KR940013306A - 편평구조방식으로 된 전자모쥴 - Google Patents
편평구조방식으로 된 전자모쥴 Download PDFInfo
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- KR940013306A KR940013306A KR1019930025433A KR930025433A KR940013306A KR 940013306 A KR940013306 A KR 940013306A KR 1019930025433 A KR1019930025433 A KR 1019930025433A KR 930025433 A KR930025433 A KR 930025433A KR 940013306 A KR940013306 A KR 940013306A
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- chip
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- 239000000463 material Substances 0.000 claims abstract 6
- 229920003002 synthetic resin Polymers 0.000 claims 9
- 239000000057 synthetic resin Substances 0.000 claims 9
- 239000000969 carrier Substances 0.000 claims 7
- 239000000853 adhesive Substances 0.000 claims 6
- 230000001070 adhesive effect Effects 0.000 claims 6
- 239000011888 foil Substances 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 5
- 229910000831 Steel Inorganic materials 0.000 claims 2
- 239000010959 steel Substances 0.000 claims 2
- 238000004512 die casting Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000007373 indentation Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 230000007246 mechanism Effects 0.000 claims 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- G—PHYSICS
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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Abstract
극단적인 편평구조방식에도 불구하고 전자모쥴(M)의 합성수지케이싱(10)내에 매설된 반도체-칩(1)의 파손경향은 현저하게 감소될 것이다. 이 칩은 시스템 반송체(20)의 칩-아일랜드위에 강판구조(리드프레임)의 형태로 조립되어 있다.
-칩에 의하여 부분적으로 카버되어질 수 있는 -외측접촉부(21)는 모쥴케이싱(10)의 하나의 편평측면에 하나의 평면에 놓여있다. 시스템 반송체의 강판에서 불가핀한 췌약선을 나타내며 칩-아일랜드(22)를 경계하고 있는 간극(22)은 정방형의 또는 장방형의 칩(1)의 모서리에 대하여 사선방향으로 (바람직하게는 45°하에서)지나가며 그리고 이로서 칩 재료중의 단결정구조에 의하여 주어지며 그리고 칩-모서리에 평행하게 지나는 가능한 파단선에 대하여 역시 사선방향으로 되어 있다.
강판중에 간극(23)으로부터 출발하는 또다른 간극(24)은 목적에 맞게 마찬가지로 칩-카아드에 사선방향으로 지난다. 또다른 조처들을 시스템 반송체(20)의 부분들과 모쥴 케이싱(10)사이의 기계적인 연결에 관한 것이며 그리고 또 반송체 몸체에의 주입시에 둘러싸는 합성수지재료와 전체의 모쥴(M)의 연결(예를 들면 칩 카아드-제조)에 관한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 실시예 1에 따르는 시스템 반송체의 실시예를 나타내며,
제2도 및 제3도는 제1도에 의한 시스템 반송체로부터 출발하여 예를 들면 전자모쥴의 연속하는 제조단계의 부분도를 보이며,
제6도는 실시예 1에 따르는 전자모쥴의 사시도이다.
Claims (17)
- 합성수지케이싱(10)의 하나의 편평측(12)에 있는 하나의 평면에 놓여있으며 편평한 강판구조의 형상으로 된 시스템 반송체(20,20′)로부터 형성되어 있는 외측접촉부(21)를 가지며, 그리고 칩-아일랜드(22)를 거쳐서 시스템 반송체(20,20′)의 하나의 편평측상에 조립되어 있으며 케이싱(10)의 합성수지재료에 의하여 주위에 압축되며 그리고 외측 접촉부들(21)과 연결되어 있는 반도체-칩(1)을 가지는 편평구조방식으로 된 전자 모쥴에 있어서, 적어도 칩-아일랜드(22)를 제한하고 있으며, 이것을 외측접촉부(21)로부터 분리하고 있는, 시스템 반송체(20,20′)내에 있는 간극(23)이 정사각형의 또는 구형의 칩(1)의 모서리에 대하여 사면으로, 바람직하게는 약 45°로 지나고 있는 것을 특징으로 하는 전자모쥴.
- 칩-아일랜드(22)의 양측에 배열되어 있으며 외측 접촉부(21)의 평행한 2개의 열을 가지는 제1항에 있어서, 칩-아일랜드(22)는 대체로 정사각형이며, 그리고 상술한 열에 대하여 수직이거나 내지 평행으로 된 대각선들을 가지고 배열되어 있는 것을 특징으로 하는 전자모쥴.
