EP1196820A2 - Verfahren zur herstellung dreidimensional angeordneter leit- und verbindungsstrukturen für volumen- und energieströme - Google Patents
Verfahren zur herstellung dreidimensional angeordneter leit- und verbindungsstrukturen für volumen- und energieströmeInfo
- Publication number
- EP1196820A2 EP1196820A2 EP00991054A EP00991054A EP1196820A2 EP 1196820 A2 EP1196820 A2 EP 1196820A2 EP 00991054 A EP00991054 A EP 00991054A EP 00991054 A EP00991054 A EP 00991054A EP 1196820 A2 EP1196820 A2 EP 1196820A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- structured
- chemical
- hardening
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
- B29L2011/0075—Light guides, optical cables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
- B29L2031/3055—Cars
- B29L2031/3061—Number plates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
Definitions
- the present invention relates to a method for producing three-dimensionally arranged conductor and connection structures for volume and energy flows.
- the volume flows can be gaseous, liquid, solid or a mixture of these physical states.
- the energy flows can have an acoustic, electrical, magnetic or electromagnetic character.
- volume and energy flows are usually realized today using many different technologies.
- conductor tracks and bond wires are the most frequently used transport routes.
- glass fibers are also used to transport electromagnetic energy.
- Volume flows are realized through ducts, hoses and pipes. With increasing miniaturization, these guidance and connecting elements are very difficult to combine.
- the invention solves the problem by using a structured layered structure.
- Layer construction methods are known from microtechnology.
- DE-PS 44 20 996 describes a method in which a small amount of the light-curable plastic is held between two mutually parallel plates, at least one of which is permeable to electromagnetic waves, due to the surface tension.
- the surface of the plastic liquid below the plate permeable to electromagnetic waves cured by means of a laser beam which is guided over the surface in accordance with a 3-layer model of the structure to be generated which is stored in a connected computer.
- the laser light hardens the plastic liquid according to the 3-D layer model, whereby the distance between the plates is increased by one layer thickness, so that fresh plastic material flows into the gap between the hardened layer and the plate solely due to its surface tension can. In this way, structures in the micrometer range can be produced very precisely.
- Different light-curing materials are used to create the layers. These materials can have a wide variety of physical, chemical and biological properties, for example: electrically conductive, electrically insulating, different optical calculation indices.
- the layer segments are also filled with new material, in which no hardening took place during the previous hardening process, so that during the subsequent hardening not only the top layer is connected to the one below, but also material of the top layer with the material of one is connected below the penultimate layer.
- these are uncured areas that are available as channels after curing and rinsing. These channels can also be used as waveguides for the high frequency if the walls of the channels are produced from material with appropriate properties.
- Materials with different refractive index can also be used to create light-guiding structures. These light-guiding structures can be used in conjunction with light transistors (Keyword: light switches light) to optical integrated
- IC integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optical Integrated Circuits (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Waveguides (AREA)
- Laminated Bodies (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19964099A DE19964099B4 (de) | 1999-12-31 | 1999-12-31 | Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme |
DE19964099 | 1999-12-31 | ||
PCT/DE2000/004393 WO2001050198A2 (de) | 1999-12-31 | 2000-12-08 | Verfahren zur herstellung dreidimensional angeordneter leit- und verbindungsstrukturen für volumen- und energieströme |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1196820A2 true EP1196820A2 (de) | 2002-04-17 |
Family
ID=7935210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00991054A Ceased EP1196820A2 (de) | 1999-12-31 | 2000-12-08 | Verfahren zur herstellung dreidimensional angeordneter leit- und verbindungsstrukturen für volumen- und energieströme |
Country Status (13)
Country | Link |
---|---|
US (1) | US6805829B2 (de) |
EP (1) | EP1196820A2 (de) |
JP (1) | JP2003519039A (de) |
KR (1) | KR100652036B1 (de) |
CN (1) | CN1211197C (de) |
AU (1) | AU757191B2 (de) |
CA (1) | CA2362387C (de) |
DE (1) | DE19964099B4 (de) |
IS (1) | IS6064A (de) |
NO (1) | NO328157B1 (de) |
