EA201691781A1 - Способ резки ламинированного сверхтонкого стеклянного слоя - Google Patents
Способ резки ламинированного сверхтонкого стеклянного слояInfo
- Publication number
- EA201691781A1 EA201691781A1 EA201691781A EA201691781A EA201691781A1 EA 201691781 A1 EA201691781 A1 EA 201691781A1 EA 201691781 A EA201691781 A EA 201691781A EA 201691781 A EA201691781 A EA 201691781A EA 201691781 A1 EA201691781 A1 EA 201691781A1
- Authority
- EA
- Eurasian Patent Office
- Prior art keywords
- glass layer
- along
- cut
- cutting
- superhthon
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000011521 glass Substances 0.000 abstract 4
- 229920000642 polymer Polymers 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/076—Laminated glass comprising interlayers
- C03B33/078—Polymeric interlayers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sustainable Energy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Sustainable Development (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Liquid Crystal (AREA)
- Photovoltaic Devices (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Изобретение относится к способу резки многослойного материала (1) по меньшей мере из одного стеклянного слоя (1) с толщиной, меньшей или равной 0,3 мм, и по меньшей мере одного полимерного слоя (3), по меньшей мере, включающему: а) создание поверхностной царапины (2) на первой поверхности (I) стеклянного слоя (1), причем царапина (2) пролегает начиная от одной боковой кромки вдоль линии (L) разреза; b) перемещение первого лазерного луча (3), исходя из царапины (2), по первой поверхности (I) вдоль линии (L) разреза; с) охлаждение стеклянного слоя (1) вдоль линии (L) разреза, причем стеклянный слой (1) раскалывается вдоль линии (L) разреза; и причем полимерный слой (5) рассекается путем перемещения второго лазерного луча (6) вдоль линии (L) разреза.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14157625 | 2014-03-04 | ||
PCT/EP2015/050540 WO2015132008A1 (de) | 2014-03-04 | 2015-01-14 | Verfahren zum schneiden einer laminierten, ultradünnen glasschicht |
Publications (2)
Publication Number | Publication Date |
---|---|
EA201691781A1 true EA201691781A1 (ru) | 2016-12-30 |
EA032743B1 EA032743B1 (ru) | 2019-07-31 |
Family
ID=50189616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EA201691781A EA032743B1 (ru) | 2014-03-04 | 2015-01-14 | Способ резки ламинированного сверхтонкого стеклянного слоя |
Country Status (10)
Country | Link |
---|---|
US (1) | US20170066679A1 (ru) |
EP (1) | EP3114094B1 (ru) |
JP (1) | JP6785658B2 (ru) |
KR (1) | KR101854553B1 (ru) |
CN (1) | CN106061911B (ru) |
BR (1) | BR112016019541B1 (ru) |
CA (1) | CA2939574C (ru) |
EA (1) | EA032743B1 (ru) |
MX (1) | MX2016011203A (ru) |
WO (1) | WO2015132008A1 (ru) |
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US10739658B2 (en) | 2011-12-12 | 2020-08-11 | View, Inc. | Electrochromic laminates |
US10802371B2 (en) | 2011-12-12 | 2020-10-13 | View, Inc. | Thin-film devices and fabrication |
ES2657115T3 (es) | 2011-12-12 | 2018-03-01 | View, Inc. | Dispositivos de película fina y fabricación |
US20210394489A1 (en) | 2011-12-12 | 2021-12-23 | View, Inc. | Thin-film devices and fabrication |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
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TW201628751A (zh) * | 2014-11-20 | 2016-08-16 | 康寧公司 | 彈性玻璃基板之回饋控制的雷射切割 |
EP3274306B1 (en) | 2015-03-24 | 2021-04-14 | Corning Incorporated | Laser cutting and processing of display glass compositions |
