KR101409663B1 - 솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법 - Google Patents

솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법 Download PDF

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Publication number
KR101409663B1
KR101409663B1 KR1020120089674A KR20120089674A KR101409663B1 KR 101409663 B1 KR101409663 B1 KR 101409663B1 KR 1020120089674 A KR1020120089674 A KR 1020120089674A KR 20120089674 A KR20120089674 A KR 20120089674A KR 101409663 B1 KR101409663 B1 KR 101409663B1
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KR
South Korea
Prior art keywords
solder ball
mounting
solder
mask
prevention member
Prior art date
Application number
KR1020120089674A
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English (en)
Korean (ko)
Other versions
KR20140023075A (ko
Inventor
최진원
유연호
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020120089674A priority Critical patent/KR101409663B1/ko
Priority to JP2012242774A priority patent/JP5411340B1/ja
Publication of KR20140023075A publication Critical patent/KR20140023075A/ko
Application granted granted Critical
Publication of KR101409663B1 publication Critical patent/KR101409663B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
KR1020120089674A 2012-08-16 2012-08-16 솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법 KR101409663B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020120089674A KR101409663B1 (ko) 2012-08-16 2012-08-16 솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법
JP2012242774A JP5411340B1 (ja) 2012-08-16 2012-11-02 はんだボール実装装置、これを含むはんだボール実装システム及びこれを用いたはんだボール実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120089674A KR101409663B1 (ko) 2012-08-16 2012-08-16 솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법

Publications (2)

Publication Number Publication Date
KR20140023075A KR20140023075A (ko) 2014-02-26
KR101409663B1 true KR101409663B1 (ko) 2014-06-18

Family

ID=50202694

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120089674A KR101409663B1 (ko) 2012-08-16 2012-08-16 솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법

Country Status (2)

Country Link
JP (1) JP5411340B1 (ja)
KR (1) KR101409663B1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980012392A (ko) * 1996-07-26 1998-04-30 황인선 볼 그리드 어레이의 솔더볼 실장장치
KR19980028745A (ko) * 1996-10-24 1998-07-15 황인길 솔더볼 범핑장비
JP4233190B2 (ja) 1999-11-30 2009-03-04 日立ビアメカニクス株式会社 はんだボールの搭載方法およびその装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4814756B2 (ja) * 2006-11-01 2011-11-16 新光電気工業株式会社 はんだボール搭載方法
JP5639360B2 (ja) * 2009-12-21 2014-12-10 アスリートＦａ株式会社 ボール誘導装置、ボール誘導方法およびボール搭載装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980012392A (ko) * 1996-07-26 1998-04-30 황인선 볼 그리드 어레이의 솔더볼 실장장치
KR19980028745A (ko) * 1996-10-24 1998-07-15 황인길 솔더볼 범핑장비
JP4233190B2 (ja) 1999-11-30 2009-03-04 日立ビアメカニクス株式会社 はんだボールの搭載方法およびその装置

Also Published As

Publication number Publication date
JP2014038997A (ja) 2014-02-27
KR20140023075A (ko) 2014-02-26
JP5411340B1 (ja) 2014-02-12

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