NL8702592A - Werkwijze voor het regelen van elektrodeloze plateerbaden. - Google Patents
Werkwijze voor het regelen van elektrodeloze plateerbaden. Download PDFInfo
- Publication number
- NL8702592A NL8702592A NL8702592A NL8702592A NL8702592A NL 8702592 A NL8702592 A NL 8702592A NL 8702592 A NL8702592 A NL 8702592A NL 8702592 A NL8702592 A NL 8702592A NL 8702592 A NL8702592 A NL 8702592A
- Authority
- NL
- Netherlands
- Prior art keywords
- copper
- concentration
- electrodes
- potential
- formaldehyde
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/926,362 US4814197A (en) | 1986-10-31 | 1986-10-31 | Control of electroless plating baths |
US92636286 | 1986-10-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL8702592A true NL8702592A (nl) | 1988-05-16 |
Family
ID=25453110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL8702592A NL8702592A (nl) | 1986-10-31 | 1987-10-30 | Werkwijze voor het regelen van elektrodeloze plateerbaden. |
Country Status (14)
Country | Link |
---|---|
US (1) | US4814197A (de) |
EP (1) | EP0265901B1 (de) |
JP (1) | JP2759322B2 (de) |
KR (1) | KR880701790A (de) |
AU (1) | AU602041B2 (de) |
BR (1) | BR8707517A (de) |
CA (1) | CA1265710A (de) |
CH (1) | CH674582A5 (de) |
DE (1) | DE3736429C2 (de) |
ES (1) | ES2038151T3 (de) |
FR (1) | FR2609806B1 (de) |
GB (1) | GB2207249B (de) |
NL (1) | NL8702592A (de) |
WO (1) | WO1988003180A1 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2039403T3 (es) * | 1986-10-31 | 1993-10-01 | Amp-Akzo Corporation (A Delaware Corp.) | Metodo para depositar sin electricidad cobre de alta calidad. |
AU3304389A (en) * | 1988-04-29 | 1989-11-02 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
JP2888001B2 (ja) * | 1992-01-09 | 1999-05-10 | 日本電気株式会社 | 金属メッキ装置 |
US5352350A (en) * | 1992-02-14 | 1994-10-04 | International Business Machines Corporation | Method for controlling chemical species concentration |
US5484626A (en) * | 1992-04-06 | 1996-01-16 | Shipley Company L.L.C. | Methods and apparatus for maintaining electroless plating solutions |
WO1994017464A1 (en) * | 1993-01-19 | 1994-08-04 | Pulsafeeder, Inc. | Modular fluid characteristic sensor and additive controller |
US5368715A (en) * | 1993-02-23 | 1994-11-29 | Enthone-Omi, Inc. | Method and system for controlling plating bath parameters |
DE19546206A1 (de) * | 1994-12-19 | 1996-06-20 | At & T Corp | Verfahren zum Prüfen von Materialien zur Verwendung bei der chemischen oder außenstromlosen Beschichtung |
US5631845A (en) * | 1995-10-10 | 1997-05-20 | Ford Motor Company | Method and system for controlling phosphate bath constituents |
KR100201377B1 (ko) * | 1995-10-27 | 1999-06-15 | 김무 | 다성분 도금용액의 농도조절장치 |
US5993892A (en) * | 1996-09-12 | 1999-11-30 | Wasserman; Arthur | Method of monitoring and controlling electroless plating in real time |
US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
US7189318B2 (en) * | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7020537B2 (en) * | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
AU2001259504A1 (en) * | 2000-05-24 | 2001-12-03 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
PL342328A1 (en) * | 2000-09-01 | 2002-03-11 | Kghm Polska Miedz Sa | Method fo measuring concentration of copper ions in industrial electrolytes |
