JPS57128042A - Inspecting method for semiconductor device - Google Patents

Inspecting method for semiconductor device

Info

Publication number
JPS57128042A
JPS57128042A JP1254181A JP1254181A JPS57128042A JP S57128042 A JPS57128042 A JP S57128042A JP 1254181 A JP1254181 A JP 1254181A JP 1254181 A JP1254181 A JP 1254181A JP S57128042 A JPS57128042 A JP S57128042A
Authority
JP
Japan
Prior art keywords
probe
inspected
substrate
semiconductor element
contacted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1254181A
Other languages
Japanese (ja)
Inventor
Norio Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1254181A priority Critical patent/JPS57128042A/en
Publication of JPS57128042A publication Critical patent/JPS57128042A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To eliminate the improper contact of a probe with a portion to be inspected by contacting the probe with the portion to be inspected while emitting inert gas to the vicinity of the probe, thereby inspecting the electric characteristics of a semiconductor element. CONSTITUTION:An Si substrate 2 formed with a semiconductor element is placed on a substrate mounting base 1, the base 1 is then mounted in a probe card 3, and the substrate 2 is moved while rotating the base 1 so that a probe 4 is contacted with the portion to be inspected on the substrate 2. In this case, a gas feed fine tube 11 is provided in the vicinity of the probe 4, and the end of the probe 4 is contacted with the portion to be inspected. When the electric characteristics of the semiconductor element is then measured, pressurized inert gas is emitted to the periphery of the probe 4. In this manner, dusts or the like existing on the portion to be inspected of the substrate 2 is blown and removed, and the probe can be sufficiently contacted with the portion to be inspected of the substrate.
JP1254181A 1981-01-30 1981-01-30 Inspecting method for semiconductor device Pending JPS57128042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1254181A JPS57128042A (en) 1981-01-30 1981-01-30 Inspecting method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1254181A JPS57128042A (en) 1981-01-30 1981-01-30 Inspecting method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS57128042A true JPS57128042A (en) 1982-08-09

Family

ID=11808185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1254181A Pending JPS57128042A (en) 1981-01-30 1981-01-30 Inspecting method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS57128042A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60116243U (en) * 1984-01-13 1985-08-06 日本電気株式会社 Semiconductor wafer inspection equipment
JPS60239036A (en) * 1984-05-12 1985-11-27 Yoshie Hasegawa Semiconductor wafer prober
JPS63151036A (en) * 1986-12-16 1988-06-23 Tokyo Electron Ltd Clean prober apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5224873B2 (en) * 1971-12-22 1977-07-04
JPS5556641A (en) * 1978-10-20 1980-04-25 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor chip temperature controller

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5224873B2 (en) * 1971-12-22 1977-07-04
JPS5556641A (en) * 1978-10-20 1980-04-25 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor chip temperature controller

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60116243U (en) * 1984-01-13 1985-08-06 日本電気株式会社 Semiconductor wafer inspection equipment
JPS60239036A (en) * 1984-05-12 1985-11-27 Yoshie Hasegawa Semiconductor wafer prober
JPS63151036A (en) * 1986-12-16 1988-06-23 Tokyo Electron Ltd Clean prober apparatus
JPH079920B2 (en) * 1986-12-16 1995-02-01 東京エレクトロン株式会社 Clean prober device

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