KR970023924A - Dual Bond Preheater with General Purpose for Leadframe Size - Google Patents
Dual Bond Preheater with General Purpose for Leadframe Size Download PDFInfo
- Publication number
- KR970023924A KR970023924A KR1019950038166A KR19950038166A KR970023924A KR 970023924 A KR970023924 A KR 970023924A KR 1019950038166 A KR1019950038166 A KR 1019950038166A KR 19950038166 A KR19950038166 A KR 19950038166A KR 970023924 A KR970023924 A KR 970023924A
- Authority
- KR
- South Korea
- Prior art keywords
- preheating
- leadframe
- bonding
- dual
- size
- Prior art date
Links
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
본 발명은 와이어 본딩 예열장치에 관한 것으로, 본딩 예열장치의 리드프레임이 안착되어 예열되는 예열부와 그 예열부의 양측 면에 일체형으로 형성된 지지부를 각기 분리할 수 있는 구조로 제작하여 다양한 리드프레임의 크기에 대응할 수 있는 리드프레임 크기에 범용성을 갖는 특징을 갖는다.The present invention relates to a wire bonding preheating apparatus, which is manufactured by a structure capable of separately separating preheating units in which the leadframes of the bonding preheating apparatuses are seated and supporting parts formed integrally on both sides of the preheating units, and having various sizes of leadframes. It has a versatility in leadframe sizes that can correspond to
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명에 의한 리드프레임 크기에 범용성을 갖는 이원화된 본딩 예열장치를 나타내는 평면도,2 is a plan view showing a binary bonding preheating device having versatility in leadframe size according to the present invention;
제3A도는 제2도의 본딩 예열장치의 예열부의 결합 관계를 나타내는 확대 평면도,3A is an enlarged plan view showing a coupling relationship of a preheating unit of the bonding preheating apparatus of FIG. 2;
제3B도는 제3A도의 단면도.3B is a sectional view of FIG. 3A.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038166A KR970023924A (en) | 1995-10-30 | 1995-10-30 | Dual Bond Preheater with General Purpose for Leadframe Size |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038166A KR970023924A (en) | 1995-10-30 | 1995-10-30 | Dual Bond Preheater with General Purpose for Leadframe Size |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970023924A true KR970023924A (en) | 1997-05-30 |
Family
ID=66584065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950038166A KR970023924A (en) | 1995-10-30 | 1995-10-30 | Dual Bond Preheater with General Purpose for Leadframe Size |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970023924A (en) |
-
1995
- 1995-10-30 KR KR1019950038166A patent/KR970023924A/en not_active Application Discontinuation
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR900005586A (en) | Semiconductor device and method of forming the same | |
KR950001998A (en) | Semiconductor device having a small die pad and manufacturing method thereof | |
TW353791B (en) | Surface mount TO-220 package and process for the manufacture thereof | |
KR910007598A (en) | Wire bonding method and apparatus | |
KR920702549A (en) | Semiconductor device and manufacturing method thereof | |
GB2257827B (en) | Support for semiconductor bond wires | |
KR970023924A (en) | Dual Bond Preheater with General Purpose for Leadframe Size | |
JPH0575016A (en) | Semiconductor device | |
KR970013262A (en) | Leadframe with Extended Internal Leads | |
KR960026691A (en) | Lead Frame Pad Structure for Semiconductor Package Manufacturing | |
KR880010492A (en) | Semiconductor device with lead frame and manufacturing method thereof | |
KR970024106A (en) | Upset Adjusted Lead Frame and Semiconductor Chip Packages Using the Same | |
KR930014933A (en) | Preform Integral Lead Frame | |
KR970053638A (en) | Semiconductor package device | |
KR970030542A (en) | Wire bonding device having a plurality of chip seats and bonding windows | |
KR970053699A (en) | Heater Block with Pad Mounter | |
KR970024120A (en) | Semiconductor chip package wire bonded with center pads | |
KR960026496A (en) | Heater Block for Wire Bonding of Semiconductor Package | |
KR930011142A (en) | Die-bonding device | |
KR970077395A (en) | Internal lead plating method for wire bonding | |
KR970003894A (en) | Wire bonding method using insulation film | |
KR960043143A (en) | Lead Frames for Semiconductor Packages | |
KR970024121A (en) | Lead frame with tie bars of resin | |
KR970024079A (en) | Semiconductor manufacturing device | |
KR970053192A (en) | Stage of Die Bonding Device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |