US6677390B1
(en)
*
|
1999-08-02 |
2004-01-13 |
Nippon Soda Co., Ltd. |
Photocurable composition containing iodonium salt compound
|
GB2360283B
(en)
*
|
2000-02-08 |
2002-08-21 |
Ciba Sc Holding Ag |
Monoacylarylphosphines and acylphosphine oxides and sulphides
|
EP1136537A1
(en)
*
|
2000-03-20 |
2001-09-26 |
Akzo Nobel N.V. |
Adhesive system
|
JP4156784B2
(ja)
|
2000-07-25 |
2008-09-24 |
富士フイルム株式会社 |
ネガ型画像記録材料及び画像形成方法
|
JP2002082429A
(ja)
*
|
2000-09-08 |
2002-03-22 |
Fuji Photo Film Co Ltd |
ネガ型画像記録材料
|
US6749987B2
(en)
*
|
2000-10-20 |
2004-06-15 |
Fuji Photo Film Co., Ltd. |
Positive photosensitive composition
|
US6641971B2
(en)
*
|
2001-06-15 |
2003-11-04 |
International Business Machines Corporation |
Resist compositions comprising silyl ketals and methods of use thereof
|
JP2003064135A
(ja)
*
|
2001-08-30 |
2003-03-05 |
Idemitsu Kosan Co Ltd |
色変換材料組成物及びそれを用いた色変換膜
|
EP1289030A1
(en)
*
|
2001-09-04 |
2003-03-05 |
Sony International (Europe) GmbH |
Doping of a hole transporting material
|
US6895156B2
(en)
*
|
2001-10-09 |
2005-05-17 |
3M Innovative Properties Company |
Small diameter, high strength optical fiber
|
US6582886B1
(en)
|
2001-11-27 |
2003-06-24 |
Nupro Technologies, Inc. |
Developing solvent for photopolymerizable printing plates
|
US20050227183A1
(en)
*
|
2002-01-11 |
2005-10-13 |
Mark Wagner |
Compositions and methods for image development of conventional chemically amplified photoresists
|
JP4557497B2
(ja)
*
|
2002-03-03 |
2010-10-06 |
ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. |
シランモノマー及びポリマーを製造する方法及びそれを含むフォトレジスト組成物
|
WO2003087941A1
(fr)
*
|
2002-04-18 |
2003-10-23 |
Nissan Chemical Industries, Ltd. |
Composition de resine positivement photosensible et procede de formation de motifs
|
CN100482694C
(zh)
*
|
2002-04-19 |
2009-04-29 |
西巴特殊化学品控股有限公司 |
等离子体诱发的涂层固化
|
JP4382364B2
(ja)
*
|
2002-04-24 |
2009-12-09 |
株式会社東芝 |
液体インク
|
DE10224380A1
(de)
*
|
2002-06-01 |
2003-12-18 |
Basf Coatings Ag |
Beschichtungsstoff, Verfahren zu seiner Herstellung und seine Verwendung zur Herstellung haftfester Beschichtungen
|
AT500298A1
(de)
*
|
2002-06-14 |
2005-11-15 |
Agrolinz Melamin Gmbh |
Verfahren zur härtung von aminoplasten
|
DE10234369A1
(de)
*
|
2002-07-27 |
2004-02-12 |
Henkel Kgaa |
Strahlungsvernetzbare Schmelzhaftklebstoffe
|
EP1550677B1
(en)
*
|
2002-07-30 |
2007-02-28 |
Toagosei Co., Ltd. |
Composition for holography, method of curing the same, and cured article
|
JP4213925B2
(ja)
*
|
2002-08-19 |
2009-01-28 |
富士フイルム株式会社 |
ネガ型レジスト組成物
|
TWI223736B
(en)
*
|
2002-12-19 |
2004-11-11 |
Ind Tech Res Inst |
Hybrid photoresist with multi reaction models and process for forming pattern using the same
|
US7160665B2
(en)
*
|
2002-12-30 |
2007-01-09 |
International Business Machines Corporation |
