KR101873071B1 - 이형 필름 및 이형 필름의 제조 방법 - Google Patents
이형 필름 및 이형 필름의 제조 방법 Download PDFInfo
- Publication number
- KR101873071B1 KR101873071B1 KR1020127026625A KR20127026625A KR101873071B1 KR 101873071 B1 KR101873071 B1 KR 101873071B1 KR 1020127026625 A KR1020127026625 A KR 1020127026625A KR 20127026625 A KR20127026625 A KR 20127026625A KR 101873071 B1 KR101873071 B1 KR 101873071B1
- Authority
- KR
- South Korea
- Prior art keywords
- release film
- surface layer
- film
- layer
- hot press
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/704—Crystalline
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2010-056620 | 2010-03-12 | ||
JPJP-P-2010-056621 | 2010-03-12 | ||
JP2010056621 | 2010-03-12 | ||
JP2010056622 | 2010-03-12 | ||
JPJP-P-2010-056622 | 2010-03-12 | ||
JP2010056620 | 2010-03-12 | ||
PCT/JP2011/055798 WO2011111826A1 (ja) | 2010-03-12 | 2011-03-11 | 離型フィルム及び離型フィルムの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130043623A KR20130043623A (ko) | 2013-04-30 |
KR101873071B1 true KR101873071B1 (ko) | 2018-06-29 |
Family
ID=44563624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020127026625A KR101873071B1 (ko) | 2010-03-12 | 2011-03-11 | 이형 필름 및 이형 필름의 제조 방법 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP5719290B2 (zh) |
KR (1) | KR101873071B1 (zh) |
CN (1) | CN102791480B (zh) |
TW (1) | TWI540051B (zh) |
WO (1) | WO2011111826A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210078269A (ko) | 2019-12-18 | 2021-06-28 | 황진상 | 반도체 패키지 몰드용 이형필름 및 그 제조방법 |
KR20210078270A (ko) | 2019-12-18 | 2021-06-28 | 황진상 | 반도체 패키지 몰드용 이형필름 및 그 제조방법 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6014680B2 (ja) * | 2012-11-19 | 2016-10-25 | タツタ電線株式会社 | 積層フィルム及びシールドプリント配線板 |
JP6126446B2 (ja) * | 2013-04-24 | 2017-05-10 | 三井化学東セロ株式会社 | 離型フィルムおよびled素子封止体の製造方法 |
WO2014178151A1 (ja) * | 2013-04-30 | 2014-11-06 | 住友ベークライト株式会社 | 離型フィルムおよび離型フィルムの使用方法 |
JP6223913B2 (ja) * | 2013-08-05 | 2017-11-01 | 積水化学工業株式会社 | 離型フィルム |
JP2015077783A (ja) * | 2013-09-10 | 2015-04-23 | 東レ株式会社 | 離型用二軸配向ポリエステルフィルム |
JPWO2015133630A1 (ja) * | 2014-03-07 | 2017-04-06 | 旭硝子株式会社 | 離型フィルム、その製造方法、および半導体パッケージの製造方法 |
JP6572616B2 (ja) * | 2014-09-17 | 2019-09-11 | 東レ株式会社 | 白色ポリエステルフィルム |
JP6531555B2 (ja) * | 2014-10-31 | 2019-06-19 | 東レ株式会社 | 光学フィルム製造用ポリエステルフィルム |
JP2018167458A (ja) * | 2017-03-29 | 2018-11-01 | 日本メクトロン株式会社 | 離型フィルムおよびフレキシブルプリント基板の製造方法 |
CN111819228B (zh) * | 2018-03-19 | 2023-09-19 | 积水化学工业株式会社 | 脱模膜 |
CN112586096B (zh) | 2018-07-06 | 2024-06-11 | 拓自达电线株式会社 | 印制线路基材用贴附膜 |
WO2021060151A1 (ja) * | 2019-09-25 | 2021-04-01 | 積水化学工業株式会社 | 離型フィルム |
CN111019148B (zh) * | 2019-12-10 | 2021-10-01 | 河南科技学院 | 一种改性泡沫铜材料及其制备方法和应用 |
