KR960039305A - 반도체 장치 및 그 제조 방법 - Google Patents
반도체 장치 및 그 제조 방법 Download PDFInfo
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- KR960039305A KR960039305A KR1019960011934A KR19960011934A KR960039305A KR 960039305 A KR960039305 A KR 960039305A KR 1019960011934 A KR1019960011934 A KR 1019960011934A KR 19960011934 A KR19960011934 A KR 19960011934A KR 960039305 A KR960039305 A KR 960039305A
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- Prior art keywords
- pads
- concave portion
- semiconductor device
- semiconductor chip
- concave
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract 5
- 239000004593 Epoxy Substances 0.000 claims abstract 7
- 238000004382 potting Methods 0.000 claims abstract 7
- 239000011521 glass Substances 0.000 claims abstract 5
- 239000002184 metal Substances 0.000 claims abstract 5
- 239000000463 material Substances 0.000 claims abstract 4
- 239000004642 Polyimide Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract 2
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
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- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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Abstract
본 발명의 반도체 장치는, 중앙이 오목형으로 소정 깊이로 홈파기 가공된 유리 에폭시 재료(3)와, 유리 에폭시 재료(3)의 오목형 부재에 배열된 다수의 본딩패드(5)와, 유리 에폭시 재료(3)의 오목형부 내에, 소자 영역이 본딩 패드(5)의 열에 대향하도록 배치되며, 본딩 패드(5)에 구형 금속(12)을 통해 전기적으로 접속된 콘택트 패드(1)를 갖는 반도체 소자(6)와, 반도체 소자(6)를 완전히 피복하도록 오목형부 내에 유입된 포팅제(2)를 구비한다. 본 발명을 사용함으로써, 외위기의 외형 치수의 축소, 제조 공정 감소 및 포팅제의 미충전 방지에 의한 신뢰성의 향상 등의 효과를 얻을 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예를 도시한 반도체 장치의 평면도 및 단면도.
Claims (5)
- 반도체 장치에 있어서, 중앙이 오목형으로 소정 깊이로 홈파기 가공된 외위기(3)와, 상기 외위기의 오목형부 내에 배열된 다수의 제1패드(5)와, 상기 외위기(3)의 오목형부 내에, 소자 영역이 상기 제1패드(5)의 열에 대향하도록 배치되며 상기 제1패드(5)에 금속 볼(12)을 통해 전기적으로 접속된 제2패드(1)를 갖는 반도체 칩(6)과, 상기 반도체 칩(6)을 완전히 피복하도록 상기 오목형부 내에 유입된 포팅 부재(2)를 구비하는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 상기 외위기(2)는 유리 에폭시 재료로 구성되어 있는 것을 특징으로 하는 반도체 장치.
- 반도체 장치의 제조 방법에 있어서, 중앙이 오목형으로 소정 깊이로 홈파기 가공되며 이 오목형부 내에 다수의 패드가 형성된 외위기의 상기 오목형부 내에, 반도체 칩을 이 소자 영역이 상기 패드의 열에 대향하도록 배치하면서 상기 패드에 금속 볼을 통해 전기적으로 접속하는 공정과, 상기 오목형부 내에 포팅 부재를 유입함과 동시에 상기 외위기의 중앙에 형성된 관통 구멍에서 흡인함으로써 상기 반도체 칩을 상기 포팅 부재로 완전히 피복하는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 반도체 장치의 제조 방법에 있어서, 유리 에폭시판을 중앙이 오목형으로 소정 깊이가 되도록 홈파기 가공함으로써 외위기를 형성하는 공정과, 상기 외위기의 오목형부 내에 다수의 패드를 형성하는 공정과, 상기 외위기의 오목형부 내에 소정 높이의 절연 부재를 배치하는 공정과, 반도체 칩의 다수의 콘택트 패드상에 금속 볼을 배치하는 공정과, 상기 절연 부재상에 상기 반도체 칩을 탑재시키면서 상기 다수의 패드와 상기 콘택트 패드를 서로 대향시켜 상기 금속 볼을 통해 전기적으로 접속하는 공정과, 상기 오목형부 내에 포팅 부재를 유입함과 동시에 상기 외위기의 중앙에 형성된 관통 구멍에서 흡인함으로써 상기 반도체 칩을 상기 포팅 부재로 완전히 피복하는 공정을 구비하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제4항에 있어서, 상기 절연 부내는 폴리이미드 테이프로 구성되어 있는 것을 특징으로 하는 반도체 장치의 제조 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP95-096367 | 1995-04-21 | ||
JP7096367A JPH08293524A (ja) | 1995-04-21 | 1995-04-21 | 半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
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KR960039305A true KR960039305A (ko) | 1996-11-25 |
KR100200254B1 KR100200254B1 (ko) | 1999-06-15 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960011934A KR100200254B1 (ko) | 1995-04-21 | 1996-04-19 | 반도체 장치 및 그 제조 방법 |
Country Status (4)
Country | Link |
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US (1) | US5834835A (ko) |
JP (1) | JPH08293524A (ko) |
KR (1) | KR100200254B1 (ko) |
TW (1) | TW390004B (ko) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05335183A (ja) * | 1992-05-28 | 1993-12-17 | Murata Mfg Co Ltd | 多層基板を備えた電子部品及びその製造方法 |
FR2748156B1 (fr) * | 1996-04-26 | 1998-08-07 | Suisse Electronique Microtech | Dispositif comprenant deux substrats destines a former un microsysteme ou une partie d'un microsysteme et procede d'assemblage de deux substrats micro-usines |
JPH1064956A (ja) * | 1996-08-20 | 1998-03-06 | Fujitsu Ltd | フェースダウンボンディング半導体装置 |
US6124546A (en) * | 1997-12-03 | 2000-09-26 | Advanced Micro Devices, Inc. | Integrated circuit chip package and method of making the same |
