CN1211197C - 用于体积及能量流的三维布置的导电及连接结构的制造方法 - Google Patents

用于体积及能量流的三维布置的导电及连接结构的制造方法 Download PDF

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CN1211197C
CN1211197C CNB008044791A CN00804479A CN1211197C CN 1211197 C CN1211197 C CN 1211197C CN B008044791 A CNB008044791 A CN B008044791A CN 00804479 A CN00804479 A CN 00804479A CN 1211197 C CN1211197 C CN 1211197C
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赖纳·格岑
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Goetzen Reiner
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Abstract

本发明涉及一种用于体积及能量流的三维布置的导电及连接结构的制造方法，其中使用不同的光硬化材料来产生各个层。在更换材料时，那些在前面的硬化过程中未硬化的层区域又充入新的材料，因此在随后的硬化时不仅最上层与其下一层相连接，而且最上层的材料与倒数第二层下面一层的材料相连接。因此可以在层的序列内使具有不同材料特性的结构一层接一层地彼此连接。

Description

用于体积及能量流的三维布置 的导电及连接结构的制造方法
技术领域
本发明涉及用于体积及能量流的三维布置的导电及连接结构的制造方法。体积流可以是气态，液态或固态的或由所有这些状态的混合物组成。能量流可能具有声的、电的、磁的、或电磁的特性。
背景技术
现在这种体积及能量流通常可通过许多不同的技术来实现。对于微型***技术，导体条及压焊丝是最常用的传输路径。为了传输电磁能量，除使用波导外还使用玻璃纤维。体积流可以通过通道、软管及管状导体来实现。在不断小型化趋势下，这些导电及连接单元很难进行连接。
发明内容
为克服上述缺陷，本发明提出一种带有用于体积及能量流的三维布置的导电及连接结构的微型***的制造方法，其中，使用不同的可光硬化材料来形成一层状结构，其特征在于，通过两个彼此平行的板之间的少量可光硬化材料产生上述层中的各层，所述两板中的至少一个可透过电磁波，并通过表面张力将所述少量可光硬化材料保持在两板之间，所述各层借助电磁波并根据以层状方式构造的待产生结构的三维层模型被照射，电磁波根据该模型一层接一层地在被照射位置上使所述可光硬化材料具有一定构造地硬化，其中两板之间的距离每次增加一个相应层的厚度，以使得新的可光硬化材料能够继续流入所形成的间隙中，每次层中未硬化的区域借助冲洗工序清洗并在构造下一层时被也形成下一层的可光硬化材料填满，其中，所述新的可光硬化材料可具有不同的物理、化学或生物特性，这样，未硬化的区域在进一步构造***时形成空穴或通道，或者由于用具有不同特性的材料填充而在空穴之间形成连接，在以层的方式构造微型***期间可以在这些空穴中置入电的、光学的或机械部件，这些部件通过所述通道或者导电连接彼此相连。
有利的是，本发明的方法具有以下步骤：
a)通过具有所选择物理、化学或生物特性的流体光硬化材料的结构硬化来产生一结构层，
b)所述结构层中的未硬化材料借助冲洗工序进行清洗，并且充入具有另外物理、化学或生物特性的流体光硬化材料，并使层达到一定厚度；
c)通过结构硬化使第一层及新的一层结构硬化，
d)上述结构层中最后结构的未硬化材料借助冲洗工序进行清洗，并且充入具有另外物理、化学或生物特性的流体光硬化材料，并使层达到一定厚度；
e)通过结构硬化使第二层的区域及新的一层结构硬化，由此产生具有相同物理、化学或生物特性的材料的连接或隔离；
f)这些结构层中的最后结构的未硬化材料借助冲洗工序进行清洗；
g)未充填材料的区域将根据待制作的***装上电子的、机械的、光学的或化学的部件；
h)这些结构层及部件将用具有另外物理、化学或生物特性的流体光硬化材料充填，并使层达到一定的厚度；
i)通过结构硬化使倒数第二层的区域及新的一层结构硬化，由此产生了具有相同物理、化学或生物特性的材料及部件的连接或隔离。
有利的是，所述多个电子的、机械的、化学的或生物的/电的部件彼此相连。
有利的是，所述***的部件及周围之间的连接可用于体积及能量流。
具体实施方式
本发明的任务通过使用结构上呈层状形式的构造来解决。层状构造方法已由微型技术公知。例如DE-PS 44 20 996中描述了一种方法，其中在两个彼此平行的板之间利用表面张力保持少量的可光硬化的塑料，这两个板中至少一个可透过电磁波。在可透过电磁波的板下面的塑料立体的表面例如借助激光束来硬化，按照存储在一个所连接的计算机中的待产生结构的3维层模型的尺寸比例在所述的表面上对所述的激光束进行控制。激光将根据所述的3维层模型一层接一层地硬化所述的塑料流体，其中两个板之间的距离每次总是增加一个层的厚度，以致新的塑料材料在其表面张力作用下即可补充地流入已硬化的层与一个板之间所形成的空隙中。以此方式可以非常精确地在微米范围内产生其结构。
本发明适当地使用了所述技术。
这里，它被用来产生不同的光硬化材料的层。这些材料可具有不同的物理、化学及生物性能，例如：导电、电绝缘、不同光计算指数。在更换材料时，那些在前面的硬化过程中未硬化的层区域又充入新的材料，因此在随后的硬化时不仅最上层与其下一层相连接，而且最上层的材料与倒数第二层下面一层的材料相连接。因此可以在层的序列内使具有不同材料特性的结构一层接一层地彼此连接。对于体积传输，是未硬化的区域在硬化及冲洗工序后作为通道被提供。这些通道可作为用于高频的波导被使用，这时通道的壁由具有相应特性的材料制作。
并且也可通过具有不同计算指数的材料来产生光导结构。这些光导结构可与光导晶体管(提示词：光开关光)连接成为集成光开关而使用。
以此方式也可使传统的集成电路(IC)彼此连接。因为一个IC被集成在最后表面下面的一个空穴中，由此可在连接端子(pads)上面用导电材料产生通道，然后该通道被引导到另一IC或插接式连接器，后者也是以此方式制作的。