Method for employing vertical acid transport for lithographic imaging applications
|
EP1605005B1
(en)
*
|
2003-02-28 |
2013-12-04 |
Kuraray Co., Ltd. |
Curable resin composition
|
US7244473B2
(en)
*
|
2003-04-22 |
2007-07-17 |
Konica Minolta Medical & Graphic, Inc. |
Active ray curable ink-jet composition, image forming method using the same, ink-jet recording apparatus, and triarylsulfonium salt compound
|
US7358408B2
(en)
*
|
2003-05-16 |
2008-04-15 |
Az Electronic Materials Usa Corp. |
Photoactive compounds
|
US7122294B2
(en)
*
|
2003-05-22 |
2006-10-17 |
3M Innovative Properties Company |
Photoacid generators with perfluorinated multifunctional anions
|
US20060222998A1
(en)
*
|
2003-06-30 |
2006-10-05 |
Tsutomu Sato |
Positive photosensitive composition
|
US7235593B2
(en)
|
2003-08-04 |
2007-06-26 |
Rensselaer Polytechnic Institute |
Command-cure adhesives
|
KR100561842B1
(ko)
*
|
2003-08-25 |
2006-03-16 |
삼성전자주식회사 |
단량체 광산발생제 조성물, 상기 조성물로 코팅된 기판,상기 단량체 광산발생제 조성물을 이용하여 기판상에서화합물을 합성하는 방법 및 상기 방법에 의하여 제조된마이크로어레이
|
JP2005105225A
(ja)
*
|
2003-10-02 |
2005-04-21 |
Konica Minolta Medical & Graphic Inc |
活性光線硬化型インクジェットインク組成物
|
JP4037856B2
(ja)
*
|
2003-10-28 |
2008-01-23 |
東芝テック株式会社 |
インクジェットインク
|
CN100523102C
(zh)
*
|
2003-10-28 |
2009-08-05 |
东芝泰格有限公司 |
喷墨油墨
|
JP4595311B2
(ja)
*
|
2003-11-06 |
2010-12-08 |
コニカミノルタエムジー株式会社 |
活性光線硬化型インクジェットインク組成物、それを用いた画像形成方法及びインクジェット記録装置
|
JP2005153273A
(ja)
*
|
2003-11-25 |
2005-06-16 |
Nitto Denko Corp |
樹脂シート、液晶セル基板、液晶表示装置、エレクトロルミネッセンス表示装置用基板、エレクトロルミネッセンス表示装置および太陽電池用基板
|
JP4384570B2
(ja)
*
|
2003-12-01 |
2009-12-16 |
東京応化工業株式会社 |
厚膜用ホトレジスト組成物及びレジストパターンの形成方法
|
DE102004003143A1
(de)
*
|
2004-01-21 |
2005-08-18 |
Kodak Polychrome Graphics Gmbh |
Strahlungsempfindliche Zusammensetzungen mit mercapto-funktionalisierten, radikalisch polymerisierbaren Monomeren
|
JP2007523974A
(ja)
*
|
2004-01-27 |
2007-08-23 |
チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド |
熱安定性のカチオン光硬化性組成物
|
GB0411842D0
(en)
*
|
2004-05-27 |
2004-06-30 |
Ici Plc |
Colour changing coating composition
|
JP4606136B2
(ja)
|
2004-06-09 |
2011-01-05 |
富士通株式会社 |
多層体、レジストパターン形成方法、微細加工パターンを有する装置の製造方法および電子装置
|
JP3910979B2
(ja)
*
|
2004-07-29 |
2007-04-25 |
東芝テック株式会社 |
インクジェットインク組成物およびそれを用いた印刷物
|
JP4152928B2
(ja)
*
|
2004-08-02 |
2008-09-17 |
株式会社シンク・ラボラトリー |
ポジ型感光性組成物
|
US7592376B2
(en)
*
|
2004-08-23 |
2009-09-22 |
Rensselaer Polytechnic Institute |
Photopolymerizable epoxide and oxetane compositions
|
US20060046183A1
(en)
*
|
2004-08-26 |
2006-03-02 |
Wang Yueh |
Photoresist formulation with surfactant additive
|
US20060093844A1
(en)
*
|
2004-10-29 |
2006-05-04 |
Conklin Jeanine A |
Photochromic coating compositions, methods of making coated articles and articles thereof
|
US7927778B2
(en)
*
|
2004-12-29 |
2011-04-19 |
Tokyo Ohka Kogyo Co., Ltd. |
Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