RU (1) | RU2242063C2 (de) |
TW (1) | TWI248555B (de) |
WO (1) | WO2001050198A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003519039A (ja) * | 1999-12-31 | 2003-06-17 | ゲッツェン ライナー | 体積流およびエネルギー流のための、3次元的に配置された導体構造および接続構造の製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10102063A1 (de) * | 2001-01-17 | 2002-07-25 | Alpha Technology Ges Fuer Ange | Analysechip mit mehreren funktionalen Ebenen für elektrofokussiertes Spotten |
DE102004013161B4 (de) * | 2004-03-17 | 2008-04-10 | microTec Gesellschaft für Mikrotechnologie mbH | Mikrofluidik-Chip |
DE102006008332B4 (de) * | 2005-07-11 | 2009-06-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit |
US20070074579A1 (en) * | 2005-10-03 | 2007-04-05 | Honeywell International Inc. | Wireless pressure sensor and method of forming same |
DE102009050325B4 (de) * | 2009-10-22 | 2014-03-20 | Amphenol-Tuchel Electronics Gmbh | Kontaktiervorrichtung und Verfahren zur Herstellung einer Kontaktiervorrichtung, Band mit Kontaktiervorrichtungen sowie SIM-Block |
US10828828B2 (en) * | 2016-11-08 | 2020-11-10 | Flex Ltd. | Method of manufacturing a part |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01232024A (ja) * | 1988-03-14 | 1989-09-18 | Mitsui Eng & Shipbuild Co Ltd | 光硬化性樹脂を用いた3次元模型の製造方法 |
DK0500225T3 (da) * | 1991-01-31 | 1996-02-05 | Texas Instruments Inc | System, fremgangsmåde og proces til computerstyret fremstilling af tredimensionale genstande udfra computerdata |
US6175422B1 (en) * | 1991-01-31 | 2001-01-16 | Texas Instruments Incorporated | Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data |
US5173220A (en) * | 1991-04-26 | 1992-12-22 | Motorola, Inc. | Method of manufacturing a three-dimensional plastic article |
US5278442A (en) * | 1991-07-15 | 1994-01-11 | Prinz Fritz B | Electronic packages and smart structures formed by thermal spray deposition |
CA2118021A1 (en) * | 1992-04-15 | 1993-10-28 | Young C. Bae | Rapid prototype three-dimensional stereolithography |
US5264061A (en) * | 1992-10-22 | 1993-11-23 | Motorola, Inc. | Method of forming a three-dimensional printed circuit assembly |
US5398193B1 (en) * | 1993-08-20 | 1997-09-16 | Alfredo O Deangelis | Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor |
DE4332982A1 (de) * | 1993-09-28 | 1995-03-30 | Eos Electro Optical Syst | Verfahren und Vorrichtung zum Herstellen eines dreidimensionalen Objekts |
DE4420996C2 (de) * | 1994-06-16 | 1998-04-09 | Reiner Dipl Ing Goetzen | Verfahren und Vorrichtung zur Herstellung von mikromechanischen und mikrooptischen Bauelementen |
US6549821B1 (en) * | 1999-02-26 | 2003-04-15 | Micron Technology, Inc. | Stereolithographic method and apparatus for packaging electronic components and resulting structures |
DE19964099B4 (de) * | 1999-12-31 | 2006-04-06 | Götzen, Reiner, Dipl.-Ing. | Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme |
-
1999
- 1999-12-31 DE DE19964099A patent/DE19964099B4/de not_active Expired - Lifetime
-
2000
- 2000-12-08 EP EP00991054A patent/EP1196820A2/de not_active Ceased
- 2000-12-08 RU RU2001126395/28A patent/RU2242063C2/ru not_active IP Right Cessation
- 2000-12-08 WO PCT/DE2000/004393 patent/WO2001050198A2/de active Application Filing
- 2000-12-08 CN CNB008044791A patent/CN1211197C/zh not_active Expired - Fee Related
- 2000-12-08 US US09/914,585 patent/US6805829B2/en not_active Expired - Lifetime
- 2000-12-08 CA CA002362387A patent/CA2362387C/en not_active Expired - Fee Related
- 2000-12-08 AU AU31504/01A patent/AU757191B2/en not_active Ceased
- 2000-12-08 JP JP2001550494A patent/JP2003519039A/ja active Pending
- 2000-12-08 KR KR1020017010676A patent/KR100652036B1/ko not_active IP Right Cessation
- 2000-12-13 TW TW089126539A patent/TWI248555B/zh not_active IP Right Cessation
-
2001
- 2001-08-28 IS IS6064A patent/IS6064A/is unknown
- 2001-08-30 NO NO20014209A patent/NO328157B1/no not_active IP Right Cessation
Non-Patent Citations (1)
Title |
---|
See references of WO0150198A2 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003519039A (ja) * | 1999-12-31 | 2003-06-17 | ゲッツェン ライナー | 体積流およびエネルギー流のための、3次元的に配置された導体構造および接続構造の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
NO20014209D0 (no) | 2001-08-30 |
US6805829B2 (en) | 2004-10-19 |
US20020125612A1 (en) | 2002-09-12 |
CN1211197C (zh) | 2005-07-20 |
CA2362387C (en) | 2007-09-11 |
CA2362387A1 (en) | 2001-07-12 |
KR20010105354A (ko) | 2001-11-28 |
WO2001050198A2 (de) | 2001-07-12 |
WO2001050198A3 (de) | 2002-01-17 |
JP2003519039A (ja) | 2003-06-17 |
AU3150401A (en) | 2001-07-16 |
AU757191B2 (en) | 2003-02-06 |
CN1358131A (zh) | 2002-07-10 |
IS6064A (is) | 2001-08-28 |
KR100652036B1 (ko) | 2006-11-30 |
NO20014209L (no) | 2001-10-25 |
RU2242063C2 (ru) | 2004-12-10 |
DE19964099B4 (de) | 2006-04-06 |
NO328157B1 (no) | 2009-12-21 |
DE19964099A1 (de) | 2001-09-13 |
TWI248555B (en) | 2006-02-01 |
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