FI840981A0 - Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter - Google Patents

Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter

Info

Publication number
FI840981A0
FI840981A0 FI840981A FI840981A FI840981A0 FI 840981 A0 FI840981 A0 FI 840981A0 FI 840981 A FI840981 A FI 840981A FI 840981 A FI840981 A FI 840981A FI 840981 A0 FI840981 A0 FI 840981A0
Authority
FI
Finland
Prior art keywords
inkapsling
halvledark
componenter
baerremsa
anordnade
Prior art date
Application number
FI840981A
Other languages
English (en)
Other versions
FI72409C (fi
FI72409B (fi
FI840981A (fi
Inventor
Seppo Pienimaa
Original Assignee
Lohja Ab Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lohja Ab Oy filed Critical Lohja Ab Oy
Publication of FI840981A0 publication Critical patent/FI840981A0/fi
Priority to FI840981A priority Critical patent/FI72409C/fi
Priority to US06/708,785 priority patent/US4711688A/en
Priority to BE0/214612A priority patent/BE901890A/fr
Priority to DE19853508385 priority patent/DE3508385A1/de
Priority to SE8501172A priority patent/SE466473B/sv
Priority to FR858503434A priority patent/FR2561040B1/fr
Priority to CH1071/85A priority patent/CH668526A5/de
Priority to GB08506111A priority patent/GB2155688B/en
Publication of FI840981A publication Critical patent/FI840981A/fi
Application granted granted Critical
Publication of FI72409B publication Critical patent/FI72409B/fi
Publication of FI72409C publication Critical patent/FI72409C/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
FI840981A 1984-03-09 1984-03-09 Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter. FI72409C (fi)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI840981A FI72409C (fi) 1984-03-09 1984-03-09 Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter.
US06/708,785 US4711688A (en) 1984-03-09 1985-03-06 Method for encapsulating semiconductor components mounted on a carrier tape
BE0/214612A BE901890A (fr) 1984-03-09 1985-03-07 Procede d'encapsulation de composants semiconducteurs sur un ruban de support.
SE8501172A SE466473B (sv) 1984-03-09 1985-03-08 Saett att inkapsla elektroniska komponenter, som aer monterade paa ett baerarband
DE19853508385 DE3508385A1 (de) 1984-03-09 1985-03-08 Verfahren zum einkapseln von halbleiter-bauelementen, die auf einem traegerband angeordnet sind
FR858503434A FR2561040B1 (fr) 1984-03-09 1985-03-08 Procede d'encapsulage de composants electroniques, montes sur une bande porteuse
CH1071/85A CH668526A5 (de) 1984-03-09 1985-03-08 Verfahren zur verkapselung von auf einem traegerband montierten halbleiterkomponenten.
GB08506111A GB2155688B (en) 1984-03-09 1985-03-08 Method for encapsulating semiconductor components mounted on a carrier tape

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI840981 1984-03-09
FI840981A FI72409C (fi) 1984-03-09 1984-03-09 Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter.

Publications (4)

Publication Number Publication Date
FI840981A0 true FI840981A0 (fi) 1984-03-09
FI840981A FI840981A (fi) 1985-09-10
FI72409B FI72409B (fi) 1987-01-30
FI72409C FI72409C (fi) 1987-05-11

Family

ID=8518705

Family Applications (1)

Application Number Title Priority Date Filing Date
FI840981A FI72409C (fi) 1984-03-09 1984-03-09 Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter.

Country Status (8)