|
US7951522B2
(en)
*
|
2004-12-29 |
2011-05-31 |
Tokyo Ohka Kogyo Co., Ltd. |
Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
|
WO2006081534A1
(en)
*
|
2005-01-28 |
2006-08-03 |
Micell Technologies, Inc. |
Compositions and methods for image development of conventional chemically amplified photoresists
|
US7410751B2
(en)
*
|
2005-01-28 |
2008-08-12 |
Micell Technologies, Inc. |
Compositions and methods for image development of conventional chemically amplified photoresists
|
US20060172230A1
(en)
|
2005-02-02 |
2006-08-03 |
Dsm Ip Assets B.V. |
Method and composition for reducing waste in photo-imaging applications
|
EP1705007B1
(en)
*
|
2005-03-23 |
2012-06-06 |
FUJIFILM Corporation |
Lithographic printing plate precursor and lithographic printing method
|
TWI332122B
(en)
*
|
2005-04-06 |
2010-10-21 |
Shinetsu Chemical Co |
Novel sulfonate salts and derivatives, photoacid generators, resist compositions and patterning process
|
CA2602628A1
(en)
*
|
2005-04-07 |
2006-10-12 |
Alstom Technology Ltd. |
Method for repairing or renewing cooling holes of a coated component of a gas turbine
|
JP4724465B2
(ja)
*
|
2005-05-23 |
2011-07-13 |
富士フイルム株式会社 |
感光性組成物及び該感光性組成物を用いたパターン形成方法
|
KR100732301B1
(ko)
*
|
2005-06-02 |
2007-06-25 |
주식회사 하이닉스반도체 |
포토레지스트 중합체, 포토레지스트 조성물 및 이를 이용한반도체 소자의 제조 방법
|
CN1904736B
(zh)
*
|
2005-07-25 |
2012-06-13 |
日产化学工业株式会社 |
正型感光性树脂组合物和由其得到的固化膜
|
GB0516515D0
(en)
*
|
2005-08-11 |
2005-09-21 |
Sun Chemical Bv |
A jet ink and ink jet printing process
|
JP5193041B2
(ja)
*
|
2005-08-23 |
2013-05-08 |
ピーエスティ・センサーズ・(プロプライエタリー)・リミテッド |
粒状半導体材料のドーピング
|
JP4979915B2
(ja)
*
|
2005-09-09 |
2012-07-18 |
東京応化工業株式会社 |
高分子化合物、ネガ型レジスト組成物およびレジストパターン形成方法
|
US7695890B2
(en)
*
|
2005-09-09 |
2010-04-13 |
Brewer Science Inc. |
Negative photoresist for silicon KOH etch without silicon nitride
|
JP4770354B2
(ja)
*
|
2005-09-20 |
2011-09-14 |
日立化成工業株式会社 |
光硬化性樹脂組成物及びこれを用いたパターン形成方法
|
EP1780198B1
(en)
*
|
2005-10-31 |
2011-10-05 |
Shin-Etsu Chemical Co., Ltd. |
Novel fluorosulfonyloxyalkyl sulfonate salts and derivatives, photoacid generators, resist compositions, and patterning process
|
EP1780199B1
(en)
*
|
2005-10-31 |
2012-02-01 |
Shin-Etsu Chemical Co., Ltd. |
Novel fluorohydroxyalkyl sulfonate salts and derivatives, photoacid generators, resist compositions, and patterning process
|
KR100777561B1
(ko)
*
|
2005-11-24 |
2007-11-28 |
주식회사 엘지화학 |
알칼리 가용성 수지 및 이를 포함하는 감광성 수지 조성물
|
US7989517B2
(en)
*
|
2005-11-28 |
2011-08-02 |
Konica Minolta Medical & Graphic, Inc. |
Actinic ray curable composition, actinic ray curable ink, and image formation process employing the same
|
US7696260B2
(en)
*
|
2006-03-30 |
2010-04-13 |
Dsm Ip Assets B.V. |
Cationic compositions and methods of making and using the same
|
US7524614B2
(en)
*
|
