JPS57128042A - Inspecting method for semiconductor device - Google Patents
Inspecting method for semiconductor deviceInfo
- Publication number
- JPS57128042A JPS57128042A JP1254181A JP1254181A JPS57128042A JP S57128042 A JPS57128042 A JP S57128042A JP 1254181 A JP1254181 A JP 1254181A JP 1254181 A JP1254181 A JP 1254181A JP S57128042 A JPS57128042 A JP S57128042A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- inspected
- substrate
- semiconductor element
- contacted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To eliminate the improper contact of a probe with a portion to be inspected by contacting the probe with the portion to be inspected while emitting inert gas to the vicinity of the probe, thereby inspecting the electric characteristics of a semiconductor element. CONSTITUTION:An Si substrate 2 formed with a semiconductor element is placed on a substrate mounting base 1, the base 1 is then mounted in a probe card 3, and the substrate 2 is moved while rotating the base 1 so that a probe 4 is contacted with the portion to be inspected on the substrate 2. In this case, a gas feed fine tube 11 is provided in the vicinity of the probe 4, and the end of the probe 4 is contacted with the portion to be inspected. When the electric characteristics of the semiconductor element is then measured, pressurized inert gas is emitted to the periphery of the probe 4. In this manner, dusts or the like existing on the portion to be inspected of the substrate 2 is blown and removed, and the probe can be sufficiently contacted with the portion to be inspected of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1254181A JPS57128042A (en) | 1981-01-30 | 1981-01-30 | Inspecting method for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1254181A JPS57128042A (en) | 1981-01-30 | 1981-01-30 | Inspecting method for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57128042A true JPS57128042A (en) | 1982-08-09 |
Family
ID=11808185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1254181A Pending JPS57128042A (en) | 1981-01-30 | 1981-01-30 | Inspecting method for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57128042A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60116243U (en) * | 1984-01-13 | 1985-08-06 | 日本電気株式会社 | Semiconductor wafer inspection equipment |
JPS60239036A (en) * | 1984-05-12 | 1985-11-27 | Yoshie Hasegawa | Semiconductor wafer prober |
JPS63151036A (en) * | 1986-12-16 | 1988-06-23 | Tokyo Electron Ltd | Clean prober apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5224873B2 (en) * | 1971-12-22 | 1977-07-04 | ||
JPS5556641A (en) * | 1978-10-20 | 1980-04-25 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor chip temperature controller |
-
1981
- 1981-01-30 JP JP1254181A patent/JPS57128042A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5224873B2 (en) * | 1971-12-22 | 1977-07-04 | ||
JPS5556641A (en) * | 1978-10-20 | 1980-04-25 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor chip temperature controller |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60116243U (en) * | 1984-01-13 | 1985-08-06 | 日本電気株式会社 | Semiconductor wafer inspection equipment |
JPS60239036A (en) * | 1984-05-12 | 1985-11-27 | Yoshie Hasegawa | Semiconductor wafer prober |
JPS63151036A (en) * | 1986-12-16 | 1988-06-23 | Tokyo Electron Ltd | Clean prober apparatus |
JPH079920B2 (en) * | 1986-12-16 | 1995-02-01 | 東京エレクトロン株式会社 | Clean prober device |
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