Claims (4)

1.一种带有用于体积及能量流的三维布置的导电及连接结构的微型***的制造方法，其中，使用不同的可光硬化材料来形成一层状结构，其特征在于，通过两个彼此平行的板之间的少量可光硬化材料产生上述层中的各层，所述两板中的至少一个可透过电磁波，并通过表面张力将所述少量可光硬化材料保持在两板之间，所述各层借助电磁波并根据以层状方式构造的待产生结构的三维层模型被照射，电磁波根据该模型一层接一层地在被照射位置上使所述可光硬化材料具有一定构造地硬化，其中两板之间的距离每次增加一个相应层的厚度，以使得新的可光硬化材料能够继续流入所形成的间隙中，每次层中未硬化的区域借助冲洗工序清洗并在构造下一层时被也形成下一层的可光硬化材料填满，其中，所述新的可光硬化材料可具有不同的物理、化学或生物特性，这样，未硬化的区域在进一步构造***时形成空穴或通道，或者由于用具有不同特性的材料填充而在空穴之间形成连接，在以层的方式构造微型***期间可以在这些空穴中置入电的、光学的或机械部件，这些部件通过所述通道或者导电连接彼此相连。
2.根据权利要求1所述的方法，其特征在于，它具有以下步骤：
a)通过具有所选择物理、化学或生物特性的流体光硬化材料的结构硬化来产生一结构层，
b)所述结构层中的未硬化材料借助冲洗工序进行清洗，并且充入具有另外物理、化学或生物特性的流体光硬化材料，并使层达到一定厚度；
c)通过结构硬化使第一层及新的一层结构硬化，
d)上述结构层中最后结构的未硬化材料借助冲洗工序进行清洗，并且充入具有另外物理、化学或生物特性的流体光硬化材料，并使层达到一定厚度；
e)通过结构硬化使第二层的区域及新的一层结构硬化，由此产生具有相同物理、化学或生物特性的材料的连接或隔离；
f)这些结构层中的最后结构的未硬化材料借助冲洗工序进行清洗；
g)未充填材料的区域将根据待制作的***装上电子的、机械的、光学的或化学的部件；
h)这些结构层及部件将用具有另外物理、化学或生物特性的流体光硬化材料充填，并使层达到一定的厚度；
i)通过结构硬化使倒数第二层的区域及新的一层结构硬化，由此产生了具有相同物理、化学或生物特性的材料及部件的连接或隔离。
3.根据权利要求2所述的方法，其特征在于：所述多个电子的、机械的、化学的或生物的/电的部件彼此相连。
4.根据权利要求3所述的方法，其特征在于：所述***的部件及周围之间的连接可用于体积及能量流。
CNB008044791A 1999-12-31 2000-12-08 用于体积及能量流的三维布置的导电及连接结构的制造方法 Expired - Fee Related CN1211197C (zh)