TWI740515B (zh) | 2019-12-23 | 2021-09-21 | 長春人造樹脂廠股份有限公司 | 液晶高分子膜及包含其之積層板 |
JP7095780B1 (ja) * | 2021-06-09 | 2022-07-05 | 住友ベークライト株式会社 | 離型フィルムおよび成型品の製造方法 |
JPWO2023032793A1 (zh) * | 2021-08-31 | 2023-03-09 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03240658A (ja) * | 1990-02-01 | 1991-10-28 | Teijin Ltd | 蓋材 |
JPH05283862A (ja) | 1992-03-31 | 1993-10-29 | Sony Corp | 積層プリント基板の製造方法 |
JP4818541B2 (ja) * | 2001-08-07 | 2011-11-16 | 三菱樹脂株式会社 | ポリエステルフィルム |
JP2003192987A (ja) * | 2001-12-26 | 2003-07-09 | Toray Ind Inc | 無溶剤型ポリシロキサン系塗剤及び離型フィルム |
JP3791458B2 (ja) * | 2002-05-23 | 2006-06-28 | 旭硝子株式会社 | 離型フィルム |
JP4011086B2 (ja) * | 2003-09-30 | 2007-11-21 | 積水化学工業株式会社 | 多層シート |
JP2005212453A (ja) * | 2004-02-02 | 2005-08-11 | Sekisui Chem Co Ltd | 離型フィルム及び離型フィルムの製造方法 |
KR100879003B1 (ko) * | 2005-05-26 | 2009-01-15 | 주식회사 코오롱 | 이형필름 |
JP2007237497A (ja) * | 2006-03-07 | 2007-09-20 | Teijin Dupont Films Japan Ltd | 離型用フィルム |
EP2002973B1 (en) * | 2006-04-05 | 2011-05-11 | Asahi Glass Company, Limited | Mold release film, mold release cushion material, process for manufacturing printed board and process for manufacturing mold release film |
JP4332204B2 (ja) * | 2007-09-21 | 2009-09-16 | 積水化学工業株式会社 | 離型フィルム |
JP2009132806A (ja) | 2007-11-30 | 2009-06-18 | Sekisui Chem Co Ltd | 離型フィルム |
CN102046349B (zh) * | 2008-05-28 | 2013-09-18 | 株式会社吴羽 | 聚苯硫醚树脂制离型膜和叠层体 |
JP5300372B2 (ja) * | 2008-08-25 | 2013-09-25 | ユニチカ株式会社 | 剥離性ポリエステルフィルム |
JP5492542B2 (ja) * | 2009-12-24 | 2014-05-14 | 積水化学工業株式会社 | 離型フィルムの製造方法 |
-
2011
- 2011-03-11 WO PCT/JP2011/055798 patent/WO2011111826A1/ja active Application Filing
- 2011-03-11 KR KR1020127026625A patent/KR101873071B1/ko active IP Right Grant
- 2011-03-11 JP JP2011513562A patent/JP5719290B2/ja active Active
- 2011-03-11 CN CN201180013457.0A patent/CN102791480B/zh active Active
- 2011-03-14 TW TW100108641A patent/TWI540051B/zh active
-
2014
- 2014-10-29 JP JP2014220657A patent/JP5837976B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210078269A (ko) | 2019-12-18 | 2021-06-28 | 황진상 | 반도체 패키지 몰드용 이형필름 및 그 제조방법 |
KR20210078270A (ko) | 2019-12-18 | 2021-06-28 | 황진상 | 반도체 패키지 몰드용 이형필름 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP5837976B2 (ja) | 2015-12-24 |
CN102791480B (zh) | 2015-06-17 |
JP5719290B2 (ja) | 2015-05-13 |
KR20130043623A (ko) | 2013-04-30 |
JPWO2011111826A1 (ja) | 2013-06-27 |
JP2015083379A (ja) | 2015-04-30 |
CN102791480A (zh) | 2012-11-21 |
TW201144072A (en) | 2011-12-16 |
WO2011111826A1 (ja) | 2011-09-15 |
TWI540051B (zh) | 2016-07-01 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |