NO328157B1 - Fremgangsmate for frembringelse av tredimensjonalt anordnede lednings- og forbindelsesstrukturer for volum- og energistrommer - Google Patents
Fremgangsmate for frembringelse av tredimensjonalt anordnede lednings- og forbindelsesstrukturer for volum- og energistrommer Download PDFInfo
- Publication number
- NO328157B1 NO328157B1 NO20014209A NO20014209A NO328157B1 NO 328157 B1 NO328157 B1 NO 328157B1 NO 20014209 A NO20014209 A NO 20014209A NO 20014209 A NO20014209 A NO 20014209A NO 328157 B1 NO328157 B1 NO 328157B1
- Authority
- NO
- Norway
- Prior art keywords
- layer
- structured
- chemical
- light
- liquid
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 14
- 239000000463 material Substances 0.000 claims description 43
- 239000007788 liquid Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- 230000004071 biological effect Effects 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- 238000011010 flushing procedure Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 3
- 238000002955 isolation Methods 0.000 claims 2
- 239000004837 Ultraviolet (UV) light curing adhesive Substances 0.000 claims 1
- 238000009417 prefabrication Methods 0.000 claims 1
- 230000000295 complement effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 2
- 238000005094 computer simulation Methods 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
- B29L2011/0075—Light guides, optical cables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
- B29L2031/3055—Cars
- B29L2031/3061—Number plates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optical Integrated Circuits (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Moulding By Coating Moulds (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Waveguides (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19964099A DE19964099B4 (de) | 1999-12-31 | 1999-12-31 | Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme |
PCT/DE2000/004393 WO2001050198A2 (de) | 1999-12-31 | 2000-12-08 | Verfahren zur herstellung dreidimensional angeordneter leit- und verbindungsstrukturen für volumen- und energieströme |
Publications (3)
Publication Number | Publication Date |
---|---|
NO20014209D0 NO20014209D0 (no) | 2001-08-30 |
NO20014209L NO20014209L (no) | 2001-10-25 |
NO328157B1 true NO328157B1 (no) | 2009-12-21 |
Family
ID=7935210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20014209A NO328157B1 (no) | 1999-12-31 | 2001-08-30 | Fremgangsmate for frembringelse av tredimensjonalt anordnede lednings- og forbindelsesstrukturer for volum- og energistrommer |
Country Status (13)
Country | Link |
---|---|
US (1) | US6805829B2 (zh) |
EP (1) | EP1196820A2 (zh) |
JP (1) | JP2003519039A (zh) |
KR (1) | KR100652036B1 (zh) |
CN (1) | CN1211197C (zh) |
AU (1) | AU757191B2 (zh) |
CA (1) | CA2362387C (zh) |
DE (1) | DE19964099B4 (zh) |
IS (1) | IS6064A (zh) |
NO (1) | NO328157B1 (zh) |
RU (1) | RU2242063C2 (zh) |
TW (1) | TWI248555B (zh) |
WO (1) | WO2001050198A2 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19964099B4 (de) * | 1999-12-31 | 2006-04-06 | Götzen, Reiner, Dipl.-Ing. | Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme |
DE10102063A1 (de) * | 2001-01-17 | 2002-07-25 | Alpha Technology Ges Fuer Ange | Analysechip mit mehreren funktionalen Ebenen für elektrofokussiertes Spotten |
DE102004013161B4 (de) * | 2004-03-17 | 2008-04-10 | microTec Gesellschaft für Mikrotechnologie mbH | Mikrofluidik-Chip |
DE102006008332B4 (de) * | 2005-07-11 | 2009-06-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit |
US20070074579A1 (en) * | 2005-10-03 | 2007-04-05 | Honeywell International Inc. | Wireless pressure sensor and method of forming same |
DE102009050325B4 (de) * | 2009-10-22 | 2014-03-20 | Amphenol-Tuchel Electronics Gmbh | Kontaktiervorrichtung und Verfahren zur Herstellung einer Kontaktiervorrichtung, Band mit Kontaktiervorrichtungen sowie SIM-Block |