EP3319911B1 (en) | 2015-07-10 | 2023-04-19 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
JP6552717B2 (ja) | 2015-08-10 | 2019-07-31 | サン−ゴバン グラス フランスSaint−Gobain Glass France | 薄型のガラス層を切断する方法 |
US10494290B2 (en) * | 2016-01-14 | 2019-12-03 | Corning Incorporated | Dual-airy-beam systems and methods for processing glass substrates |
JP6788880B2 (ja) * | 2016-04-05 | 2020-11-25 | 三星ダイヤモンド工業株式会社 | ガラス基板分割装置 |
CN106271111B (zh) * | 2016-09-26 | 2019-11-22 | 华中科技大学 | 一种多焦点激光分离夹层玻璃方法及装置 |
CN113399816B (zh) | 2016-09-30 | 2023-05-16 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
KR102428350B1 (ko) | 2016-10-24 | 2022-08-02 | 코닝 인코포레이티드 | 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션 |
US10752534B2 (en) * | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US11148228B2 (en) | 2017-07-10 | 2021-10-19 | Guardian Glass, LLC | Method of making insulated glass window units |
KR102022102B1 (ko) * | 2017-12-21 | 2019-09-17 | 주식회사 넵시스 | 레이저 빔을 이용한 절단 장치 |
DE102018104899A1 (de) * | 2018-03-05 | 2019-09-05 | Valeo Schalter Und Sensoren Gmbh | Head-up-Display für ein Kraftfahrzeug und Verfahren zum Herstellen einer Abdeckung für ein Head-up-Display |
TW201946882A (zh) * | 2018-05-07 | 2019-12-16 | 美商康寧公司 | 透明氧化物玻璃的雷射誘導分離 |
DE102018216440A1 (de) * | 2018-09-26 | 2020-03-26 | Flabeg Deutschland Gmbh | Verfahren zum Schneiden eines laminierten Verbundelements, insbesondere eines Verbundglaselements, und Schneidsystem |
JP2020071967A (ja) * | 2018-10-30 | 2020-05-07 | 三星ダイヤモンド工業株式会社 | フレキシブル有機elディスプレイの製造方法 |
JP2020071966A (ja) * | 2018-10-30 | 2020-05-07 | 三星ダイヤモンド工業株式会社 | フレキシブル有機elディスプレイの製造方法 |
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DE202019005592U1 (de) * | 2019-01-22 | 2021-02-08 | Hegla Gmbh & Co. Kg | Vorrichtung zum Bearbeiten und zum Trennen einer Verbundsicherheitsglastafel |
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CN110202878A (zh) * | 2013-03-14 | 2019-09-06 | 康宁股份有限公司 | 用于制造和切割挠性玻璃和聚合物复合结构的方法和设备 |
US9102007B2 (en) * | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
JP2017508704A (ja) * | 2014-02-20 | 2017-03-30 | コーニング インコーポレイテッド | フレキシブル薄型ガラスにおいてアール部を切断する方法および装置 |
-
2015
- 2015-01-14 CA CA2939574A patent/CA2939574C/en active Active
- 2015-01-14 US US15/122,898 patent/US20170066679A1/en not_active Abandoned
- 2015-01-14 EA EA201691781A patent/EA032743B1/ru not_active IP Right Cessation
- 2015-01-14 MX MX2016011203A patent/MX2016011203A/es unknown
- 2015-01-14 CN CN201580011655.1A patent/CN106061911B/zh not_active Expired - Fee Related
- 2015-01-14 JP JP2016555530A patent/JP6785658B2/ja active Active
- 2015-01-14 EP EP15700249.4A patent/EP3114094B1/de active Active
- 2015-01-14 BR BR112016019541-8A patent/BR112016019541B1/pt not_active IP Right Cessation
- 2015-01-14 KR KR1020167023840A patent/KR101854553B1/ko active IP Right Grant
- 2015-01-14 WO PCT/EP2015/050540 patent/WO2015132008A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
MX2016011203A (es) | 2016-12-16 |
JP6785658B2 (ja) | 2020-11-18 |
KR101854553B1 (ko) | 2018-05-03 |
CA2939574A1 (en) | 2015-09-11 |
KR20160114691A (ko) | 2016-10-05 |
JP2017514774A (ja) | 2017-06-08 |
EP3114094B1 (de) | 2022-05-18 |
BR112016019541A2 (pt) | 2017-08-15 |
CA2939574C (en) | 2019-08-20 |
US20170066679A1 (en) | 2017-03-09 |
CN106061911B (zh) | 2019-02-12 |
BR112016019541B1 (pt) | 2021-12-14 |
EP3114094A1 (de) | 2017-01-11 |
WO2015132008A1 (de) | 2015-09-11 |
CN106061911A (zh) | 2016-10-26 |
EA032743B1 (ru) | 2019-07-31 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s) |
Designated state(s): AM AZ BY KZ KG TJ TM |