MY8600554A - Semiconductor integrated circuit device and a method of manufacture thereof - Google Patents
Semiconductor integrated circuit device and a method of manufacture thereofInfo
- Publication number
- MY8600554A MY8600554A MY8600554A MY8600554A MY8600554A MY 8600554 A MY8600554 A MY 8600554A MY 8600554 A MY8600554 A MY 8600554A MY 8600554 A MY8600554 A MY 8600554A MY 8600554 A MY8600554 A MY 8600554A
- Authority
- MY
- Malaysia
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit device
- manufacture
- input
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
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- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
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- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9535781A JPS57211248A (en) | 1981-06-22 | 1981-06-22 | Semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
MY8600554A true MY8600554A (en) | 1986-12-31 |
Family
ID=14135390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MY8600554A MY8600554A (en) | 1981-06-22 | 1986-12-30 | Semiconductor integrated circuit device and a method of manufacture thereof |
Country Status (10)
Country | Link |
---|---|
US (1) | US4893168A (xx) |
JP (1) | JPS57211248A (xx) |
KR (1) | KR910000155B1 (xx) |
DE (1) | DE3223276A1 (xx) |
FR (1) | FR2508255B1 (xx) |
GB (1) | GB2104284B (xx) |
HK (1) | HK54686A (xx) |
IT (1) | IT1152980B (xx) |
MY (1) | MY8600554A (xx) |
SG (1) | SG20786G (xx) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5864047A (ja) * | 1981-10-13 | 1983-04-16 | Nec Corp | マスタ−スライス半導体集積回路装置 |
JPS5897847A (ja) * | 1981-12-08 | 1983-06-10 | Nec Corp | 集積回路装置 |
JPS58124263A (ja) * | 1982-01-20 | 1983-07-23 | Toshiba Corp | 半導体装置 |
JPS58213448A (ja) * | 1982-06-07 | 1983-12-12 | Hitachi Ltd | 負荷駆動方式 |
US4409499A (en) * | 1982-06-14 | 1983-10-11 | Standard Microsystems Corporation | High-speed merged plane logic function array |
JPS5941852A (ja) * | 1982-06-24 | 1984-03-08 | ストレイジ・テクノロジ−・パ−トナ−ズ | 集積回路チツプ |
US4870471A (en) * | 1982-09-30 | 1989-09-26 | Mitsubishi Denki Kabushiki Kaisha | Complementary metal-oxide semiconductor integrated circuit device with isolation |
US5281545A (en) * | 1982-12-10 | 1994-01-25 | Ricoh Company, Ltd. | Processes for manufacturing a semiconductor device |
JPS59139646A (ja) * | 1983-01-31 | 1984-08-10 | Hitachi Micro Comput Eng Ltd | 半導体集積回路装置 |
KR910008521B1 (ko) * | 1983-01-31 | 1991-10-18 | 가부시기가이샤 히다찌세이사꾸쇼 | 반도체집적회로 |
US4568961A (en) * | 1983-03-11 | 1986-02-04 | Rca Corporation | Variable geometry automated universal array |
JPS59167122A (ja) * | 1983-03-11 | 1984-09-20 | Nec Corp | 入出力バツフア− |
JPS607147A (ja) * | 1983-06-24 | 1985-01-14 | Mitsubishi Electric Corp | 半導体装置 |
EP0148927A4 (en) * | 1983-07-14 | 1985-11-25 | Advanced Micro Devices Inc | SEMICONDUCTOR BOARD WITH NON-SPECIALIZED INPUT / TASK CELLS. |
JPS6027145A (ja) * | 1983-07-25 | 1985-02-12 | Hitachi Ltd | 半導体集積回路装置 |
US5610089A (en) * | 1983-12-26 | 1997-03-11 | Hitachi, Ltd. | Method of fabrication of semiconductor integrated circuit device |
US5276346A (en) * | 1983-12-26 | 1994-01-04 | Hitachi, Ltd. | Semiconductor integrated circuit device having protective/output elements and internal circuits |
JPS61111576A (ja) * | 1984-10-13 | 1986-05-29 | Fujitsu Ltd | 半導体装置 |
JPS61218143A (ja) * | 1985-03-25 | 1986-09-27 | Hitachi Ltd | 半導体集積回路装置 |
JPS6289341A (ja) * | 1985-10-15 | 1987-04-23 | Mitsubishi Electric Corp | マスタスライス方式大規模半導体集積回路装置の製造方法 |
JPH0638453B2 (ja) * | 1986-05-12 | 1994-05-18 | 日本電気株式会社 | 半導体装置 |
US4862197A (en) * | 1986-08-28 | 1989-08-29 | Hewlett-Packard Co. | Process for manufacturing thermal ink jet printhead and integrated circuit (IC) structures produced thereby |
JPS63108733A (ja) * | 1986-10-24 | 1988-05-13 | Nec Corp | 半導体集積回路 |