US6057175A (en) * | 1997-12-04 | 2000-05-02 | Medtronic, Inc. | Method of making encapsulated package |
US6586829B1 (en) * | 1997-12-18 | 2003-07-01 | Si Diamond Technology, Inc. | Ball grid array package |
US6150724A (en) * | 1998-03-02 | 2000-11-21 | Motorola, Inc. | Multi-chip semiconductor device and method for making the device by using multiple flip chip interfaces |
JP3610787B2 (ja) * | 1998-03-24 | 2005-01-19 | セイコーエプソン株式会社 | 半導体チップの実装構造体、液晶装置及び電子機器 |
GB2340996B (en) * | 1998-08-26 | 2003-07-09 | Lsi Logic Corp | Low skew signal distribution circuits |
JP2000223657A (ja) * | 1999-02-03 | 2000-08-11 | Rohm Co Ltd | 半導体装置およびそれに用いる半導体チップ |
JP2000260912A (ja) * | 1999-03-05 | 2000-09-22 | Fujitsu Ltd | 半導体装置の実装構造及び半導体装置の実装方法 |
US6392289B1 (en) | 1999-04-15 | 2002-05-21 | Micron Technology, Inc. | Integrated circuit substrate having through hole markings to indicate defective/non-defective status of same |
FR2805410B1 (fr) * | 2000-02-23 | 2002-09-06 | Andre Rene Georges Gennesseaux | Systeme autonome de cogeneration d'electricite et de chaleur comportant un stockage d'energie par volant d'inertie |
TW521555B (en) * | 2000-08-25 | 2003-02-21 | Hitachi Aic Inc | Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device |
US6486561B1 (en) * | 2000-09-12 | 2002-11-26 | Luminary Logic, Ltd. | Semiconductor light emitting element formed on a clear or translucent substrate |
JP3866033B2 (ja) * | 2000-12-14 | 2007-01-10 | シャープ株式会社 | 半導体装置の製造方法 |
US6762509B2 (en) * | 2001-12-11 | 2004-07-13 | Celerity Research Pte. Ltd. | Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill material |
US6936495B1 (en) | 2002-01-09 | 2005-08-30 | Bridge Semiconductor Corporation | Method of making an optoelectronic semiconductor package device |
US7190060B1 (en) | 2002-01-09 | 2007-03-13 | Bridge Semiconductor Corporation | Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
US6891276B1 (en) * | 2002-01-09 | 2005-05-10 | Bridge Semiconductor Corporation | Semiconductor package device |
US6989295B1 (en) | 2002-01-09 | 2006-01-24 | Bridge Semiconductor Corporation | Method of making a semiconductor package device that includes an insulative housing with first and second housing portions |
KR100506035B1 (ko) * | 2003-08-22 | 2005-08-03 | 삼성전자주식회사 | 반도체 패키지 및 그 제조방법 |
TWI241696B (en) * | 2004-11-26 | 2005-10-11 | Delta Electronics Inc | Chip package structure |
US8138027B2 (en) * | 2008-03-07 | 2012-03-20 | Stats Chippac, Ltd. | Optical semiconductor device having pre-molded leadframe with window and method therefor |
CN103050416B (zh) * | 2012-12-07 | 2015-07-15 | 中国电子科技集团公司第十一研究所 | 用于百万像素碲镉汞混成芯片的底部填充方法及装置 |
Family Cites Families (7)
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JPS6489544A (en) * | 1987-09-30 | 1989-04-04 | Nec Corp | Cap for photosemiconductor device case |
CA2092165C (en) * | 1992-03-23 | 2001-05-15 | Tuyosi Nagano | Chip carrier for optical device |
US5491362A (en) * | 1992-04-30 | 1996-02-13 | Vlsi Technology, Inc. | Package structure having accessible chip |
JP2856647B2 (ja) * | 1993-09-20 | 1999-02-10 | 株式会社東芝 | 半導体チップバーンイン用ソケット |
US5498906A (en) * | 1993-11-17 | 1996-03-12 | Staktek Corporation | Capacitive coupling configuration for an intergrated circuit package |
US5721450A (en) * | 1995-06-12 | 1998-02-24 | Motorola, Inc. | Moisture relief for chip carriers |
US5710071A (en) * | 1995-12-04 | 1998-01-20 | Motorola, Inc. | Process for underfilling a flip-chip semiconductor device |
-
1995
- 1995-04-21 JP JP7096367A patent/JPH08293524A/ja active Pending
-
1996
- 1996-04-12 TW TW085104384A patent/TW390004B/zh not_active IP Right Cessation
- 1996-04-18 US US08/634,678 patent/US5834835A/en not_active Expired - Fee Related
- 1996-04-19 KR KR1019960011934A patent/KR100200254B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5834835A (en) | 1998-11-10 |
JPH08293524A (ja) | 1996-11-05 |
TW390004B (en) | 2000-05-11 |
KR100200254B1 (ko) | 1999-06-15 |
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