KR930014933A - Preform Integral Lead Frame - Google Patents

Preform Integral Lead Frame Download PDF

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Publication number
KR930014933A
KR930014933A KR1019910023980A KR910023980A KR930014933A KR 930014933 A KR930014933 A KR 930014933A KR 1019910023980 A KR1019910023980 A KR 1019910023980A KR 910023980 A KR910023980 A KR 910023980A KR 930014933 A KR930014933 A KR 930014933A
Authority
KR
South Korea
Prior art keywords
lead frame
preform
die
bonding
integral lead
Prior art date
Application number
KR1019910023980A
Other languages
Korean (ko)
Other versions
KR100234022B1 (en
Inventor
정삼균
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019910023980A priority Critical patent/KR100234022B1/en
Publication of KR930014933A publication Critical patent/KR930014933A/en
Application granted granted Critical
Publication of KR100234022B1 publication Critical patent/KR100234022B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

프리폼 일체형 리드 프레임에 관한 것으로, 다이 본딩기에 투입될 리드 프레임 본체(21)의 패드(22)에 프리폼(3)을 펀칭하여 접합한 것을 특징으로 하고 있으며, 이러한 본 발명은 프리폼 불량율과 리드 프레임 불량을 절감하고 생산성을 향상하는 이점이 있으며, 다이 본딩기에서 프리폼 접착장치를 제거하여도 되므로 다이본딩기 및 다이 본딩공정을 간단화할 수 있는 이점도 있다.The preform integrated lead frame is characterized in that the preform 3 is punched and bonded to the pads 22 of the lead frame main body 21 to be fed into the die bonding machine. In addition, the die-bonding apparatus and the die-bonding process can be simplified since the preform bonding device can be removed from the die bonding machine.

Description

프리폼 일체형 리드 프레임Preform Integral Lead Frame

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제5도는 본 발명에 적용되는 프리폼 펀칭기의 단면도,5 is a cross-sectional view of a preform punching machine applied to the present invention,

제6도는 본 고안에 의한 프리폼 일체형 리드 프레임의 평면도.Figure 6 is a plan view of a preform integrated lead frame according to the present invention.

Claims (1)

다이 본딩기에 투입될 리드 프레이 본체(21)의 패드(22)에 프리폼(3)을 펀칭하여 접합한 것을 특징으로 하는 프리폼 일체형 리드 프레임.A preform-integrated lead frame, characterized in that the preform (3) is punched and bonded to the pad (22) of the lead-frame main body (21) to be put into the die bonding machine. ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.※ Note: This is to be disclosed by the original application.
KR1019910023980A 1991-12-23 1991-12-23 Lead frame of die bonding body type KR100234022B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910023980A KR100234022B1 (en) 1991-12-23 1991-12-23 Lead frame of die bonding body type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910023980A KR100234022B1 (en) 1991-12-23 1991-12-23 Lead frame of die bonding body type

Publications (2)

Publication Number Publication Date
KR930014933A true KR930014933A (en) 1993-07-23
KR100234022B1 KR100234022B1 (en) 1999-12-15

Family

ID=19325632

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910023980A KR100234022B1 (en) 1991-12-23 1991-12-23 Lead frame of die bonding body type

Country Status (1)

Country Link
KR (1) KR100234022B1 (en)

Also Published As

Publication number Publication date
KR100234022B1 (en) 1999-12-15

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