ATE151199T1 - Plasmaätzvorrichtung mit magnetfeldverstärkung - Google Patents
Plasmaätzvorrichtung mit magnetfeldverstärkungInfo
- Publication number
- ATE151199T1 ATE151199T1 AT93201991T AT93201991T ATE151199T1 AT E151199 T1 ATE151199 T1 AT E151199T1 AT 93201991 T AT93201991 T AT 93201991T AT 93201991 T AT93201991 T AT 93201991T AT E151199 T1 ATE151199 T1 AT E151199T1
- Authority
- AT
- Austria
- Prior art keywords
- wafer
- gas
- electrode
- magnetic field
- pedestal
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Epidemiology (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Public Health (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- X-Ray Techniques (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US94484386A | 1986-12-19 | 1986-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE151199T1 true ATE151199T1 (de) | 1997-04-15 |
Family
ID=25482161
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT87311195T ATE111261T1 (de) | 1986-12-19 | 1987-12-18 | Plasmaätzvorrichtung mit magnetfeldverstärkung. |
AT93201991T ATE151199T1 (de) | 1986-12-19 | 1987-12-18 | Plasmaätzvorrichtung mit magnetfeldverstärkung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT87311195T ATE111261T1 (de) | 1986-12-19 | 1987-12-18 | Plasmaätzvorrichtung mit magnetfeldverstärkung. |
Country Status (5)
Country | Link |
---|---|
EP (2) | EP0272142B1 (de) |
JP (1) | JP2624975B2 (de) |
AT (2) | ATE111261T1 (de) |
DE (2) | DE3752042T2 (de) |
ES (1) | ES2058132T3 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5158644A (en) * | 1986-12-19 | 1992-10-27 | Applied Materials, Inc. | Reactor chamber self-cleaning process |
US5000113A (en) * | 1986-12-19 | 1991-03-19 | Applied Materials, Inc. | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process |
ES2081806T3 (es) * | 1987-06-26 | 1996-03-16 | Applied Materials Inc | Procedimiento de autolimpieza de una camara de reactor. |
US4944860A (en) * | 1988-11-04 | 1990-07-31 | Eaton Corporation | Platen assembly for a vacuum processing system |
JP2886878B2 (ja) * | 1989-03-01 | 1999-04-26 | 株式会社日立製作所 | 真空処理装置 |
KR0170391B1 (ko) * | 1989-06-16 | 1999-03-30 | 다카시마 히로시 | 피처리체 처리장치 및 처리방법 |
US5556501A (en) * | 1989-10-03 | 1996-09-17 | Applied Materials, Inc. | Silicon scavenger in an inductively coupled RF plasma reactor |
US5312778A (en) * | 1989-10-03 | 1994-05-17 | Applied Materials, Inc. | Method for plasma processing using magnetically enhanced plasma chemical vapor deposition |
US6068784A (en) * | 1989-10-03 | 2000-05-30 | Applied Materials, Inc. | Process used in an RF coupled plasma reactor |
JPH03142828A (ja) * | 1989-10-27 | 1991-06-18 | Tokyo Electron Ltd | 処理装置 |
JP2875945B2 (ja) * | 1993-01-28 | 1999-03-31 | アプライド マテリアルズ インコーポレイテッド | Cvdにより大面積のガラス基板上に高堆積速度でシリコン窒化薄膜を堆積する方法 |
KR960006958B1 (ko) * | 1993-02-06 | 1996-05-25 | 현대전자산업주식회사 | 이시알 장비 |
US5427621A (en) * | 1993-10-29 | 1995-06-27 | Applied Materials, Inc. | Method for removing particulate contaminants by magnetic field spiking |
US5900103A (en) | 1994-04-20 | 1999-05-04 | Tokyo Electron Limited | Plasma treatment method and apparatus |
US6391147B2 (en) | 1994-04-28 | 2002-05-21 | Tokyo Electron Limited | Plasma treatment method and apparatus |
US5738751A (en) * | 1994-09-01 | 1998-04-14 | Applied Materials, Inc. | Substrate support having improved heat transfer |
US5503676A (en) * | 1994-09-19 | 1996-04-02 | Lam Research Corporation | Apparatus and method for magnetron in-situ cleaning of plasma reaction chamber |
TW347460B (en) * | 1995-11-29 | 1998-12-11 | Applied Materials Inc | Flat bottom components and flat bottom architecture for fluid and gas systems |
US6293749B1 (en) | 1997-11-21 | 2001-09-25 | Asm America, Inc. | Substrate transfer system for semiconductor processing equipment |
EP1167572A3 (de) * | 2000-06-22 | 2002-04-10 | Applied Materials, Inc. | Deckelanordnung für eine Halbleiterbehandlungskammer |
JP4236873B2 (ja) * | 2002-06-21 | 2009-03-11 | 東京エレクトロン株式会社 | マグネトロンプラズマ処理装置 |
US7686918B2 (en) | 2002-06-21 | 2010-03-30 | Tokyo Electron Limited | Magnetron plasma processing apparatus |
WO2004088710A2 (en) * | 2003-04-02 | 2004-10-14 | Nkt Research & Innovation A/S | Method and apparatus for gas plasma treatment with controlled extent of gas plasma, and use thereof |
FR2920912B1 (fr) * | 2007-09-12 | 2010-08-27 | S O I Tec Silicon On Insulator Tech | Procede de fabrication d'une structure par transfert de couche |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4159799A (en) * | 1977-12-14 | 1979-07-03 | Bell Telephone Laboratories, Incorporated | Cassette unit and fixture for loading the unit with a planar member |
