JPS6468953A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6468953A
JPS6468953A JP22590987A JP22590987A JPS6468953A JP S6468953 A JPS6468953 A JP S6468953A JP 22590987 A JP22590987 A JP 22590987A JP 22590987 A JP22590987 A JP 22590987A JP S6468953 A JPS6468953 A JP S6468953A
Authority
JP
Japan
Prior art keywords
long size
semiconductor device
size frame
cutout part
specific long
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22590987A
Other languages
Japanese (ja)
Inventor
Masaaki Shimotomai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP22590987A priority Critical patent/JPS6468953A/en
Publication of JPS6468953A publication Critical patent/JPS6468953A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To discriminate a specific long size frame from other long size frames, by previously forming a cutout part in the specific long size frame. CONSTITUTION:A cutout part 27 is previously formed in a long size frame 21, and a semiconductor device is then bonded on an island part 25 using a die bonder 1. Subsequently, the pads of the semiconductor device and leads 26b are connected each other through wires using a wire bonder 5. Next, the wires and the semiconductor device are together sealed with plastic using a plastic sealing machine 6. In such a manner, because the cutout part is formed in the specific long size frame, the specific long size frame can be discriminated from other long size frames, thereby the management of the semiconductor device can be performed easily.
JP22590987A 1987-09-09 1987-09-09 Manufacture of semiconductor device Pending JPS6468953A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22590987A JPS6468953A (en) 1987-09-09 1987-09-09 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22590987A JPS6468953A (en) 1987-09-09 1987-09-09 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6468953A true JPS6468953A (en) 1989-03-15

Family

ID=16836788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22590987A Pending JPS6468953A (en) 1987-09-09 1987-09-09 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6468953A (en)

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