2006-05-26 |
2009-04-28 |
Eastman Kodak Company |
Negative-working radiation-sensitive compositions and imageable materials
|
JP5124805B2
(ja)
*
|
2006-06-27 |
2013-01-23 |
信越化学工業株式会社 |
光酸発生剤並びにこれを用いたレジスト材料及びパターン形成方法
|
JP5124806B2
(ja)
*
|
2006-06-27 |
2013-01-23 |
信越化学工業株式会社 |
光酸発生剤並びにこれを用いたレジスト材料及びパターン形成方法
|
US7846639B2
(en)
*
|
2006-06-30 |
2010-12-07 |
E. I. Du Pont De Nemours And Company |
Imaging element having a photoluminescent tag and process of using the imaging element to form a recording element
|
KR101256301B1
(ko)
*
|
2006-07-19 |
2013-04-18 |
히타치가세이가부시끼가이샤 |
유기 일렉트로닉스용 재료, 유기 일렉트로닉스 소자 및 유기 일렉트로루미네센스 소자
|
US7332253B1
(en)
*
|
2006-07-27 |
2008-02-19 |
Eastman Kodak Company |
Negative-working radiation-sensitive compositions and imageable materials
|
RU2453886C2
(ru)
*
|
2006-08-24 |
2012-06-20 |
Циба Холдинг Инк. |
Индикаторы дозы уф-излучения
|
US7326521B1
(en)
*
|
2006-08-31 |
2008-02-05 |
Eastman Kodak Company |
Method of imaging and developing negative-working elements
|
JP5430821B2
(ja)
*
|
2006-09-19 |
2014-03-05 |
東京応化工業株式会社 |
レジストパターン形成方法
|
KR101035742B1
(ko)
*
|
2006-09-28 |
2011-05-20 |
신에쓰 가가꾸 고교 가부시끼가이샤 |
신규 광산 발생제 및 이것을 이용한 레지스트 재료 및 패턴형성 방법
|
EP2076563B1
(en)
*
|
2006-10-24 |
2016-08-17 |
Basf Se |
Thermally stable cationic photocurable compositions
|
US7491482B2
(en)
*
|
2006-12-04 |
2009-02-17 |
Az Electronic Materials Usa Corp. |
Photoactive compounds
|
KR20080064456A
(ko)
*
|
2007-01-05 |
2008-07-09 |
주식회사 하이닉스반도체 |
반도체 소자의 미세 패턴 형성 방법
|
EP2109001B1
(en)
*
|
2007-01-22 |
2012-01-11 |
Nissan Chemical Industries, Ltd. |
Positive photosensitive resin composition
|
GB2450975B
(en)
|
2007-07-12 |
2010-02-24 |
Ciba Holding Inc |
Yellow radiation curing inks
|
JP5019071B2
(ja)
|
2007-09-05 |
2012-09-05 |
信越化学工業株式会社 |
新規光酸発生剤並びにこれを用いたレジスト材料及びパターン形成方法
|
US8470518B2
(en)
*
|
2007-09-14 |
2013-06-25 |
E I Du Pont De Nemours And Company |
Photosensitive element having reinforcing particles and method for preparing a printing form from the element
|
US8042976B2
(en)
*
|
2007-11-30 |
2011-10-25 |
Taiyo Holdings Co., Ltd. |
White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
|
EP2098367A1
(en)
|
2008-03-05 |
2009-09-09 |
Eastman Kodak Company |
Sensitizer/Initiator Combination for Negative-Working Thermal-Sensitive Compositions Usable for Lithographic Plates
|
JP5245956B2
(ja)
|
2008-03-25 |
2013-07-24 |
信越化学工業株式会社 |
新規光酸発生剤並びにこれを用いたレジスト材料及びパターン形成方法
|
US8084182B2
(en)
|
2008-04-29 |
2011-12-27 |
Eastman Kodak Company |
On-press developable elements and methods of use
|
JP4569786B2
(ja)
|
2008-05-01 |
2010-10-27 |
信越化学工業株式会社 |
新規光酸発生剤並びにこれを用いたレジスト材料及びパターン形成方法
|
JP5199752B2
(ja)
*
|
2008-06-30 |
2013-05-15 |
住友化学株式会社 |
有機薄膜トランジスタ及びその製造方法、並びにこの有機トランジスタを用いたディスプレイ用部材及びディスプレイ
|
US8168367B2
(en)
*
|
2008-07-11 |
2012-05-01 |