JPS5927212B2 (ja) * | 1979-09-25 | 1984-07-04 | 三菱電機株式会社 | プラズマ反応装置 |
JPS5816078A (ja) * | 1981-07-17 | 1983-01-29 | Toshiba Corp | プラズマエツチング装置 |
FR2538987A1 (fr) * | 1983-01-05 | 1984-07-06 | Commissariat Energie Atomique | Enceinte pour le traitement et notamment la gravure de substrats par la methode du plasma reactif |
JPH0669032B2 (ja) * | 1984-07-24 | 1994-08-31 | 富士通株式会社 | プラズマ処理装置 |
DE3580953D1 (de) * | 1984-08-31 | 1991-01-31 | Anelva Corp | Entladungsvorrichtung. |
US4657620A (en) * | 1984-10-22 | 1987-04-14 | Texas Instruments Incorporated | Automated single slice powered load lock plasma reactor |
JPS61119040A (ja) * | 1984-11-15 | 1986-06-06 | Tokyo Denshi Kagaku Kabushiki | 真空処理装置 |
JPH054282Y2 (de) * | 1984-12-04 | 1993-02-02 | ||
JPH0666300B2 (ja) * | 1985-03-18 | 1994-08-24 | 株式会社日立製作所 | ドライエッチング装置 |
US4624728A (en) * | 1985-06-11 | 1986-11-25 | Tegal Corporation | Pin lift plasma processing |
US4615755A (en) * | 1985-08-07 | 1986-10-07 | The Perkin-Elmer Corporation | Wafer cooling and temperature control for a plasma etching system |
US4677758A (en) * | 1985-10-08 | 1987-07-07 | Seiichiro Aigo | Spin drier for semiconductor material |
US4668338A (en) * | 1985-12-30 | 1987-05-26 | Applied Materials, Inc. | Magnetron-enhanced plasma etching process |
US4724621A (en) * | 1986-04-17 | 1988-02-16 | Varian Associates, Inc. | Wafer processing chuck using slanted clamping pins |
-
1987
- 1987-12-18 AT AT87311195T patent/ATE111261T1/de not_active IP Right Cessation
- 1987-12-18 EP EP87311195A patent/EP0272142B1/de not_active Expired - Lifetime
- 1987-12-18 ES ES87311195T patent/ES2058132T3/es not_active Expired - Lifetime
- 1987-12-18 JP JP62321182A patent/JP2624975B2/ja not_active Expired - Fee Related
- 1987-12-18 EP EP93201991A patent/EP0566220B1/de not_active Expired - Lifetime
- 1987-12-18 AT AT93201991T patent/ATE151199T1/de active
- 1987-12-18 DE DE3752042T patent/DE3752042T2/de not_active Expired - Fee Related
- 1987-12-18 DE DE3750502T patent/DE3750502T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE3750502D1 (de) | 1994-10-13 |
JPS63283024A (ja) | 1988-11-18 |
EP0272142B1 (de) | 1994-09-07 |
ATE111261T1 (de) | 1994-09-15 |
EP0272142A3 (en) | 1990-09-05 |
EP0566220A2 (de) | 1993-10-20 |
JP2624975B2 (ja) | 1997-06-25 |
EP0272142A2 (de) | 1988-06-22 |
DE3752042D1 (de) | 1997-05-07 |
EP0566220A3 (de) | 1993-10-27 |
EP0566220B1 (de) | 1997-04-02 |
DE3752042T2 (de) | 1997-07-17 |
ES2058132T3 (es) | 1994-11-01 |
DE3750502T2 (de) | 1995-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE68921234D1 (de) | Vakuum-Bearbeitungsreaktor. | |
ATE111261T1 (de) | Plasmaätzvorrichtung mit magnetfeldverstärkung. | |
KR100907848B1 (ko) | 고온 정전기 척 | |
EP1604389B1 (de) | Verarbeitungssystem und verfahren zum thermischen behandeln eines substrats | |
US5228501A (en) | Physical vapor deposition clamping mechanism and heater/cooler | |
EP0165400B1 (de) | Vorrichtung zum Plasma-Ätzen | |
US6529362B2 (en) | Monocrystalline ceramic electrostatic chuck | |
EP1604387B1 (de) | Behandlungsvorrichtung und verfahren zur substratbehandlung | |
EP1604388B1 (de) | Verarbeitungssystem und verfahren zum chemischen behandeln eines substrats | |
KR101476566B1 (ko) | 다이나믹 온도 제어를 가지는 기판 지지대 | |
EP0452779B1 (de) | Klemmechanismus für physikalische Dampfniederschlagvorrichtung | |
US6583064B2 (en) | Low contamination high density plasma etch chambers and methods for making the same | |
EP0776032B1 (de) | Plasma-Ätz-Verfahren | |
US5484011A (en) | Method of heating and cooling a wafer during semiconductor processing | |
US5160405A (en) | Method of etching diamond thin films | |
JP2011176365A (ja) | 化学的酸化物除去(ChemicalOxideRemoval)処理システム及び方法 | |
WO2008109504A2 (en) | Processing system and method for performing high throughput non-plasma processing | |
KR20220156052A (ko) | 기판 프로세싱 챔버 내의 프로세스 키트의 시스 및 온도 제어 | |
EP1420081B1 (de) | Vorrichtung und Verfahren zur Herstellung von dünnen Schichten | |
US20220293452A1 (en) | Lift pin mechanism | |
JPS63283025A (ja) | 多接点カソードを備えたプラズマストリッパー | |
US6221203B1 (en) | Apparatus and method for controlling temperature of a chamber | |
JPH0476495B2 (de) | ||
CN219658687U (zh) | 静电卡盘及半导体工艺设备 | |
US20220293397A1 (en) | Substrate edge ring that extends process environment beyond substrate diameter |