KR870010614A - 경사 클램핑 핀을 이용한 웨이퍼 처리용 척 - Google Patents

경사 클램핑 핀을 이용한 웨이퍼 처리용 척 Download PDF

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Publication number
KR870010614A
KR870010614A KR870003639A KR870003639A KR870010614A KR 870010614 A KR870010614 A KR 870010614A KR 870003639 A KR870003639 A KR 870003639A KR 870003639 A KR870003639 A KR 870003639A KR 870010614 A KR870010614 A KR 870010614A
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KR
South Korea
Prior art keywords
workpiece
platform
pin
retaining
wafer processing
Prior art date
Application number
KR870003639A
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English (en)
Inventor
엠. 홉슨 필립
에이취. 딕 폴
Original Assignee
스탠리 젯드. 코울
배리언 어소시에이츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스탠리 젯드. 코울, 배리언 어소시에이츠 인코포레이티드 filed Critical 스탠리 젯드. 코울
Publication of KR870010614A publication Critical patent/KR870010614A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

내용 없음

Description

경사 클램핑 핀을 사용한 웨이퍼 처리용 척
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 웨이퍼 처리 시스템의 부분 단면 정면도.
제2도는 제1도 선 2-2를 따라 취한 제1도 시스템의 부분 단면도.
제3도는 제2도의 선 3-3을 따라 취한 제1도 및 제2도 시스템을 통한 단면도.

Claims (6)

  1. 디스크형 작업물을 유지시키는 장치에 있어서, 작업물을 지지하는 상부면 수단을 가지는 플랫포옴과 적어도 3개의 유지 핀을 포함하며, 상기 각 유지 핀은 로드로써 형성되어 상기 플랫포옴 아래의 안내부에 설치되며, 상기 각 안내부는 플랫포옴 아래의 중심으로부터 상기 플랫포옴 외측 및 상방의 점쪽으로 향해 방사하도록 정렬되며, 상기 각 핀은 그 말단부에 급작스런 확대부를 가져, 상기 핀이 상기 중심점쪽으로 당겨질때 작업물이 유지시키는 상기 확대부로써 플랫포옴에 작업물을 유지시키는 것이 특징인 유지 장치.
  2. 제1항에 있어서,
    상기 중심점쪽으로 상기 유지 핀을 당기는 스프링 수단을 포함하는 것이 특징인 장치.
  3. 제2항에 있어서,
    승강 테이블과, 상기 승강 테이블을 상승시키는 구동 수단을 포함하는 것이 특징인 장치.
  4. 제3항에 있어서,
    작업물 취급 기구로부터 작업물을 받아 상기 작업물을 상기 플랫포옴에 내려 놓는 승강 핀 수단을 포함하는 것이 특징인 장치.
  5. 제4항에 있어서,
    상기 작업물이 상기 플랫포옴에 유지되는 동안 상기 작업물의 온도 제어를 위한 수단을 포함하는 것이 특징인 장치.
  6. 제5항에 잇어서,
    상기 온도 제어 수단은 상기 플랫포옴가 작업물의 이면 사이에 헬륨 가스를 보내는 수단을 포함하여 열 접촉을 보증하는 것이 특징인 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR870003639A 1986-04-17 1987-04-16 경사 클램핑 핀을 이용한 웨이퍼 처리용 척 KR870010614A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/853,271 US4724621A (en) 1986-04-17 1986-04-17 Wafer processing chuck using slanted clamping pins
US853271 1986-04-17

Publications (1)

Publication Number Publication Date
KR870010614A true KR870010614A (ko) 1987-11-30

Family

ID=25315561

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870003639A KR870010614A (ko) 1986-04-17 1987-04-16 경사 클램핑 핀을 이용한 웨이퍼 처리용 척

Country Status (4)

Country Link
US (1) US4724621A (ko)
EP (1) EP0242065A2 (ko)
JP (1) JPS62250654A (ko)
KR (1) KR870010614A (ko)

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Also Published As

Publication number Publication date
JPS62250654A (ja) 1987-10-31
US4724621A (en) 1988-02-16
EP0242065A2 (en) 1987-10-21

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