MY181072A - Holding table - Google Patents
Holding tableInfo
- Publication number
- MY181072A MY181072A MYPI2015000210A MYPI2015000210A MY181072A MY 181072 A MY181072 A MY 181072A MY PI2015000210 A MYPI2015000210 A MY PI2015000210A MY PI2015000210 A MYPI2015000210 A MY PI2015000210A MY 181072 A MY181072 A MY 181072A
- Authority
- MY
- Malaysia
- Prior art keywords
- wafer
- holding
- holding table
- reinforcing portion
- annular
- Prior art date
Links
- 230000003014 reinforcing effect Effects 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 238000003672 processing method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014020641A JP6317935B2 (ja) | 2014-02-05 | 2014-02-05 | 保持テーブル |
Publications (1)
Publication Number | Publication Date |
---|---|
MY181072A true MY181072A (en) | 2020-12-17 |
Family
ID=53547291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015000210A MY181072A (en) | 2014-02-05 | 2015-01-27 | Holding table |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6317935B2 (ja) |
KR (1) | KR102175865B1 (ja) |
CN (1) | CN104816100B (ja) |
DE (1) | DE102015201833B4 (ja) |
MY (1) | MY181072A (ja) |
SG (1) | SG10201500647RA (ja) |
TW (1) | TWI637460B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6371579B2 (ja) * | 2014-05-12 | 2018-08-08 | 株式会社ディスコ | チャックテーブル |
JP6564669B2 (ja) * | 2015-10-06 | 2019-08-21 | 株式会社ディスコ | デバイスの製造方法 |
JP6672053B2 (ja) * | 2016-04-18 | 2020-03-25 | 株式会社ディスコ | ウェーハの加工方法 |
DE102016110378B4 (de) | 2016-06-06 | 2023-10-26 | Infineon Technologies Ag | Entfernen eines Verstärkungsrings von einem Wafer |
DE102016111629B4 (de) * | 2016-06-24 | 2022-10-27 | Infineon Technologies Ag | Verfahren zum Herstellen einer Halbleitervorrichtung |
JP2018101678A (ja) * | 2016-12-20 | 2018-06-28 | 株式会社ディスコ | 被加工物の加工方法 |
JP6770443B2 (ja) | 2017-01-10 | 2020-10-14 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体ウェハ |
JP7045811B2 (ja) * | 2017-07-06 | 2022-04-01 | リンテック株式会社 | 除去装置および除去方法 |
JP2019016691A (ja) * | 2017-07-06 | 2019-01-31 | リンテック株式会社 | 除去装置および除去方法 |
JP6955919B2 (ja) * | 2017-07-06 | 2021-10-27 | リンテック株式会社 | 除去装置および除去方法 |
KR102409260B1 (ko) * | 2020-05-19 | 2022-06-17 | 주식회사 에이엘티 | 타이코 웨이퍼 링 제거장치 및 타이코 웨이퍼 링 제거방법 |
KR20220048938A (ko) | 2020-10-13 | 2022-04-20 | 가부시기가이샤 디스코 | 레이저 가공 장치 |
CN112599413B (zh) * | 2021-03-04 | 2021-05-14 | 成都先进功率半导体股份有限公司 | 一种晶圆芯片切割方法 |
CN113275769B (zh) * | 2021-07-22 | 2021-09-21 | 南通智谷数控机械有限公司 | 一种智能控制清理毛边的海绵切割机 |
JP2023021607A (ja) * | 2021-08-02 | 2023-02-14 | 株式会社Screenホールディングス | 光照射装置、および、光照射方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049888A (ja) * | 1983-08-30 | 1985-03-19 | Dainippon Printing Co Ltd | レ−ザ−断裁装置 |
JPS61138489U (ja) * | 1985-02-19 | 1986-08-28 | ||
US6955956B2 (en) * | 2000-12-26 | 2005-10-18 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
JP5390740B2 (ja) | 2005-04-27 | 2014-01-15 | 株式会社ディスコ | ウェーハの加工方法 |
JP2008283025A (ja) * | 2007-05-11 | 2008-11-20 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
CN201067832Y (zh) * | 2007-07-30 | 2008-06-04 | 深圳市大族激光科技股份有限公司 | 一种激光加工用的加工平台 |
JP5544228B2 (ja) * | 2010-07-14 | 2014-07-09 | 株式会社ディスコ | ウェーハの加工方法 |
JP5686570B2 (ja) * | 2010-10-29 | 2015-03-18 | 株式会社ディスコ | ウエーハ支持プレートの使用方法 |
EP2737970B1 (en) * | 2011-07-28 | 2016-09-28 | Mitsubishi Electric Corporation | Laser machining device |
JP5606412B2 (ja) * | 2011-08-29 | 2014-10-15 | 富士フイルム株式会社 | パターン形成装置、パターン形成方法及びパターン形成基板の製造方法 |
CN202861627U (zh) * | 2012-09-21 | 2013-04-10 | 北京工业大学 | 大功率激光吸收装置 |
-
2014
- 2014-02-05 JP JP2014020641A patent/JP6317935B2/ja active Active
- 2014-12-25 TW TW103145482A patent/TWI637460B/zh active
-
2015
- 2015-01-27 MY MYPI2015000210A patent/MY181072A/en unknown
- 2015-01-27 SG SG10201500647RA patent/SG10201500647RA/en unknown
- 2015-01-27 KR KR1020150012791A patent/KR102175865B1/ko active IP Right Grant
- 2015-02-03 DE DE102015201833.4A patent/DE102015201833B4/de active Active
- 2015-02-04 CN CN201510059595.2A patent/CN104816100B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP6317935B2 (ja) | 2018-04-25 |
DE102015201833A1 (de) | 2015-08-06 |
KR102175865B1 (ko) | 2020-11-06 |
CN104816100A (zh) | 2015-08-05 |
SG10201500647RA (en) | 2015-09-29 |
TWI637460B (zh) | 2018-10-01 |
KR20150092705A (ko) | 2015-08-13 |
CN104816100B (zh) | 2019-09-06 |
JP2015147231A (ja) | 2015-08-20 |
DE102015201833B4 (de) | 2020-10-29 |
TW201532182A (zh) | 2015-08-16 |
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