22) is used for detaching the encapsulating tape (9).
3. Method as claimed in Claim 1, c h a r a c t e r-i z e d in that the pressing of the polymer films (24, 25) onto the support area (2) of each component (3) is carried out by means of stamps (10, 11) shaped equal to the support area (2) and presisng the support area (2) from both sides.
4. Method as claimed in Claim 1, c h a r a c t e r-i z e d in that the encapsulating tape (9) is moistened by making it pass through a polymer basin (12).
5. Method as claimed in Claim 1, c h a r a c t e r-i z e d in that the carrier tape (6) and the encapsulating tape (9) are combined with each other by guiding the encap-sulating tape (9) to underneath the carrier tape (6) so that it is pressed evenly against the bottom of the semiconductor piece (3).
6. Method as claimed in Claim 1, c h a r a c t e r-i z e d in that a polymer film is pressed onto the conduc-tors (4) extending from the semiconductor piece (3) by means of a stamp (10, 11) of desired shape.
7. Method as claimed in Claim 1, c h a r a c t e r-i z e d in that the solvent is an organic solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000476422A CA1213988A (en) | 1985-03-13 | 1985-03-13 | Method for encapsulating semiconductor components mounted on a carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000476422A CA1213988A (en) | 1985-03-13 | 1985-03-13 | Method for encapsulating semiconductor components mounted on a carrier tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1213988A true CA1213988A (en) | 1986-11-12 |
Family
ID=4130012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000476422A Expired CA1213988A (en) | 1985-03-13 | 1985-03-13 | Method for encapsulating semiconductor components mounted on a carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1213988A (en) |
-
1985
- 1985-03-13 CA CA000476422A patent/CA1213988A/en not_active Expired
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |