KR900008521A - 반도체 기억장치 - Google Patents

반도체 기억장치

Info

Publication number
KR900008521A
KR900008521A KR1019890016607A KR890016607A KR900008521A KR 900008521 A KR900008521 A KR 900008521A KR 1019890016607 A KR1019890016607 A KR 1019890016607A KR 890016607 A KR890016607 A KR 890016607A KR 900008521 A KR900008521 A KR 900008521A
Authority
KR
South Korea
Prior art keywords
semiconductor memory
semiconductor
memory
Prior art date
Application number
KR1019890016607A
Other languages
English (en)
Other versions
KR930000766B1 (ko
Inventor
줌페이 구마가이
슈소 후지이
Original Assignee
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도시바 filed Critical 가부시키가이샤 도시바
Publication of KR900008521A publication Critical patent/KR900008521A/ko
Application granted granted Critical
Publication of KR930000766B1 publication Critical patent/KR930000766B1/ko

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0207Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • G11C11/4097Bit-line organisation, e.g. bit-line layout, folded bit lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/922Active solid-state devices, e.g. transistors, solid-state diodes with means to prevent inspection of or tampering with an integrated circuit, e.g. "smart card", anti-tamper

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1019890016607A 1988-11-16 1989-11-16 반도체 기억장치 KR930000766B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63-289259 1988-11-16
JP63289259A JPH07109878B2 (ja) 1988-11-16 1988-11-16 半導体記憶装置

Publications (2)

Publication Number Publication Date
KR900008521A true KR900008521A (ko) 1990-06-03
KR930000766B1 KR930000766B1 (ko) 1993-02-01

Family

ID=17740841

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890016607A KR930000766B1 (ko) 1988-11-16 1989-11-16 반도체 기억장치

Country Status (5)

Country Link
US (1) US4941031A (ko)
EP (1) EP0369183B1 (ko)
JP (1) JPH07109878B2 (ko)
KR (1) KR930000766B1 (ko)
DE (1) DE68915395T2 (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194752A (en) * 1989-05-23 1993-03-16 Kabushiki Kaisha Toshiba Semiconductor memory device
JP2953708B2 (ja) * 1989-07-31 1999-09-27 株式会社東芝 ダイナミック型半導体記憶装置
JPH0713864B2 (ja) * 1989-09-27 1995-02-15 東芝マイクロエレクトロニクス株式会社 半導体記憶装置
EP0496406B1 (en) * 1991-01-25 1999-05-06 Nec Corporation Semiconductor memory apparatus
JPH0669208A (ja) * 1991-03-12 1994-03-11 Oki Electric Ind Co Ltd 半導体装置
US5639690A (en) * 1991-03-12 1997-06-17 Oki Electric Industry Co., Ltd. Method for manufacturing a conductive pattern structure for a semiconductor device
US5170243A (en) * 1991-11-04 1992-12-08 International Business Machines Corporation Bit line configuration for semiconductor memory
EP0713251B1 (en) * 1992-11-18 1999-01-07 Fuji Electric Co. Ltd. Semiconductor conversion device
KR100298871B1 (ko) * 1993-06-02 2001-11-22 김영환 반도체 메모리 장치의 비트라인 구조
US5485419A (en) * 1994-05-23 1996-01-16 Campbell; John P. Memory device column address selection lead layout
US5670815A (en) * 1994-07-05 1997-09-23 Motorola, Inc. Layout for noise reduction on a reference voltage
US5636158A (en) * 1995-03-13 1997-06-03 Kabushiki Kaisha Toshiba Irregular pitch layout for a semiconductor memory device
US5899706A (en) * 1997-06-30 1999-05-04 Siemens Aktiengesellschaft Method of reducing loading variation during etch processing
JP2000216264A (ja) * 1999-01-22 2000-08-04 Mitsubishi Electric Corp Cmos論理回路素子、半導体装置とその製造方法およびその製造方法において用いる半導体回路設計方法
JP2002190532A (ja) * 2000-12-19 2002-07-05 Hitachi Ltd 半導体記憶装置
JP2008004889A (ja) * 2006-06-26 2008-01-10 Samsung Electronics Co Ltd 半導体記憶装置
JP2008227171A (ja) * 2007-03-13 2008-09-25 Toshiba Corp 不揮発性半導体メモリ
US7948094B2 (en) * 2007-10-22 2011-05-24 Rohm Co., Ltd. Semiconductor device
KR102635666B1 (ko) * 2018-08-16 2024-02-14 에스케이하이닉스 주식회사 반도체 메모리 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349969A (en) * 1976-10-18 1978-05-06 Hitachi Ltd Semiconductor memory unit
US4319342A (en) * 1979-12-26 1982-03-09 International Business Machines Corporation One device field effect transistor (FET) AC stable random access memory (RAM) array
JPS5772348A (en) * 1980-10-24 1982-05-06 Nec Corp Wiring structure in integrated circuit
JPS59231852A (ja) * 1983-06-15 1984-12-26 Hitachi Ltd 半導体装置
JPH0714006B2 (ja) * 1985-05-29 1995-02-15 株式会社東芝 ダイナミツク型メモリ
JPS6211262A (ja) * 1985-07-08 1987-01-20 Nec Ic Microcomput Syst Ltd 半導体記憶装置
JPS6265300A (ja) * 1985-09-18 1987-03-24 Toshiba Corp 半導体記憶装置
JPS6276761A (ja) * 1985-09-30 1987-04-08 Toshiba Corp 半導体装置
JPH0766659B2 (ja) * 1986-01-30 1995-07-19 三菱電機株式会社 半導体記憶装置
JPS6367771A (ja) * 1986-09-09 1988-03-26 Mitsubishi Electric Corp 半導体記憶装置
JPS63183691A (ja) * 1987-01-26 1988-07-29 Mitsubishi Electric Corp 半導体記憶装置

Also Published As

Publication number Publication date
DE68915395T2 (de) 1994-10-06
JPH02134868A (ja) 1990-05-23
EP0369183B1 (en) 1994-05-18
US4941031A (en) 1990-07-10
JPH07109878B2 (ja) 1995-11-22
EP0369183A3 (en) 1991-01-23
EP0369183A2 (en) 1990-05-23
KR930000766B1 (ko) 1993-02-01
DE68915395D1 (de) 1994-06-23

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Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20030130

Year of fee payment: 11

LAPS Lapse due to unpaid annual fee