KR950021343A - 정전척크 부착 세라믹 히터 - Google Patents

정전척크 부착 세라믹 히터 Download PDF

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Publication number
KR950021343A
KR950021343A KR1019940037555A KR19940037555A KR950021343A KR 950021343 A KR950021343 A KR 950021343A KR 1019940037555 A KR1019940037555 A KR 1019940037555A KR 19940037555 A KR19940037555 A KR 19940037555A KR 950021343 A KR950021343 A KR 950021343A
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KR
South Korea
Prior art keywords
electrostatic chuck
ceramic
ceramic heater
electrode
heat generating
Prior art date
Application number
KR1019940037555A
Other languages
English (en)
Inventor
노부오 가와다
쇼지 가노
고지 하기와라
노부오 아라이
주니찌 아라미
겐지 이시까와
Original Assignee
가나까와 지히로
신에쓰가가꾸고오교 가부시끼가이샤
이노우에 아끼라
도오꾜엘렉트론 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가나까와 지히로, 신에쓰가가꾸고오교 가부시끼가이샤, 이노우에 아끼라, 도오꾜엘렉트론 가부시끼가이샤 filed Critical 가나까와 지히로
Publication of KR950021343A publication Critical patent/KR950021343A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Jigs For Machine Tools (AREA)
  • Ceramic Products (AREA)

Abstract

본 발명은 반도체 프로세스에 있어서 승강온(昇降溫) 프로세스에 사용하여도 접합부에 박리가 발생하지 않는 정전척크부착 세라믹히터를 제공하는 것을 목적으로 한다. 본 발명은 정전척크부착 세라믹은 전기절연성 세라믹으로 이루어진 지지기재의 표면에 도전성 세라믹으로 이루어진 정전 척크용 전극을 접합시키고, 이면에는 도전성 세라믹으로 이루어진 발열층을 접합시키며, 그 위에 전기절연성 세라믹으로 이루어지는 피복층을 설치하여 이루어진 정전척크부착 세라믹에 있어서, 이 지지기재, 정전 척크용 전극 및 발열층의 표면거침 Rmax모두를 5㎛이상이 되도록 하여 이루어진 것을 특징으로 한다.

Description

정전척크 부착 세라믹 히터
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 정전척크부착 세라믹히터의 종단 도면이다.

Claims (5)

  1. 전기절연성 세라믹으로 이루어진 지지 기재의 표면에 도전성 세라믹으로 이루어지는 정전 척크용 전극을 접합함과 동시에, 이면에 도전선 세라믹으로 이루어진 발열층을 접합하고, 그들 위에 전기절연성 세라믹으로 이루어진 피복층을 설치한 정전척크부착 세라믹 히터에 있어서, 이 지지기재, 정전 척크용 전극 및 발열층의 표면거침Rmax를 모두 5㎛ 이상으로서 이루어짐을 특징으로 하는 정전척크부착 세라믹히터.
  2. 제1항에 있어서, 지지 기재와 피복층이 질화붕소, 질화붕소와 질화 알루미늄의 혼합물 또는 질화규소이며, 상기 정전척크용 전극 및 발열층이 흑연 또는 탄화규소인 정전척크부착 세라믹히터,
  3. 제2항에 있어서, 정전 척크용 전극, 발열층 및 피복층을 화학기상 증착법으로 제조되는 정전척크부착 세라믹히터.
  4. 제1항 또는 제2항에 있어서, 피복층위에 확산 방지층이 접합되어 있는 정전척크부착 세라믹히터.
  5. 제4항에 있어서, 확산 방지층에 산화 규소 또는 질화 규소인 정전척크부착 세라믹히터.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940037555A 1993-12-27 1994-12-27 정전척크 부착 세라믹 히터 KR950021343A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP93-330764 1993-12-27
JP33076493 1993-12-27
JP94-316374 1994-12-20
JP31637494A JPH07307377A (ja) 1993-12-27 1994-12-20 静電チャック付セラミックスヒーター

Publications (1)

Publication Number Publication Date
KR950021343A true KR950021343A (ko) 1995-07-26

Family

ID=26568634

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940037555A KR950021343A (ko) 1993-12-27 1994-12-27 정전척크 부착 세라믹 히터

Country Status (4)

Country Link
US (1) US5665260A (ko)
JP (1) JPH07307377A (ko)
KR (1) KR950021343A (ko)
TW (1) TW287294B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN113396535A (zh) * 2019-02-21 2021-09-14 京瓷株式会社 试样保持工具

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CN113396535B (zh) * 2019-02-21 2024-01-19 京瓷株式会社 试样保持工具

Also Published As

Publication number Publication date
US5665260A (en) 1997-09-09
JPH07307377A (ja) 1995-11-21
TW287294B (ko) 1996-10-01

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