- 제1항 또는 제2항에 있어서, 칩-아일랜드(22)를 경계하고 있는 상술한 간극(23)으로부터 출발하고 있으며 외측접촉부(21)를 분리하고 있는 간극(24)이 적어도 부분적으로 금이 새겨진 선들을 따라서 지나고 있는 것을 특징으로 하는 전자모쥴.
- 제1항에 있어서, 칩-아일랜드(22)와 인접하여 있는 범위에 있는 외측접촉부(21), 그리고 칩-아일랜드(22)와 연결되어 있는 시스템 반송체(20)의 범위(25)는 통공들(31)을 가지며 이 통공들은 합성수지케이싱(10)의 압축재료로서 채워져 있으며, 여기서 통공의 횡단면에 있는 압축재료는 접촉부(21)의 외측과 결합하여 놓여있는 것을 특징으로 하는 전자모쥴.
- 제1항에 있어서, 반도체-칩(1)은 절연되는 접착박지(2,2′)을 사용하여 칩-아일랜드(22)위에 장착되어 있는 것을 특징으로 하는 전자모쥴.
- 제5항에 있어서, 반도체-칩(1)이 칩-아일랜드(22)를 측방으로 지나서 돌출하며 절연하는 접착박지(2,2′)를 거쳐서 역시 외측 접촉부(21)의 인접한 범위에 부착되는 것을 특징으로 하는 전자모쥴.
- 제5항에 있어서, 접착박지(2′)는 통과하면서 역시 외측접촉부(21)위에 뻗쳐있으며 그리고 이것과는 대체로 아주 편평하게 결합되어 있는 것을 특징으로 하는 전자모쥴.
- 제5항 내지 제7항중의 어느 하나의 항에 있어서, 접착박지(2,2′) 및/또는 그의 접착재료층은 작은 전기전도도를 가지는 것을 특징으로 하는 전자모쥴.
- 합성수지 케이싱(10)과 중심이 맞추어진 편평한 합성수지-대상물에로의 주입을 하게 되어 있는 전항들중의 어느 하나의 항에 의한 전자모쥴에 있어서, 시스템 반송체(20,20′)는 케이싱 가장자리의 외측에 놓여있는 돌출부들(26,27,26′,34)을 형성하며, 이 돌기부들은 케이싱의 반대편에 놓여있는 편평측면(11)에의 방향으로 굽어져 있는 것을 특징으로 하는 전자모쥴.
- 제9항에 있어서, 상술한 돌출부들(26,27,26′,34)의 적어도 일부는 통공들(29,17) 또는 요입부(29′)를 굴곡부의 범위에 가지는 것을 특징으로 하는 전자모쥴.
- 제8항 또는 제10항에 있어서, 접착박지(2′)는 역시 돌출부들(34)의 적어도 일부를 거쳐서 이들의 통공들(17)의 범위에서 뻗쳐있는 것을 특징으로 하는 전자모쥴.
- 제9항에 있어서, 상기한 돌출부들(26,26′,27)의 적어도 일부분은 외측 접촉부들(21)과 기계적으로 연결되어 있는 것을 특징으로 하는 전자모쥴.
- 제9항에 있어서, 케이싱(10)에 관하여 서로 반대편에 놓여있는 2개의 돌출부들(27)은 이들의 단부의 범위에 중심조정개구들(36)이 형성되어 있으며, 이 개구들은 모쥴을 수용하고 있는 다이캐스팅형(44,45)의 중심조정 기구들(46)의 파지를 위한 것으로 정해져 있는 것을 특징으로 하는 전자모쥴.
- 안에 전자모쥴(M)이 제9항 내지 제13항중의 어느 하나의 항에 의하여 주입되어지는 특히 크레디트카아드 형상으로 된 편평한 합성수지대상물에 있어서, 이 대상물의 주입재료의 두께는 전자모쥴의 두께와 동일한 것을 특징으로 하는 편평한 합성수지 대상물.
- 전자모쥴의 외측접촉부(21)는 합성수지케이싱(10)과 연결되어 있으며 그리고 편평한 강판구조의 형상으로 된 시스템 반송체(20,20′)로부터 형성되어 있으며, 여기서 이 시스템 반송체(20,20′)상에는 케이싱(10)에 의하여 둘러쌓여진 반도체-칩(1)이 조립되어 있는, 편평구조방식으로 된 전자모쥴에 있어서, 시스템 반송체(20,20′)는 조립자동기계와의 공동작용을 위하여 정하여진, 합성수지케이싱(10)의 외부에 있는 돌출부들(27)을 가지며, 이 돌출부들은 파지구윤곽체 및/또는 위치조정윤곽체(35,36)를 갖추고 있으며 이 윤곽체들은 모쥴(M)의 외측윤곽(21)에 대하여 정확한 위치관계가 성립하는 것을 특징으로 하는 전자모쥴.