Shin-Etsu Chemical Co., Ltd. |
Resist composition and patterning process
|
JP5106285B2
(ja)
|
2008-07-16 |
2012-12-26 |
富士フイルム株式会社 |
光硬化性組成物、インク組成物、及び該インク組成物を用いたインクジェット記録方法
|
TWI400226B
(zh)
*
|
2008-10-17 |
2013-07-01 |
Shinetsu Chemical Co |
具有聚合性陰離子之鹽及高分子化合物、光阻劑材料及圖案形成方法
|
JP4813537B2
(ja)
|
2008-11-07 |
2011-11-09 |
信越化学工業株式会社 |
熱酸発生剤を含有するレジスト下層材料、レジスト下層膜形成基板及びパターン形成方法
|
EP2189845B1
(en)
*
|
2008-11-19 |
2017-08-02 |
Rohm and Haas Electronic Materials LLC |
Compositions and processes for photolithography
|
DE102008058177A1
(de)
*
|
2008-11-20 |
2010-06-24 |
Eos Gmbh Electro Optical Systems |
Verfahren zur Identifizierung von Lasersinterpulvern
|
WO2010061886A1
(ja)
*
|
2008-11-28 |
2010-06-03 |
日産化学工業株式会社 |
薄膜トランジスタ用ゲート絶縁膜形成組成物
|
TWI417274B
(zh)
*
|
2008-12-04 |
2013-12-01 |
Shinetsu Chemical Co |
鹽、酸發生劑及使用其之抗蝕劑材料、空白光罩,及圖案形成方法
|
GB0823282D0
(en)
*
|
2008-12-20 |
2009-01-28 |
Univ Strathclyde |
Dose responsive UV indicator
|
JP2010181843A
(ja)
*
|
2009-02-09 |
2010-08-19 |
Seiko Epson Corp |
印刷版の製造方法および印刷版製造用光硬化性液体
|
JP5368270B2
(ja)
*
|
2009-02-19 |
2013-12-18 |
信越化学工業株式会社 |
新規スルホン酸塩及びその誘導体、光酸発生剤並びにこれを用いたレジスト材料及びパターン形成方法
|
ES2621939T3
(es)
|
2009-03-24 |
2017-07-05 |
Igm Malta Limited |
Nuevos fotoiniciadores oligofuncionales
|
JP5287552B2
(ja)
*
|
2009-07-02 |
2013-09-11 |
信越化学工業株式会社 |
光酸発生剤並びにレジスト材料及びパターン形成方法
|
EP2459519B1
(en)
|
2009-07-30 |
2017-11-29 |
Basf Se |
Macrophotoinitiators
|
US8772376B2
(en)
*
|
2009-08-18 |
2014-07-08 |
International Business Machines Corporation |
Near-infrared absorbing film compositions
|
JP5584573B2
(ja)
*
|
2009-12-01 |
2014-09-03 |
信越化学工業株式会社 |
ネガ型レジスト組成物及びパターン形成方法
|
US8993042B2
(en)
*
|
2010-01-06 |
2015-03-31 |
Toyota Motor Engineering & Manufacturing North America, Inc. |
Method for determining the production parameters for a substrate coating process
|
JP5598350B2
(ja)
*
|
2010-02-16 |
2014-10-01 |
信越化学工業株式会社 |
電子線用又はeuv用化学増幅ネガ型レジスト組成物及びパターン形成方法
|
CN103119080B
(zh)
*
|
2010-09-24 |
2015-07-29 |
电气化学工业株式会社 |
能量射线固化性树脂组合物与使用该组合物的粘合剂及固化体
|
CN102241562A
(zh)
*
|
2011-05-18 |
2011-11-16 |
常州大学 |
对称性芳基碘鎓盐酸盐的制备方法
|
BR112013032523B1
(pt)
|
2011-06-21 |
2021-02-02 |
Basf Se |
método para a formação de uma microestrutura de relevo de superfície
|
AU2013276625B2
(en)
|
2012-06-14 |
2017-09-14 |
Basf Se |
Method for manufacturing security elements and holograms
|
KR102091871B1
(ko)
|
2012-07-26 |
2020-03-20 |
덴카 주식회사 |
수지 조성물
|
WO2014041121A1
(en)
|
2012-09-17 |
2014-03-20 |
Basf Se |
Security elements and method for their manufacture
|
EP2909165B1
(en)
|
2012-10-19 |
2018-05-30 |
IGM Group B.V. |
Hybrid photoinitiators
|
EP2912011A4
(en)
*
|
2012-10-27 |
2016-11-09 |
Ground Fluor Pharmaceuticals Inc |
METHODS AND REAGENTS FOR MANUFACTURING DIARYLIODONIUM SALTS
|
CN105051087A
(zh)
|
2012-12-18 |
2015-11-11 |