JPH0758734B2 (ja) * | 1987-02-23 | 1995-06-21 | 株式会社東芝 | 絶縁ゲ−ト型セミカスタム集積回路 |
US5243208A (en) * | 1987-05-27 | 1993-09-07 | Hitachi, Ltd. | Semiconductor integrated circuit device having a gate array with a ram and by-pass signal lines which interconnect a logic section and I/O unit circuit of the gate array |
EP0338817B1 (en) * | 1988-04-22 | 1999-09-08 | Fujitsu Limited | Master slice semiconductor integrated circuit device |
JPH01289138A (ja) * | 1988-05-16 | 1989-11-21 | Toshiba Corp | マスタースライス型半導体集積回路 |
US5162893A (en) * | 1988-05-23 | 1992-11-10 | Fujitsu Limited | Semiconductor integrated circuit device with an enlarged internal logic circuit area |
JPH01293647A (ja) * | 1988-05-23 | 1989-11-27 | Fujitsu Ltd | 半導体装置 |
US5300796A (en) * | 1988-06-29 | 1994-04-05 | Hitachi, Ltd. | Semiconductor device having an internal cell array region and a peripheral region surrounding the internal cell array for providing input/output basic cells |
US5019889A (en) * | 1988-06-29 | 1991-05-28 | Hitachi, Ltd. | Semiconductor integrated circuit device |
EP0360164A3 (en) * | 1988-09-20 | 1990-07-04 | National Semiconductor Corporation | Standard cell output driver connection system |
US4987578A (en) * | 1988-10-07 | 1991-01-22 | Advanced Micro Devices, Inc. | Mask programmable bus control gate array |
JPH07111971B2 (ja) * | 1989-10-11 | 1995-11-29 | 三菱電機株式会社 | 集積回路装置の製造方法 |
US5216280A (en) * | 1989-12-02 | 1993-06-01 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device having pads at periphery of semiconductor chip |
JPH06105709B2 (ja) * | 1989-12-02 | 1994-12-21 | 東芝マイクロエレクトロニクス株式会社 | 半導体集積回路装置 |
US4988636A (en) * | 1990-01-29 | 1991-01-29 | International Business Machines Corporation | Method of making bit stack compatible input/output circuits |
JPH02223220A (ja) * | 1990-01-29 | 1990-09-05 | Hitachi Ltd | 半導体集積回路装置 |
US5153507A (en) * | 1990-11-16 | 1992-10-06 | Vlsi Technology, Inc. | Multi-purpose bond pad test die |
JP2707871B2 (ja) * | 1991-05-31 | 1998-02-04 | 富士ゼロックス株式会社 | 電子デバイス及びその製造方法 |
US5134094A (en) * | 1991-07-22 | 1992-07-28 | Silicon Power Corporation | Single inline packaged solid state relay with high current density capability |
US5220197A (en) * | 1991-07-22 | 1993-06-15 | Silicon Power Corporation | Single inline packaged solid state relay with high current density capability |
EP0533476B1 (en) * | 1991-09-18 | 1998-12-02 | Fujitsu Limited | Semiconductor integrated circuit with scan path |
US5341018A (en) * | 1991-09-18 | 1994-08-23 | Nec Corporation | Semiconductor integrated circuit device having a plurality of input circuits each including differently sized transistors |
JPH06140607A (ja) * | 1992-10-28 | 1994-05-20 | Mitsubishi Electric Corp | 半導体集積回路 |
US5404041A (en) * | 1993-03-31 | 1995-04-04 | Texas Instruments Incorporated | Source contact placement for efficient ESD/EOS protection in grounded substrate MOS integrated circuit |
US5691218A (en) * | 1993-07-01 | 1997-11-25 | Lsi Logic Corporation | Method of fabricating a programmable polysilicon gate array base cell structure |
US5436578A (en) * | 1993-07-14 | 1995-07-25 | Hewlett-Packard Corporation | CMOS output pad driver with variable drive currents ESD protection and improved leakage current behavior |
US5796129A (en) * | 1993-08-03 | 1998-08-18 | Seiko Epson Corp. | Master slice type integrated circuit system having block areas optimized based on function |
US5552333A (en) * | 1994-09-16 | 1996-09-03 | Lsi Logic Corporation | Method for designing low profile variable width input/output cells |
US5760428A (en) * | 1996-01-25 | 1998-06-02 | Lsi Logic Corporation | Variable width low profile gate array input/output architecture |
US5698873A (en) * | 1996-03-08 | 1997-12-16 | Lsi Logic Corporation | High density gate array base cell architecture |
