KR101019445B1 - 액 처리 장치 - Google Patents
액 처리 장치 Download PDFInfo
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- KR101019445B1 KR101019445B1 KR1020070037458A KR20070037458A KR101019445B1 KR 101019445 B1 KR101019445 B1 KR 101019445B1 KR 1020070037458 A KR1020070037458 A KR 1020070037458A KR 20070037458 A KR20070037458 A KR 20070037458A KR 101019445 B1 KR101019445 B1 KR 101019445B1
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- substrate
- liquid
- cup
- drainage
- rotating
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- 239000007788 liquid Substances 0.000 title claims abstract description 186
- 239000000758 substrate Substances 0.000 claims abstract description 116
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 238000007599 discharging Methods 0.000 claims 4
- 238000000034 method Methods 0.000 description 27
- 239000003595 mist Substances 0.000 description 23
- 230000008569 process Effects 0.000 description 23
- 230000002093 peripheral effect Effects 0.000 description 13
- 238000004381 surface treatment Methods 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 101150038956 cup-4 gene Proteins 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Weting (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
Claims (12)
- 기판을 수평으로 유지하고, 기판과 함께 회전 가능한 기판 유지부와,상기 기판 유지부에 유지된 기판을 둘러싸고, 기판과 함께 회전 가능한 회전 컵과,상기 회전 컵 및 상기 기판 유지부를 일체적으로 회전시키는 회전 기구와,적어도 기판의 표면에 처리액을 공급하는 액 공급 기구와,상기 회전 컵으로부터 외부로 배기 및 배액하는 배기·배액부와,표면이 기판 표면과 연속하도록 기판의 외측에 설치되고, 상기 기판 유지부 및 상기 회전 컵과 함께 회전하며, 기판 표면에 공급되어 기판으로부터 털어진 처리액을 그 표면을 통해 상기 회전 컵으로부터 상기 배기·배액부로 안내하는 안내 부재를 포함하는 액 처리 장치.
- 제1항에 있어서, 상기 안내 부재는 기판과 인접하는 부분의 표면의 높이 위치가, 기판의 표면의 높이 위치와 일치하고 있는 것인 액 처리 장치.
- 제1항에 있어서, 상기 안내 부재는 그 내단이 기판에 근접하도록 설치되어 환형의 판형체로 이루어지는 것인 액 처리 장치.
- 제1항에 있어서, 상기 회전 컵은 기판으로부터 털어진 처리액을 수평 방향으 로 배출하는 처리액 배출부를 포함하고 있는 것인 액 처리 장치.
- 제1항에 있어서, 상기 회전 컵은 기판으로부터 털어진 처리액을 취입하여 아래쪽으로 안내하는 안내 벽과, 취입한 처리액을 아래쪽으로 배출하는 개구부를 포함하고 있는 것인 액 처리 장치.
- 제1항에 있어서, 상기 배기·배액부는 기판으로부터 털어진 배액을 수취하는 환형을 이루는 배액 컵과, 상기 배액 컵의 외측에 설치되고, 상기 회전 컵의 배기를 행하는 배기 컵을 포함하는 것인 액 처리 장치.
- 기판을 수평으로 유지하고, 기판과 함께 회전 가능한 기판 유지부와,상기 기판 유지부에 유지된 기판을 둘러싸며, 기판과 함께 회전 가능한 회전 컵과,상기 회전 컵 및 상기 기판 유지부를 일체적으로 회전시키는 회전 기구와,기판의 표면에 처리액을 공급하는 표면 액 공급 기구와,기판의 이면에 처리액을 공급하는 이면 액 공급 기구와,상기 회전 컵으로부터 외부로 배기 및 배액 하는 배기·배액부와,표리면이 기판 표리면과 연속하도록 기판의 외측에 설치되고, 상기 기판 유지부 및 상기 회전 컵과 함께 회전하며, 기판 표면에 공급되어 기판으로부터 털어진 처리액을 그 표면을 통해 상기 회전 컵으로부터 상기 배기·배액부로 유도하고, 기판 이면에 공급되어 기판으로부터 털어진 처리액을 그 이면을 통해 상기 회전 컵으로부터 상기 배기·배액부로 안내하는 안내 부재를 포함하는 액 처리 장치.
- 제7항에 있어서, 상기 안내 부재는 기판과 인접하는 부분의 표면 및 이면의 높이 위치가, 기판의 표면 및 이면의 높이 위치와 일치하고 있는 것인 액 처리 장치.
- 제7항에 있어서, 상기 안내 부재는 그 내단이 기판에 근접하도록 설치되어 환형의 판형체로 이루어지는 것인 액 처리 장치.
- 제7항에 있어서, 상기 회전 컵은 기판으로부터 털어진 처리액을 수평 방향으로 배출하는 처리액 배출부를 포함하고 있는 것인 액 처리 장치.
- 제7항에 있어서, 상기 회전 컵은 기판으로부터 털어진 처리액을 취입하여 아래쪽으로 안내하는 안내 벽과, 취입한 처리액을 아래쪽으로 배출하는 개구부를 포함하고 있는 것인 액 처리 장치.
- 제7항에 있어서, 상기 배기·배액부는 기판으로부터 털어진 배액을 수취하는 환형을 이루는 배액 컵과, 상기 배액 컵의 외측에 설치되고, 상기 회전 컵의 배기 를 행하는 배기 컵을 포함하는 것인 액 처리 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2006-00114960 | 2006-04-18 | ||
JP2006114960 | 2006-04-18 |
Publications (2)
Publication Number | Publication Date |
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KR20070103314A KR20070103314A (ko) | 2007-10-23 |
KR101019445B1 true KR101019445B1 (ko) | 2011-03-07 |
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ID=38120656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020070037458A KR101019445B1 (ko) | 2006-04-18 | 2007-04-17 | 액 처리 장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7998308B2 (ko) |
EP (1) | EP1848025B1 (ko) |
KR (1) | KR101019445B1 (ko) |
CN (2) | CN101060070B (ko) |
AT (1) | ATE450885T1 (ko) |
DE (1) | DE602007003506D1 (ko) |
TW (1) | TW200802579A (ko) |
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KR101019445B1 (ko) * | 2006-04-18 | 2011-03-07 | 도쿄엘렉트론가부시키가이샤 | 액 처리 장치 |
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JP5156661B2 (ja) * | 2009-02-12 | 2013-03-06 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
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JP5645796B2 (ja) * | 2011-11-21 | 2014-12-24 | 東京エレクトロン株式会社 | 液処理装置及び液処理方法 |
JP5913937B2 (ja) * | 2011-11-30 | 2016-05-11 | 株式会社Screenセミコンダクターソリューションズ | カップおよび基板処理装置 |
JP6148475B2 (ja) * | 2013-01-25 | 2017-06-14 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
JP6057334B2 (ja) * | 2013-03-15 | 2017-01-11 | 株式会社Screenホールディングス | 基板処理装置 |
JP6281161B2 (ja) * | 2013-09-27 | 2018-02-21 | 東京エレクトロン株式会社 | 液処理装置 |
JP6229933B2 (ja) * | 2013-09-27 | 2017-11-15 | 株式会社Screenホールディングス | 処理カップ洗浄方法、基板処理方法および基板処理装置 |
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JP6090113B2 (ja) * | 2013-10-30 | 2017-03-08 | 東京エレクトロン株式会社 | 液処理装置 |
JP6134673B2 (ja) * | 2014-03-13 | 2017-05-24 | 株式会社Screenホールディングス | 基板処理装置 |
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JP6267141B2 (ja) * | 2014-06-04 | 2018-01-24 | 東京エレクトロン株式会社 | 液塗布方法、液塗布装置、及びコンピュータ読み取り可能な記録媒体 |
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JP6797526B2 (ja) * | 2014-11-11 | 2020-12-09 | 株式会社荏原製作所 | 基板洗浄装置 |
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CN105244304B (zh) * | 2015-11-11 | 2018-12-18 | 北京七星华创电子股份有限公司 | 一种带静电液雾清洗装置和清洗方法 |
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KR101019445B1 (ko) * | 2006-04-18 | 2011-03-07 | 도쿄엘렉트론가부시키가이샤 | 액 처리 장치 |
EP1879216B1 (en) * | 2006-06-16 | 2009-02-25 | Tokyo Electron Limited | Liquid processing apparatus and method |
JP4648973B2 (ja) * | 2006-07-26 | 2011-03-09 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
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2007
- 2007-04-17 KR KR1020070037458A patent/KR101019445B1/ko active IP Right Grant
- 2007-04-17 AT AT07007786T patent/ATE450885T1/de active
- 2007-04-17 EP EP07007786A patent/EP1848025B1/en not_active Expired - Fee Related
- 2007-04-17 DE DE602007003506T patent/DE602007003506D1/de active Active
- 2007-04-17 US US11/785,351 patent/US7998308B2/en active Active
- 2007-04-17 TW TW096113508A patent/TW200802579A/zh unknown
- 2007-04-18 CN CN2007100961916A patent/CN101060070B/zh active Active
- 2007-04-18 CN CN2008101795797A patent/CN101441991B/zh active Active
Patent Citations (4)
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US5997653A (en) | 1996-10-07 | 1999-12-07 | Tokyo Electron Limited | Method for washing and drying substrates |
US20030168089A1 (en) | 1999-10-06 | 2003-09-11 | Ichiro Katakabe | Method of and apparatus for cleaning substrate |
JP2002170804A (ja) | 2000-12-04 | 2002-06-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置及び基板処理方法 |
US20040180141A1 (en) * | 2003-03-10 | 2004-09-16 | Shinji Kobayashi | Coating and processing apparatus and method |
Also Published As
Publication number | Publication date |
---|---|
DE602007003506D1 (de) | 2010-01-14 |
CN101441991A (zh) | 2009-05-27 |
US7998308B2 (en) | 2011-08-16 |
TWI362068B (ko) | 2012-04-11 |
CN101060070B (zh) | 2010-10-27 |
US20070240824A1 (en) | 2007-10-18 |
ATE450885T1 (de) | 2009-12-15 |
TW200802579A (en) | 2008-01-01 |
EP1848025B1 (en) | 2009-12-02 |
CN101060070A (zh) | 2007-10-24 |
EP1848025A1 (en) | 2007-10-24 |
KR20070103314A (ko) | 2007-10-23 |
CN101441991B (zh) | 2010-11-03 |
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