巴斯夫欧洲公司 |
基于萘二酰亚胺-亚乙烯基-低聚噻吩-亚乙烯基聚合物的半导体材料
|
CN114181249A
(zh)
|
2012-12-19 |
2022-03-15 |
Igm集团公司 |
双酰基次膦酸的衍生物、其制备及其作为光敏引发剂的用途
|
CN105392851B
(zh)
|
2013-05-21 |
2018-09-11 |
巴斯夫欧洲公司 |
安全元件及其生产方法
|
US9796740B2
(en)
|
2013-07-08 |
2017-10-24 |
Basf Se |
Liquid bisacylphosphine oxide photoinitiator
|
KR102072599B1
(ko)
*
|
2013-07-11 |
2020-02-04 |
동우 화인켐 주식회사 |
롤 프린팅용 잉크 조성물
|
EP3052701B1
(en)
|
2013-10-04 |
2017-06-28 |
Basf Se |
High gloss metal effect papers
|
CN104628517A
(zh)
*
|
2013-11-08 |
2015-05-20 |
上海予利化学科技有限公司 |
阳离子光引发剂4-异丙基苯基-4’-甲基苯基碘鎓对甲苯磺酸盐的制备方法
|
JP6046646B2
(ja)
*
|
2014-01-10 |
2016-12-21 |
信越化学工業株式会社 |
オニウム塩、化学増幅型ポジ型レジスト組成物、及びパターン形成方法
|
CN105916937B
(zh)
|
2014-01-23 |
2018-11-16 |
电化株式会社 |
树脂组合物
|
CN107428892B
(zh)
*
|
2015-03-23 |
2021-05-04 |
陶氏环球技术有限责任公司 |
用于三维打印的光固化性组合物
|
CN107429491A
(zh)
|
2015-03-30 |
2017-12-01 |
巴斯夫欧洲公司 |
高光泽金属效应纸和板
|
US10106643B2
(en)
*
|
2015-03-31 |
2018-10-23 |
3M Innovative Properties Company |
Dual-cure nanostructure transfer film
|
US20160319414A1
(en)
*
|
2015-04-28 |
2016-11-03 |
Case Western Reserve University |
Poly (Acrylic Acid) Modified Cellulose Fiber Materials
|
US10604659B2
(en)
|
2015-06-08 |
2020-03-31 |
Dsm Ip Assets B.V. |
Liquid, hybrid UV/VIS radiation curable resin compositions for additive fabrication
|
WO2016200972A1
(en)
*
|
2015-06-08 |
2016-12-15 |
Dsm Ip Assets B.V. |
Liquid, hybrid uv/vis radiation curable resin compositions for additive fabrication
|
US20170021656A1
(en)
|
2015-07-24 |
2017-01-26 |
Kevin Ray |
Lithographic imaging and printing with negative-working photoresponsive printing members
|
AT517626B1
(de)
*
|
2015-09-02 |
2017-06-15 |
Technische Universität Wien |
Verwendung neuer Aryliodonium- und Sulfoniumsalze als Photoinitiatoren
|
CN105884570B
(zh)
*
|
2016-04-20 |
2019-04-05 |
华东理工大学 |
含氟二芳基碘盐及其用途
|
DE102016111590A1
(de)
|
2016-06-24 |
2017-12-28 |
Delo Industrie Klebstoffe Gmbh & Co. Kgaa |
Einkomponentenmasse auf Basis von Alkoxysilanen und Verfahren zum Fügen oder Vergießen von Bauteilen unter Verwendung der Masse
|
JP7084402B2
(ja)
*
|
2016-12-22 |
2022-06-14 |
イラミーナ インコーポレーテッド |
インプリント装置
|
DE102017126215A1
(de)
|
2017-11-09 |
2019-05-09 |
Delo Industrie Klebstoffe Gmbh & Co. Kgaa |
Verfahren zur Erzeugung opaker Beschichtungen, Verklebungen und Vergüsse sowie härtbare Masse zur Verwendung in dem Verfahren
|
EP3784499A1
(en)
|
2018-04-25 |
2021-03-03 |
Basf Se |
Process for the production of strongly adherent (embossed) films on flexible substrates
|
KR20210065126A
(ko)
|
2018-09-24 |
2021-06-03 |
바스프 에스이 |
3d 인쇄에 사용하기 위한 uv 경화성 조성물
|
WO2020064522A1
(en)
|
2018-09-24 |
2020-04-02 |
Basf Se |
Photocurable composition for use in 3d printing
|
MX2021004736A
(es)
|
2018-10-25 |
2021-06-04 |
Basf Se |
Composiciones, que comprenden nanoplaquetas de plata.
