KR101873071B1 - 이형 필름 및 이형 필름의 제조 방법 - Google Patents

이형 필름 및 이형 필름의 제조 방법 Download PDF

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Publication number
KR101873071B1
KR101873071B1 KR1020127026625A KR20127026625A KR101873071B1 KR 101873071 B1 KR101873071 B1 KR 101873071B1 KR 1020127026625 A KR1020127026625 A KR 1020127026625A KR 20127026625 A KR20127026625 A KR 20127026625A KR 101873071 B1 KR101873071 B1 KR 101873071B1
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KR
South Korea
Prior art keywords
release film
surface layer
film
layer
hot press
Prior art date
Application number
KR1020127026625A
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English (en)
Korean (ko)
Other versions
KR20130043623A (ko
Inventor
요스케 나카오
히로타케 마츠모토
야스시 고토
마사히로 츠치야
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20130043623A publication Critical patent/KR20130043623A/ko
Application granted granted Critical
Publication of KR101873071B1 publication Critical patent/KR101873071B1/ko

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • B32B2264/102Oxide or hydroxide
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • B32B2264/104Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/306Resistant to heat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538Roughness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/704Crystalline
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020127026625A 2010-03-12 2011-03-11 이형 필름 및 이형 필름의 제조 방법 KR101873071B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2010-056620 2010-03-12
JPJP-P-2010-056621 2010-03-12
JP2010056621 2010-03-12
JP2010056622 2010-03-12
JPJP-P-2010-056622 2010-03-12
JP2010056620 2010-03-12
PCT/JP2011/055798 WO2011111826A1 (ja) 2010-03-12 2011-03-11 離型フィルム及び離型フィルムの製造方法

Publications (2)

Publication Number Publication Date
KR20130043623A KR20130043623A (ko) 2013-04-30
KR101873071B1 true KR101873071B1 (ko) 2018-06-29

Family

ID=44563624

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127026625A KR101873071B1 (ko) 2010-03-12 2011-03-11 이형 필름 및 이형 필름의 제조 방법

Country Status (5)

Country Link
JP (2) JP5719290B2 (zh)
KR (1) KR101873071B1 (zh)
CN (1) CN102791480B (zh)
TW (1) TWI540051B (zh)
WO (1) WO2011111826A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210078269A (ko) 2019-12-18 2021-06-28 황진상 반도체 패키지 몰드용 이형필름 및 그 제조방법
KR20210078270A (ko) 2019-12-18 2021-06-28 황진상 반도체 패키지 몰드용 이형필름 및 그 제조방법

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JP6014680B2 (ja) * 2012-11-19 2016-10-25 タツタ電線株式会社 積層フィルム及びシールドプリント配線板
JP6126446B2 (ja) * 2013-04-24 2017-05-10 三井化学東セロ株式会社 離型フィルムおよびled素子封止体の製造方法
WO2014178151A1 (ja) * 2013-04-30 2014-11-06 住友ベークライト株式会社 離型フィルムおよび離型フィルムの使用方法
JP6223913B2 (ja) * 2013-08-05 2017-11-01 積水化学工業株式会社 離型フィルム
JP2015077783A (ja) * 2013-09-10 2015-04-23 東レ株式会社 離型用二軸配向ポリエステルフィルム
JPWO2015133630A1 (ja) * 2014-03-07 2017-04-06 旭硝子株式会社 離型フィルム、その製造方法、および半導体パッケージの製造方法
JP6572616B2 (ja) * 2014-09-17 2019-09-11 東レ株式会社 白色ポリエステルフィルム
JP6531555B2 (ja) * 2014-10-31 2019-06-19 東レ株式会社 光学フィルム製造用ポリエステルフィルム
JP2018167458A (ja) * 2017-03-29 2018-11-01 日本メクトロン株式会社 離型フィルムおよびフレキシブルプリント基板の製造方法
CN111819228B (zh) * 2018-03-19 2023-09-19 积水化学工业株式会社 脱模膜
CN112586096B (zh) 2018-07-06 2024-06-11 拓自达电线株式会社 印制线路基材用贴附膜
WO2021060151A1 (ja) * 2019-09-25 2021-04-01 積水化学工業株式会社 離型フィルム
CN111019148B (zh) * 2019-12-10 2021-10-01 河南科技学院 一种改性泡沫铜材料及其制备方法和应用
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
JP7095780B1 (ja) * 2021-06-09 2022-07-05 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
JPWO2023032793A1 (zh) * 2021-08-31 2023-03-09

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JPH03240658A (ja) * 1990-02-01 1991-10-28 Teijin Ltd 蓋材
JPH05283862A (ja) 1992-03-31 1993-10-29 Sony Corp 積層プリント基板の製造方法
JP4818541B2 (ja) * 2001-08-07 2011-11-16 三菱樹脂株式会社 ポリエステルフィルム
JP2003192987A (ja) * 2001-12-26 2003-07-09 Toray Ind Inc 無溶剤型ポリシロキサン系塗剤及び離型フィルム
JP3791458B2 (ja) * 2002-05-23 2006-06-28 旭硝子株式会社 離型フィルム
JP4011086B2 (ja) * 2003-09-30 2007-11-21 積水化学工業株式会社 多層シート
JP2005212453A (ja) * 2004-02-02 2005-08-11 Sekisui Chem Co Ltd 離型フィルム及び離型フィルムの製造方法
KR100879003B1 (ko) * 2005-05-26 2009-01-15 주식회사 코오롱 이형필름
JP2007237497A (ja) * 2006-03-07 2007-09-20 Teijin Dupont Films Japan Ltd 離型用フィルム
EP2002973B1 (en) * 2006-04-05 2011-05-11 Asahi Glass Company, Limited Mold release film, mold release cushion material, process for manufacturing printed board and process for manufacturing mold release film
JP4332204B2 (ja) * 2007-09-21 2009-09-16 積水化学工業株式会社 離型フィルム
JP2009132806A (ja) 2007-11-30 2009-06-18 Sekisui Chem Co Ltd 離型フィルム
CN102046349B (zh) * 2008-05-28 2013-09-18 株式会社吴羽 聚苯硫醚树脂制离型膜和叠层体
JP5300372B2 (ja) * 2008-08-25 2013-09-25 ユニチカ株式会社 剥離性ポリエステルフィルム
JP5492542B2 (ja) * 2009-12-24 2014-05-14 積水化学工業株式会社 離型フィルムの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210078269A (ko) 2019-12-18 2021-06-28 황진상 반도체 패키지 몰드용 이형필름 및 그 제조방법
KR20210078270A (ko) 2019-12-18 2021-06-28 황진상 반도체 패키지 몰드용 이형필름 및 그 제조방법

Also Published As

Publication number Publication date
JP5837976B2 (ja) 2015-12-24
CN102791480B (zh) 2015-06-17
JP5719290B2 (ja) 2015-05-13
KR20130043623A (ko) 2013-04-30
JPWO2011111826A1 (ja) 2013-06-27
JP2015083379A (ja) 2015-04-30
CN102791480A (zh) 2012-11-21
TW201144072A (en) 2011-12-16
WO2011111826A1 (ja) 2011-09-15
TWI540051B (zh) 2016-07-01

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