MX2019008900A - Dispositivo de medicion tridimensional. - Google Patents
Dispositivo de medicion tridimensional.Info
- Publication number
- MX2019008900A MX2019008900A MX2019008900A MX2019008900A MX2019008900A MX 2019008900 A MX2019008900 A MX 2019008900A MX 2019008900 A MX2019008900 A MX 2019008900A MX 2019008900 A MX2019008900 A MX 2019008900A MX 2019008900 A MX2019008900 A MX 2019008900A
- Authority
- MX
- Mexico
- Prior art keywords
- period
- stripe pattern
- projection
- camera
- total black
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2518—Projection by scanning of the object
- G01B11/2527—Projection by scanning of the object with phase change by in-plane movement of the patern
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Se provee un dispositivo de medición tridimensional capaz de impedir una reducción en exactitud de medición durante la medición tridimensional. Un dispositivo de inspección de sustrato 1 comprende un dispositivo de proyección 4 que proyecta un patrón de franjas sobre un sustrato impreso 2; una cámara 5 que muestra una porción del sustrato impreso 2 sobre el cual se ha proyectado el patrón de franjas y un dispositivo de control 6 que efectúa varios tipos de control en el dispositivo de inspección de sustrato 1. El dispositivo de proyección 4 comprende una fuente de luz 4a que emite luz predeterminada y un DMD 4b que convierte la luz de la fuente de luz 4a en un patrón de franjas, el dispositivo de proyección proyecta el patrón de franjas sobre el sustrato impreso 2 en un número predeterminado de cuadros por unidad de tiempo. El dispositivo de control 6: establece un período de proyección del patrón de negro total de un cuadro, tal período es un período en el cual se puede proyectar un patrón negro total predeterminado antes y después de un período de proyección del patrón de franjas de un número predeterminado de cuadros; inicia la formación de imagen efectuada por la cámara 5 en el período de proyección del patrón negro total que es antes del período de proyección del patrón de franjas y finaliza la formación de imagen efectuada por la cámara 5 en el período de proyección del patrón negro total que es después del período de proyección del patrón de franjas.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017039311A JP6353573B1 (ja) | 2017-03-02 | 2017-03-02 | 三次元計測装置 |
PCT/JP2017/030703 WO2018158983A1 (ja) | 2017-03-02 | 2017-08-28 | 三次元計測装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2019008900A true MX2019008900A (es) | 2019-09-11 |
Family
ID=62779971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2019008900A MX2019008900A (es) | 2017-03-02 | 2017-08-28 | Dispositivo de medicion tridimensional. |
Country Status (7)
Country | Link |
---|---|
US (1) | US10914574B2 (es) |
JP (1) | JP6353573B1 (es) |
CN (1) | CN110291359B (es) |
DE (1) | DE112017007154T5 (es) |
MX (1) | MX2019008900A (es) |
TW (1) | TWI641802B (es) |
WO (1) | WO2018158983A1 (es) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6306230B1 (ja) * | 2017-02-09 | 2018-04-04 | Ckd株式会社 | 半田印刷検査装置、半田印刷検査方法、及び、基板の製造方法 |
CN109799239B (zh) * | 2019-01-29 | 2021-03-02 | 安徽省沃特邦电子科技有限公司 | 一种电子元件的快速检测装置 |
CN112213332A (zh) * | 2019-07-12 | 2021-01-12 | 无锡先导智能装备股份有限公司 | 表面检测设备 |
JP7371443B2 (ja) * | 2019-10-28 | 2023-10-31 | 株式会社デンソーウェーブ | 三次元計測装置 |
CN111982928A (zh) * | 2020-08-14 | 2020-11-24 | 江苏顺泰包装印刷科技有限公司 | 智能化多功能质量分析控制平台 |
CN113513987B (zh) * | 2021-07-10 | 2023-04-18 | 深慧视(深圳)科技有限公司 | 一种3d点云坐标生成装置 |
CN116858130B (zh) * | 2023-05-30 | 2024-01-09 | 中国空气动力研究与发展中心低速空气动力研究所 | 一种基于π/2互补双脉宽调制模式的三维冰形测量方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7379193B2 (en) * | 2002-02-09 | 2008-05-27 | Lang Liu | Sensing device for measuring the three-dimension shape and its measuring method |
JP4709571B2 (ja) * | 2005-04-05 | 2011-06-22 | 国立大学法人広島大学 | 視覚情報処理システム及びその視覚情報処理方法 |
EP2183544B1 (en) * | 2007-08-17 | 2015-07-15 | Renishaw PLC | Non-contact measurement apparatus and method |
CN201765193U (zh) * | 2008-11-26 | 2011-03-16 | 康代有限公司 | 用于检查物体的*** |
JP2010164350A (ja) * | 2009-01-14 | 2010-07-29 | Ckd Corp | 三次元計測装置 |
JP4744610B2 (ja) * | 2009-01-20 | 2011-08-10 | シーケーディ株式会社 | 三次元計測装置 |
EP2615412B1 (en) * | 2010-09-07 | 2016-06-01 | Dai Nippon Printing Co., Ltd. | Scanner device and device for measuring three-dimensional shape of object |
JP5994787B2 (ja) * | 2011-10-11 | 2016-09-21 | 株式会社ニコン | 形状測定装置、構造物製造システム、形状測定方法、構造物製造方法、形状測定プログラム |
JP5917116B2 (ja) * | 2011-12-06 | 2016-05-11 | キヤノン株式会社 | 情報処理装置、情報処理装置の制御方法、およびプログラム |
JP2014032159A (ja) * | 2012-08-06 | 2014-02-20 | Canon Inc | 投影撮像システム及び投影撮像システムの制御方法 |
CN104919272B (zh) * | 2012-10-29 | 2018-08-03 | 7D外科有限公司 | 集成照明及光学表面拓扑检测***及其使用方法 |
JP5780659B2 (ja) * | 2013-06-13 | 2015-09-16 | ヤマハ発動機株式会社 | 3次元形状測定装置 |
JP6618249B2 (ja) * | 2014-02-18 | 2019-12-11 | パナソニック インテレクチュアル プロパティ コーポレーション オブ アメリカPanasonic Intellectual Property Corporation of America | 投影システムおよび半導体集積回路 |
-
2017
- 2017-03-02 JP JP2017039311A patent/JP6353573B1/ja active Active
- 2017-08-28 DE DE112017007154.2T patent/DE112017007154T5/de active Pending
- 2017-08-28 CN CN201780086352.5A patent/CN110291359B/zh active Active
- 2017-08-28 WO PCT/JP2017/030703 patent/WO2018158983A1/ja active Application Filing
- 2017-08-28 MX MX2019008900A patent/MX2019008900A/es active IP Right Grant
- 2017-10-03 TW TW106134130A patent/TWI641802B/zh active
-
2019
- 2019-08-13 US US16/538,934 patent/US10914574B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE112017007154T5 (de) | 2019-11-28 |
US20190360798A1 (en) | 2019-11-28 |
WO2018158983A1 (ja) | 2018-09-07 |
CN110291359A (zh) | 2019-09-27 |
US10914574B2 (en) | 2021-02-09 |
CN110291359B (zh) | 2021-05-28 |
JP2018146289A (ja) | 2018-09-20 |
TW201833513A (zh) | 2018-09-16 |
JP6353573B1 (ja) | 2018-07-04 |
TWI641802B (zh) | 2018-11-21 |
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