Country Link
US (1) US4711688A (fi)
BE (1) BE901890A (fi)
CH (1) CH668526A5 (fi)
DE (1) DE3508385A1 (fi)
FI (1) FI72409C (fi)
FR (1) FR2561040B1 (fi)
GB (1) GB2155688B (fi)
SE (1) SE466473B (fi)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI76220C (fi) * 1984-09-17 1988-09-09 Elkotrade Ag Foerfarande foer inkapsling av pao ett baerarband anordnade halvledarkomponenter.
US4754544A (en) * 1985-01-30 1988-07-05 Energy Conversion Devices, Inc. Extremely lightweight, flexible semiconductor device arrays
US5144412A (en) * 1987-02-19 1992-09-01 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
US4965227A (en) * 1987-05-21 1990-10-23 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
DE3731787C2 (de) * 1987-09-22 2000-11-16 Aeg Ges Moderne Inf Sys Mbh Anordnung von mehreren IC's auf einem Bandstreifen aus Isoliermaterial
KR920008256B1 (ko) * 1987-10-30 1992-09-25 엘에스아이 로직 코포레이션 반도체 장치 패키지의 제조방법 및 장치
JPH0322543A (ja) * 1989-06-05 1991-01-30 Siemens Ag 電子デバイスの被覆方法及び装置
US5344600A (en) * 1989-06-07 1994-09-06 Motorola, Inc. Method for encapsulating semiconductor devices with package bodies
US5218759A (en) * 1991-03-18 1993-06-15 Motorola, Inc. Method of making a transfer molded semiconductor device
DE4116321A1 (de) * 1991-05-16 1991-11-28 Ermic Gmbh Verfahren zur selektiven haeusung von sensor-halbleiterbauelementen in chip-on -boardtechnik
US5478517A (en) * 1994-02-28 1995-12-26 Gennum Corporation Method for molding IC chips
US5583370A (en) * 1994-03-04 1996-12-10 Motorola Inc. Tab semiconductor device having die edge protection and method for making the same
DE9413550U1 (de) * 1994-08-23 1996-01-11 Dylec Ltd Halbleiteranordnung mit wenigstens einem Halbleiterbauelement
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor
US7030504B2 (en) * 2003-05-30 2006-04-18 Asm Technology Singapore Pte Ltd. Sectional molding system
KR101633785B1 (ko) * 2014-07-24 2016-06-27 스테코 주식회사 Tcp/cof 패키지 인라인 경화장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2969300A (en) * 1956-03-29 1961-01-24 Bell Telephone Labor Inc Process for making printed circuits
US3754070A (en) * 1970-08-03 1973-08-21 Motorola Inc Flash free molding
US4079509A (en) * 1972-01-29 1978-03-21 Ferranti Limited Method of manufacturing semi-conductor devices
US4143456A (en) * 1976-06-28 1979-03-13 Citizen Watch Commpany Ltd. Semiconductor device insulation method
US4069931A (en) * 1976-09-30 1978-01-24 Saylors James P Capacitor removal device and method
FR2404992A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats
US4238528A (en) * 1978-06-26 1980-12-09 International Business Machines Corporation Polyimide coating process and material
FR2438339A1 (fr) * 1978-10-05 1980-04-30 Suisse Horlogerie Liaison electrique d'un circuit integre
US4374080A (en) * 1981-01-13 1983-02-15 Indy Electronics, Inc. Method and apparatus for encapsulation casting
JPS5887834A (ja) * 1981-11-20 1983-05-25 Ricoh Elemex Corp 半導体装置の樹脂封止方法
FR2524707B1 (fr) * 1982-04-01 1985-05-31 Cit Alcatel Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus
JPS58204547A (ja) * 1982-05-25 1983-11-29 Citizen Watch Co Ltd Ｉｃの封止方法

Also Published As

Publication number Publication date
CH668526A5 (de) 1988-12-30
GB2155688A (en) 1985-09-25
FR2561040B1 (fr) 1989-04-28
GB8506111D0 (en) 1985-04-11
SE8501172L (sv) 1985-09-10
BE901890A (fr) 1985-07-01
FI72409C (fi) 1987-05-11
US4711688A (en) 1987-12-08
SE466473B (sv) 1992-02-17
FR2561040A1 (fr) 1985-09-13
FI72409B (fi) 1987-01-30
GB2155688B (en) 1987-12-23
SE8501172D0 (sv) 1985-03-08
DE3508385A1 (de) 1985-09-26
FI840981A (fi) 1985-09-10

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Legal Events

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MM Patent lapsed
MM Patent lapsed

Owner name: ELKOTRADE AG