WO2006007533A1 (en) * | 2004-07-01 | 2006-01-19 | Tracedetect, Inc. | Method for ultrasonic cleaning of a working electrode in electrochemical cell useful for automated trace metals measurement |
JP2007051362A (ja) * | 2005-07-19 | 2007-03-01 | Ebara Corp | めっき装置及びめっき液の管理方法 |
WO2008058250A1 (en) * | 2006-11-08 | 2008-05-15 | Surfect Technologies, Inc. | System and method for controlling an electroless deposition process |
EP2192405B1 (de) | 2008-11-26 | 2012-02-22 | ATOTECH Deutschland GmbH | Verfahren zur Kontrolle von Stabilisatoradditiven in Elektrolyten zur chemischen Metall- und Metalllegierungsabscheidung |
US8172627B2 (en) | 2008-12-03 | 2012-05-08 | Tyco Electronics Corporation | Electrical connector with plated plug and receptacle |
HUE038772T2 (hu) | 2013-07-02 | 2018-11-28 | Ancosys Gmbh | In situ ujjlenyomat eljárás elektrokémiai leválasztáshoz és/vagy elektrokémiai maratáshoz |
MY191657A (en) | 2015-12-03 | 2022-07-06 | Atotech Deutschland Gmbh | Method for monitoring the total amount of sulphur containing compounds in a metal plating bath |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2851655A (en) * | 1956-09-25 | 1958-09-09 | Foxboro Co | Amperometric continuous measurement system |
US3401065A (en) * | 1964-08-18 | 1968-09-10 | Amchem Prod | Automatic control of nitrite addition in acid phosphate coating solutions |
US3532519A (en) * | 1967-11-28 | 1970-10-06 | Matsushita Electric Ind Co Ltd | Electroless copper plating process |
JPS5036197B1 (de) * | 1968-12-24 | 1975-11-21 | ||
US3959108A (en) * | 1971-12-27 | 1976-05-25 | Plumpe Jr William H | System for automatically measuring and controlling the sulfate content of a chromium plating solution |
US4096301A (en) * | 1976-02-19 | 1978-06-20 | Macdermid Incorporated | Apparatus and method for automatically maintaining an electroless copper plating bath |
GB1585057A (en) * | 1976-06-28 | 1981-02-25 | Ici Ltd | Sensing concentration of coating solution |
JPS539233A (en) * | 1976-07-14 | 1978-01-27 | Tokyo Shibaura Electric Co | Method of adjusting concentration of nonnelectrolytic copper plating solution |
JPS539234A (en) * | 1976-07-14 | 1978-01-27 | Tokyo Shibaura Electric Co | Method of adjusting concentration of reducing agent for nonnelectrolytic plating solution |
JPS539235A (en) * | 1976-07-14 | 1978-01-27 | Tokyo Shibaura Electric Co | Method of adjusting concentration of nonnelectrolytic plating solution |
US4132605A (en) * | 1976-12-27 | 1979-01-02 | Rockwell International Corporation | Method for evaluating the quality of electroplating baths |
DE2711989C2 (de) * | 1977-03-18 | 1980-04-30 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Elektrochemische Bestimmung von SchwermetaUen in Wasser |
US4209331A (en) * | 1978-05-25 | 1980-06-24 | Macdermid Incorporated | Electroless copper composition solution using a hypophosphite reducing agent |
IT1112649B (it) * | 1978-07-28 | 1986-01-20 | Oxon Italia Spa | Composto chimico eterociclio 6-fenil-(1,2,3)-oxadiazolo-(4,5 d)-piridazin-7(6h)-one e procedimento per la sua produzione |
US4336111A (en) * | 1978-11-02 | 1982-06-22 | The Boeing Company | Method for determining the strength of a metal processing solution |
JPS5926660B2 (ja) * | 1979-03-07 | 1984-06-29 | 株式会社東芝 | 無電解メツキ反応の測定方法 |