US10828828B2 (en) * | 2016-11-08 | 2020-11-10 | Flex Ltd. | Method of manufacturing a part |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01232024A (ja) * | 1988-03-14 | 1989-09-18 | Mitsui Eng & Shipbuild Co Ltd | 光硬化性樹脂を用いた3次元模型の製造方法 |
DK0500225T3 (da) * | 1991-01-31 | 1996-02-05 | Texas Instruments Inc | System, fremgangsmåde og proces til computerstyret fremstilling af tredimensionale genstande udfra computerdata |
US6175422B1 (en) * | 1991-01-31 | 2001-01-16 | Texas Instruments Incorporated | Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data |
US5173220A (en) | 1991-04-26 | 1992-12-22 | Motorola, Inc. | Method of manufacturing a three-dimensional plastic article |
US5278442A (en) * | 1991-07-15 | 1994-01-11 | Prinz Fritz B | Electronic packages and smart structures formed by thermal spray deposition |
WO1993020993A1 (en) * | 1992-04-15 | 1993-10-28 | Soane Technologies, Inc. | Rapid prototype three-dimensional stereolithography |
US5264061A (en) * | 1992-10-22 | 1993-11-23 | Motorola, Inc. | Method of forming a three-dimensional printed circuit assembly |
US5398193B1 (en) * | 1993-08-20 | 1997-09-16 | Alfredo O Deangelis | Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor |
DE4332982A1 (de) * | 1993-09-28 | 1995-03-30 | Eos Electro Optical Syst | Verfahren und Vorrichtung zum Herstellen eines dreidimensionalen Objekts |
DE4420996C2 (de) * | 1994-06-16 | 1998-04-09 | Reiner Dipl Ing Goetzen | Verfahren und Vorrichtung zur Herstellung von mikromechanischen und mikrooptischen Bauelementen |
US6549821B1 (en) * | 1999-02-26 | 2003-04-15 | Micron Technology, Inc. | Stereolithographic method and apparatus for packaging electronic components and resulting structures |
DE19964099B4 (de) * | 1999-12-31 | 2006-04-06 | Götzen, Reiner, Dipl.-Ing. | Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme |
-
1999
- 1999-12-31 DE DE19964099A patent/DE19964099B4/de not_active Expired - Lifetime
-
2000
- 2000-12-08 AU AU31504/01A patent/AU757191B2/en not_active Ceased
- 2000-12-08 JP JP2001550494A patent/JP2003519039A/ja active Pending
- 2000-12-08 CN CNB008044791A patent/CN1211197C/zh not_active Expired - Fee Related
- 2000-12-08 US US09/914,585 patent/US6805829B2/en not_active Expired - Lifetime
- 2000-12-08 WO PCT/DE2000/004393 patent/WO2001050198A2/de active Application Filing
- 2000-12-08 EP EP00991054A patent/EP1196820A2/de not_active Ceased
- 2000-12-08 CA CA002362387A patent/CA2362387C/en not_active Expired - Fee Related
- 2000-12-08 RU RU2001126395/28A patent/RU2242063C2/ru not_active IP Right Cessation
- 2000-12-08 KR KR1020017010676A patent/KR100652036B1/ko not_active IP Right Cessation
- 2000-12-13 TW TW089126539A patent/TWI248555B/zh not_active IP Right Cessation
-
2001
- 2001-08-28 IS IS6064A patent/IS6064A/is unknown
- 2001-08-30 NO NO20014209A patent/NO328157B1/no not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20010105354A (ko) | 2001-11-28 |
US20020125612A1 (en) | 2002-09-12 |
KR100652036B1 (ko) | 2006-11-30 |
AU757191B2 (en) | 2003-02-06 |
US6805829B2 (en) | 2004-10-19 |
CA2362387C (en) | 2007-09-11 |
EP1196820A2 (de) | 2002-04-17 |
DE19964099B4 (de) | 2006-04-06 |
IS6064A (is) | 2001-08-28 |
DE19964099A1 (de) | 2001-09-13 |
WO2001050198A3 (de) | 2002-01-17 |
CA2362387A1 (en) | 2001-07-12 |
JP2003519039A (ja) | 2003-06-17 |
CN1211197C (zh) | 2005-07-20 |
TWI248555B (en) | 2006-02-01 |
AU3150401A (en) | 2001-07-16 |
RU2242063C2 (ru) | 2004-12-10 |
CN1358131A (zh) | 2002-07-10 |
NO20014209D0 (no) | 2001-08-30 |
WO2001050198A2 (de) | 2001-07-12 |
NO20014209L (no) | 2001-10-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM1K | Lapsed by not paying the annual fees |