JPS6467949A - Lead frame and manufacture thereof - Google Patents
Lead frame and manufacture thereofInfo
- Publication number
- JPS6467949A JPS6467949A JP62224497A JP22449787A JPS6467949A JP S6467949 A JPS6467949 A JP S6467949A JP 62224497 A JP62224497 A JP 62224497A JP 22449787 A JP22449787 A JP 22449787A JP S6467949 A JPS6467949 A JP S6467949A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- face
- lead
- resin
- rough
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To improve bondability to a resin package and to improve the moisture resistance of a lead frame by employing a punch in which at least part of its outside face is roughened when the lead frame is punched by pressing. CONSTITUTION:A metal mold D is mounted on a stripe material which is surface treated as predetermined, and a lead frame is formed by pressing with punches in which a rough region R' is formed on the end face of its side. The punching is conducted, a region corresponding to the rough region R', i.e., part of the side face of an inner lead is simultaneously formed with a rough face R. The lead frame formed in this manner bonds a semiconductor chip on its die pad, a bonding pad at the end of the inner lead is connected by a wire bonding method to a bonding pad of a semiconductor chip, and then sealed with resin. A resin-sealed semiconductor device formed in this manner has remarkably improved bondability of a resin package to the lead, high moisture resistance and high reliability.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62224497A JPS6467949A (en) | 1987-09-08 | 1987-09-08 | Lead frame and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62224497A JPS6467949A (en) | 1987-09-08 | 1987-09-08 | Lead frame and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6467949A true JPS6467949A (en) | 1989-03-14 |
Family
ID=16814723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62224497A Pending JPS6467949A (en) | 1987-09-08 | 1987-09-08 | Lead frame and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6467949A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6002173A (en) * | 1991-12-20 | 1999-12-14 | Sgs-Thomson Microelectronics S.R.L. | Semiconductor device package with metal-polymer joint of controlled roughness |
JP2013139640A (en) * | 2013-02-21 | 2013-07-18 | Kobe Steel Ltd | Fitting type connector terminal |
US9252090B2 (en) | 2012-03-28 | 2016-02-02 | Panasonic Intellectual Property Management Co., Ltd. | Resin package |
JPWO2015037233A1 (en) * | 2013-09-11 | 2017-03-02 | テルモ株式会社 | Hollow needle assembly for medical use and method for manufacturing hollow needle |
US10211131B1 (en) * | 2017-10-06 | 2019-02-19 | Microchip Technology Incorporated | Systems and methods for improved adhesion between a leadframe and molding compound in a semiconductor device |
JP2021086905A (en) * | 2019-11-27 | 2021-06-03 | 京セラ株式会社 | Wiring board, package, and electronic component |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827352A (en) * | 1981-08-12 | 1983-02-18 | Hitachi Ltd | Semiconductor device |
JPS5864056A (en) * | 1981-10-13 | 1983-04-16 | Nec Corp | Semiconductor device |
-
1987
- 1987-09-08 JP JP62224497A patent/JPS6467949A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827352A (en) * | 1981-08-12 | 1983-02-18 | Hitachi Ltd | Semiconductor device |
JPS5864056A (en) * | 1981-10-13 | 1983-04-16 | Nec Corp | Semiconductor device |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6002173A (en) * | 1991-12-20 | 1999-12-14 | Sgs-Thomson Microelectronics S.R.L. | Semiconductor device package with metal-polymer joint of controlled roughness |
US9252090B2 (en) | 2012-03-28 | 2016-02-02 | Panasonic Intellectual Property Management Co., Ltd. | Resin package |
JP2013139640A (en) * | 2013-02-21 | 2013-07-18 | Kobe Steel Ltd | Fitting type connector terminal |
JPWO2015037233A1 (en) * | 2013-09-11 | 2017-03-02 | テルモ株式会社 | Hollow needle assembly for medical use and method for manufacturing hollow needle |
JP2019134921A (en) * | 2013-09-11 | 2019-08-15 | テルモ株式会社 | Medical hollow needle assembly and method for manufacturing hollow needle |
US10434265B2 (en) | 2013-09-11 | 2019-10-08 | Terumo Kabushiki Kaisha | Medical hollow needle assembly and method of manufacturing hollow needle |
US10211131B1 (en) * | 2017-10-06 | 2019-02-19 | Microchip Technology Incorporated | Systems and methods for improved adhesion between a leadframe and molding compound in a semiconductor device |
JP2021086905A (en) * | 2019-11-27 | 2021-06-03 | 京セラ株式会社 | Wiring board, package, and electronic component |
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