US5796638A (en) * | 1996-06-24 | 1998-08-18 | The Board Of Trustees Of The University Of Illinois | Methods, apparatus and computer program products for synthesizing integrated circuits with electrostatic discharge capability and connecting ground rules faults therein |
US5767565A (en) * | 1996-07-22 | 1998-06-16 | Alliance Semiconductor Corporation | Semiconductor devices having cooperative mode option at assembly stage and method thereof |
US5969390A (en) * | 1997-07-22 | 1999-10-19 | Zilog, Inc. | Layout solution for electromagnetic interference reduction |
US6114731A (en) * | 1998-03-27 | 2000-09-05 | Adaptec, Inc. | Low capacitance ESD structure having a source inside a well and the bottom portion of the drain inside a substrate |
US6078068A (en) * | 1998-07-15 | 2000-06-20 | Adaptec, Inc. | Electrostatic discharge protection bus/die edge seal |
JP3914649B2 (ja) * | 1999-02-10 | 2007-05-16 | 株式会社東芝 | 半導体装置 |
JP3530450B2 (ja) * | 2000-02-18 | 2004-05-24 | Necエレクトロニクス株式会社 | マクロ回路の配線方法、マクロ回路配線装置、及びマクロ回路 |
JP4146290B2 (ja) * | 2003-06-06 | 2008-09-10 | 株式会社ルネサステクノロジ | 半導体装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3771217A (en) * | 1971-04-16 | 1973-11-13 | Texas Instruments Inc | Integrated circuit arrays utilizing discretionary wiring and method of fabricating same |
US3936812A (en) * | 1974-12-30 | 1976-02-03 | Ibm Corporation | Segmented parallel rail paths for input/output signals |
JPS5851425B2 (ja) * | 1975-08-22 | 1983-11-16 | 株式会社日立製作所 | ハンドウタイソウチ |
US4161662A (en) * | 1976-01-22 | 1979-07-17 | Motorola, Inc. | Standardized digital logic chip |
US4207556A (en) * | 1976-12-14 | 1980-06-10 | Nippon Telegraph And Telephone Public Corporation | Programmable logic array arrangement |
JPS5925381B2 (ja) * | 1977-12-30 | 1984-06-16 | 富士通株式会社 | 半導体集積回路装置 |
JPS60953B2 (ja) * | 1977-12-30 | 1985-01-11 | 富士通株式会社 | 半導体集積回路装置 |
US4249193A (en) * | 1978-05-25 | 1981-02-03 | International Business Machines Corporation | LSI Semiconductor device and fabrication thereof |
JPS55163859A (en) * | 1979-06-07 | 1980-12-20 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS561545A (en) * | 1979-06-15 | 1981-01-09 | Mitsubishi Electric Corp | Input/output buffer cell for semiconductor integrated circuit |
JPS5631730U (xx) * | 1979-07-19 | 1981-03-27 | ||
JPS5619639A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Semiconductor device |
JPS5690548A (en) * | 1979-11-20 | 1981-07-22 | Fujitsu Ltd | Manufacture of semiconductor device by master slice system |
JPS57181152A (en) * | 1981-04-30 | 1982-11-08 | Toshiba Corp | Semiconductor integrated circuit device |
-
1981
- 1981-06-22 JP JP9535781A patent/JPS57211248A/ja active Granted
-
1982
- 1982-06-02 US US06/384,680 patent/US4893168A/en not_active Expired - Lifetime
- 1982-06-14 GB GB8217205A patent/GB2104284B/en not_active Expired
- 1982-06-15 KR KR8202670A patent/KR910000155B1/ko active
- 1982-06-18 FR FR8210662A patent/FR2508255B1/fr not_active Expired
- 1982-06-21 IT IT2197182A patent/IT1152980B/it active
- 1982-06-22 DE DE19823223276 patent/DE3223276A1/de not_active Ceased
-
1986
- 1986-03-03 SG SG20786A patent/SG20786G/en unknown
- 1986-07-24 HK HK54686A patent/HK54686A/xx not_active IP Right Cessation
- 1986-12-30 MY MY8600554A patent/MY8600554A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DE3223276A1 (de) | 1983-01-05 |
KR840000985A (ko) | 1984-03-26 |
US4893168A (en) | 1990-01-09 |
GB2104284A (en) | 1983-03-02 |
FR2508255B1 (fr) | 1987-12-24 |
GB2104284B (en) | 1985-06-19 |
IT1152980B (it) | 1987-01-14 |
HK54686A (en) | 1986-08-01 |
SG20786G (en) | 1987-03-27 |
JPH0440866B2 (xx) | 1992-07-06 |
FR2508255A1 (fr) | 1982-12-24 |
IT8221971A0 (it) | 1982-06-21 |
JPS57211248A (en) | 1982-12-25 |
KR910000155B1 (ko) | 1991-01-21 |
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