JPS55158554A (en) * | 1979-05-28 | 1980-12-10 | Nissan Eng Kk | Apparatus for measuring concentration of oxidating and reducing substance |
US4353933A (en) * | 1979-11-14 | 1982-10-12 | C. Uyemura & Co., Ltd. | Method for controlling electroless plating bath |
JPS6016517B2 (ja) * | 1979-12-29 | 1985-04-25 | 上村工業株式会社 | 無電解めつき制御方法 |
JPS56120943A (en) * | 1980-02-29 | 1981-09-22 | Hitachi Ltd | Manufacture of ph-detecting electrode |
JPS5841344A (ja) * | 1981-09-07 | 1983-03-10 | Baionikusu Kiki Kk | ボルタンメトリ−分析法 |
US4563217A (en) * | 1983-07-25 | 1986-01-07 | Hitachi, Ltd. | Electroless copper plating solution |
JPS60104246A (ja) * | 1983-11-11 | 1985-06-08 | C Uyemura & Co Ltd | 化学銅めつき浴中のホルムアルデヒドの分析方法 |
US4565575A (en) * | 1984-11-02 | 1986-01-21 | Shiplay Company Inc. | Apparatus and method for automatically maintaining an electroless plating bath |
US4623554A (en) * | 1985-03-08 | 1986-11-18 | International Business Machines Corp. | Method for controlling plating rate in an electroless plating system |
US4631116A (en) * | 1985-06-05 | 1986-12-23 | Hughes Aircraft Company | Method of monitoring trace constituents in plating baths |
US4654126A (en) * | 1985-10-07 | 1987-03-31 | International Business Machines Corporation | Process for determining the plating activity of an electroless plating bath |
-
1986
- 1986-10-31 US US06/926,362 patent/US4814197A/en not_active Expired - Lifetime
-
1987
- 1987-10-27 ES ES198787115717T patent/ES2038151T3/es not_active Expired - Lifetime
- 1987-10-27 EP EP87115717A patent/EP0265901B1/de not_active Expired - Lifetime
- 1987-10-28 DE DE3736429A patent/DE3736429C2/de not_active Expired
- 1987-10-29 CH CH4251/87A patent/CH674582A5/de not_active IP Right Cessation
- 1987-10-29 GB GB8725399A patent/GB2207249B/en not_active Expired - Lifetime
- 1987-10-30 FR FR8715091A patent/FR2609806B1/fr not_active Expired - Fee Related
- 1987-10-30 WO PCT/US1987/002854 patent/WO1988003180A1/en unknown
- 1987-10-30 JP JP62507140A patent/JP2759322B2/ja not_active Expired - Lifetime
- 1987-10-30 NL NL8702592A patent/NL8702592A/nl not_active Application Discontinuation
- 1987-10-30 AU AU83269/87A patent/AU602041B2/en not_active Ceased
- 1987-10-30 BR BR8707517A patent/BR8707517A/pt not_active IP Right Cessation
- 1987-11-02 CA CA000550806A patent/CA1265710A/en not_active Expired - Lifetime
-
1988
- 1988-06-30 KR KR1019880700759A patent/KR880701790A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
AU8326987A (en) | 1988-05-25 |
AU602041B2 (en) | 1990-09-27 |
FR2609806A1 (fr) | 1988-07-22 |
WO1988003180A1 (en) | 1988-05-05 |
US4814197A (en) | 1989-03-21 |
FR2609806B1 (fr) | 1993-09-10 |
GB2207249B (en) | 1991-03-27 |
GB8725399D0 (en) | 1987-12-02 |
ES2038151T3 (es) | 1993-07-16 |
JP2759322B2 (ja) | 1998-05-28 |
EP0265901A3 (en) | 1989-05-10 |
JPH01501324A (ja) | 1989-05-11 |
EP0265901A2 (de) | 1988-05-04 |
DE3736429A1 (de) | 1988-05-19 |
BR8707517A (pt) | 1989-02-21 |
KR880701790A (ko) | 1988-11-05 |
CA1265710A (en) | 1990-02-13 |
DE3736429C2 (de) | 1988-12-01 |
EP0265901B1 (de) | 1993-01-27 |
CH674582A5 (de) | 1990-06-15 |
GB2207249A (en) | 1989-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
CNR | Transfer of rights (patent application after its laying open for public inspection) |
Free format text: AMP-AKZO CORPORATION |
|
BV | The patent application has lapsed |