KR920018914A - Semiconductor package - Google Patents
Semiconductor package Download PDFInfo
- Publication number
- KR920018914A KR920018914A KR1019910004606A KR910004606A KR920018914A KR 920018914 A KR920018914 A KR 920018914A KR 1019910004606 A KR1019910004606 A KR 1019910004606A KR 910004606 A KR910004606 A KR 910004606A KR 920018914 A KR920018914 A KR 920018914A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- semiconductor chip
- heat sink
- die pad
- absorbing means
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
내용 없음No content
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제4도의 (가), (나) 및 제5도의 (가), (나)는 이 발명에 따른 반도체 패키지의 실시예를 나타낸 도면.4A, 5B and 5A, 5B show an embodiment of a semiconductor package according to the present invention.
Claims (5)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910004606A KR920018914A (en) | 1991-03-23 | 1991-03-23 | Semiconductor package |
JP3218596A JPH04320360A (en) | 1991-03-23 | 1991-08-29 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910004606A KR920018914A (en) | 1991-03-23 | 1991-03-23 | Semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR920018914A true KR920018914A (en) | 1992-10-22 |
Family
ID=19312420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910004606A KR920018914A (en) | 1991-03-23 | 1991-03-23 | Semiconductor package |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH04320360A (en) |
KR (1) | KR920018914A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4211035B2 (en) * | 2003-12-19 | 2009-01-21 | 富士通マイクロエレクトロニクス株式会社 | Semiconductor device having temperature control function |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5513993A (en) * | 1978-07-18 | 1980-01-31 | Nec Corp | Semiconductor device |
JPS6084849A (en) * | 1983-10-15 | 1985-05-14 | Mitsubishi Electric Corp | Semiconductor device |
JPH01198056A (en) * | 1988-02-03 | 1989-08-09 | Mitsubishi Electric Corp | Ic package |
-
1991
- 1991-03-23 KR KR1019910004606A patent/KR920018914A/en not_active IP Right Cessation
- 1991-08-29 JP JP3218596A patent/JPH04320360A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH04320360A (en) | 1992-11-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
SUBM | Submission of document of abandonment before or after decision of registration |