|
DE102018127854A1
(de)
|
2018-11-08 |
2020-05-14 |
Delo Industrie Klebstoffe Gmbh & Co. Kgaa |
Feuchtigkeitshärtbare Einkomponentenmasse und Verfahren zum Fügen, Vergießen und Beschichten unter Verwendung der Masse
|
US20220064367A1
(en)
|
2018-12-10 |
2022-03-03 |
Delo Industrie Klebstoffe Gmbh & Co. Kgaa |
Cationically curable composition and method for the joining, casting and coating of substrates using the composition
|
JP7161392B2
(ja)
*
|
2018-12-20 |
2022-10-26 |
クラレノリタケデンタル株式会社 |
エネルギー線硬化性立体造形用組成物
|
EP3680274A1
(en)
|
2019-01-14 |
2020-07-15 |
Basf Se |
Hydroxyurethane (meth)acrylate prepolymers for use in 3d printing
|
EP3680263A1
(en)
|
2019-01-14 |
2020-07-15 |
Basf Se |
Limonene-based (meth)acrylates for use in 3d printing
|
EP3914458B1
(en)
|
2019-01-21 |
2022-12-21 |
Basf Se |
Security element
|
US20220088957A1
(en)
|
2019-01-29 |
2022-03-24 |
Basf Se |
Security element
|
US20220220284A1
(en)
|
2019-05-06 |
2022-07-14 |
Basf Se |
Compositions, comprising silver nanoplatelets
|
WO2021020975A1
(en)
*
|
2019-07-30 |
2021-02-04 |
Damar Industries Limited |
Rapid cure paint technology
|
JP2023500370A
(ja)
|
2019-11-07 |
2023-01-05 |
ビーエーエスエフ ソシエタス・ヨーロピア |
3d印刷で使用するための水洗可能な組成物
|
KR20220101662A
(ko)
|
2019-11-14 |
2022-07-19 |
메르크 파텐트 게엠베하 |
알칼리-가용성 아크릴 수지를 포함하는 dnq-타입 포토레지스트 조성물
|
CN115279518A
(zh)
|
2020-04-23 |
2022-11-01 |
巴斯夫欧洲公司 |
包含片状过渡金属颗粒的组合物
|
FR3121623B1
(fr)
*
|
2021-04-09 |
2023-06-16 |
S A S 3Dceram Sinto |
Composition durcissable pour la fabrication, par stereolithographie, de pieces crues en materiau ceramique ou metallique par voie photo-thermique
|
US20230017655A1
(en)
*
|
2021-07-12 |
2023-01-19 |
Raytheon Company |
Ultraviolet curable epoxy dielectric ink
|
TWI820512B
(zh)
*
|
2021-11-10 |
2023-11-01 |
位元奈米科技股份有限公司 |
電容感應辨識標籤
|
DE102021006273A1
(de)
*
|
2021-12-21 |
2023-06-22 |
Lohmann Gmbh & Co. Kg |
Indikatormischung
|
CN114315584A
(zh)
*
|
2021-12-30 |
2022-04-12 |
宁波南大光电材料有限公司 |
一种光敏剂及其制备方法
|
WO2023170132A1
(en)
|
2022-03-10 |
2023-09-14 |
Basf Se |
Casting lacquer for screen printing
|
KR20230143709A
(ko)
|
2022-04-06 |
2023-10-13 |
이피캠텍 주식회사 |
광개시제용 디페닐요오도늄 염 및 그의 제조 방법
|