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DE19964099.8 1999-12-31

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DE102004013161B4 (de) * 2004-03-17 2008-04-10 microTec Gesellschaft für Mikrotechnologie mbH Mikrofluidik-Chip
DE102006008332B4 (de) * 2005-07-11 2009-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit
US20070074579A1 (en) * 2005-10-03 2007-04-05 Honeywell International Inc. Wireless pressure sensor and method of forming same
DE102009050325B4 (de) * 2009-10-22 2014-03-20 Amphenol-Tuchel Electronics Gmbh Kontaktiervorrichtung und Verfahren zur Herstellung einer Kontaktiervorrichtung, Band mit Kontaktiervorrichtungen sowie SIM-Block
US10828828B2 (en) * 2016-11-08 2020-11-10 Flex Ltd. Method of manufacturing a part

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232024A (ja) * 1988-03-14 1989-09-18 Mitsui Eng & Shipbuild Co Ltd 光硬化性樹脂を用いた３次元模型の製造方法
DK0500225T3 (da) * 1991-01-31 1996-02-05 Texas Instruments Inc System, fremgangsmåde og proces til computerstyret fremstilling af tredimensionale genstande udfra computerdata
US6175422B1 (en) * 1991-01-31 2001-01-16 Texas Instruments Incorporated Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data
US5173220A (en) * 1991-04-26 1992-12-22 Motorola, Inc. Method of manufacturing a three-dimensional plastic article
US5278442A (en) * 1991-07-15 1994-01-11 Prinz Fritz B Electronic packages and smart structures formed by thermal spray deposition
CA2118021A1 (en) * 1992-04-15 1993-10-28 Young C. Bae Rapid prototype three-dimensional stereolithography
US5264061A (en) * 1992-10-22 1993-11-23 Motorola, Inc. Method of forming a three-dimensional printed circuit assembly
US5398193B1 (en) * 1993-08-20 1997-09-16 Alfredo O Deangelis Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor
DE4332982A1 (de) * 1993-09-28 1995-03-30 Eos Electro Optical Syst Verfahren und Vorrichtung zum Herstellen eines dreidimensionalen Objekts
DE4420996C2 (de) * 1994-06-16 1998-04-09 Reiner Dipl Ing Goetzen Verfahren und Vorrichtung zur Herstellung von mikromechanischen und mikrooptischen Bauelementen
US6549821B1 (en) * 1999-02-26 2003-04-15 Micron Technology, Inc. Stereolithographic method and apparatus for packaging electronic components and resulting structures
DE19964099B4 (de) * 1999-12-31 2006-04-06 Götzen, Reiner, Dipl.-Ing. Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme

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US6805829B2 (en) 2004-10-19
US20020125612A1 (en) 2002-09-12
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CA2362387A1 (en) 2001-07-12
KR20010105354A (ko) 2001-11-28
WO2001050198A2 (de) 2001-07-12
EP1196820A2 (de) 2002-04-17
WO2001050198A3 (de) 2002-01-17
JP2003519039A (ja) 2003-06-17
AU3150401A (en) 2001-07-16
AU757191B2 (en) 2003-02-06
CN1358131A (zh) 2002-07-10
IS6064A (is) 2001-08-28
KR100652036B1 (ko) 2006-11-30
NO20014209L (no) 2001-10-25
RU2242063C2 (ru) 2004-12-10
DE19964099B4 (de) 2006-04-06
NO328157B1 (no) 2009-12-21
DE19964099A1 (de) 2001-09-13
TWI248555B (en) 2006-02-01

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