- 제15항에 있어서, 편평한 합성수지케이싱(10)의 2개의 서로 반대편에 놓여있는 가장자리마다 떨어져 있는 2개의 돌출부(27)가 존재하는 것을 특징으로 하는 전자모쥴.
- 제15항 또는 제16항에 있어서, 돌출부들(27)의 외측접촉부(21)중의 하나로부터 각각 나오며 합성수지케이싱(10)의 외측에서 케이싱의 두께에 걸쳐서 절곡되어 있으며 그리고 이들의 단부를 가지고는 외측 접촉부들(21)의 반대측에 놓여있는 하나의 케이싱-편평측(11)의 평면으로 도달하는 것을 특징으로 하는 전자모쥴.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CH363392A CH686325A5 (de) | 1992-11-27 | 1992-11-27 | Elektronikmodul und Chip-Karte. |
CH03633/92-9 | 1992-11-27 |
Publications (2)
Publication Number | Publication Date |
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KR940013306A true KR940013306A (ko) | 1994-06-25 |
KR0174761B1 KR0174761B1 (ko) | 1999-02-01 |
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KR1019930025433A KR0174761B1 (ko) | 1992-11-27 | 1993-11-26 | 초박형 구조로된 전자모쥴 |
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US (1) | US5550402A (ko) |
EP (4) | EP0599194A1 (ko) |
JP (1) | JP2515086B2 (ko) |
KR (1) | KR0174761B1 (ko) |
AT (1) | ATE192883T1 (ko) |
AU (2) | AU671868B2 (ko) |
CA (1) | CA2109761C (ko) |
CH (1) | CH686325A5 (ko) |
DE (1) | DE59310040D1 (ko) |
IL (1) | IL107696A (ko) |
MY (1) | MY111079A (ko) |
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-
1993
- 1993-11-18 AT AT98101884T patent/ATE192883T1/de active
- 1993-11-18 EP EP93118564A patent/EP0599194A1/de not_active Withdrawn
- 1993-11-18 EP EP00106889A patent/EP1028462A1/de not_active Withdrawn
- 1993-11-18 EP EP95118345A patent/EP0706214A3/de not_active Withdrawn
- 1993-11-18 EP EP98101884A patent/EP0843358B1/de not_active Expired - Lifetime
- 1993-11-18 DE DE59310040T patent/DE59310040D1/de not_active Expired - Fee Related
- 1993-11-19 JP JP5290842A patent/JP2515086B2/ja not_active Expired - Lifetime
- 1993-11-22 IL IL107696A patent/IL107696A/en not_active IP Right Cessation
- 1993-11-22 AU AU51848/93A patent/AU671868B2/en not_active Ceased
- 1993-11-23 CA CA002109761A patent/CA2109761C/en not_active Expired - Fee Related
- 1993-11-23 US US08/156,295 patent/US5550402A/en not_active Expired - Fee Related
- 1993-11-26 MY MYPI93002490A patent/MY111079A/en unknown
- 1993-11-26 KR KR1019930025433A patent/KR0174761B1/ko not_active IP Right Cessation
-
1996
- 1996-07-04 AU AU58375/96A patent/AU688682B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
IL107696A (en) | 1998-02-22 |
ATE192883T1 (de) | 2000-05-15 |
EP1028462A1 (de) | 2000-08-16 |
KR0174761B1 (ko) | 1999-02-01 |
US5550402A (en) | 1996-08-27 |
CA2109761C (en) | 1998-01-06 |
EP0599194A1 (de) | 1994-06-01 |
MY111079A (en) | 1999-08-30 |
EP0706214A3 (de) | 1998-01-14 |
EP0843358B1 (de) | 2000-05-10 |
EP0843358A2 (de) | 1998-05-20 |
EP0706214A2 (de) | 1996-04-10 |
CA2109761A1 (en) | 1994-05-28 |
AU688682B2 (en) | 1998-03-12 |
IL107696A0 (en) | 1994-02-27 |
AU5184893A (en) | 1994-06-09 |
CH686325A5 (de) | 1996-02-29 |
JPH06236958A (ja) | 1994-08-23 |
AU671868B2 (en) | 1996-09-12 |
AU5837596A (en) | 1996-09-05 |
JP2515086B2 (ja) | 1996-07-10 |
EP0843358A3 (de) | 1998-05-27 |
DE59310040D1 (de) | 2000-06-15 |
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