KR100859105B1 - 비접촉 ic 카드 - Google Patents
비접촉 ic 카드 Download PDFInfo
- Publication number
- KR100859105B1 KR100859105B1 KR1020027009761A KR20027009761A KR100859105B1 KR 100859105 B1 KR100859105 B1 KR 100859105B1 KR 1020027009761 A KR1020027009761 A KR 1020027009761A KR 20027009761 A KR20027009761 A KR 20027009761A KR 100859105 B1 KR100859105 B1 KR 100859105B1
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- Prior art keywords
- card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
구체적인 예로서는 3,3-비스(p-디메틸아미노페닐)-6-디메틸아미노푸탈리드, 3, 3-비스(p-디메틸아미노페닐)푸탈리드, 3, 3-비스(1,2-디메틸인돌-3-일)-6-디메틸아미노푸탈리드, 3-디메틸아미노-6-클로로-7-메틸플루오란, 3′3-비스-(9-에틸카바졸-3-일-5)-디메틸아미노푸탈리드, 3-디에틸아미노-7-디벤질아미노플루오란, 3-디에틸아미노-7-클로로플루오란, 3-디에틸아미노-6-메틸-7-아닐리노플루오란, 3-피페리디노-6-메틸-7-아닐리노플루오란, 3-(n-에틸-n-니트릴)아미노-6-메틸-7-아닐리노플루오란, 3-디부틸아미노-6-메틸-7-아닐리노플루오란, 3-(n-에틸-n-테트라하이드로푸릴)아미노-6-메틸-7-아닐리노플루오란 등을 들 수 있고, 단독 혹은 혼합하여 사용된다.
Claims (8)
- 기판 상에 IC 칩과 안테나 회로가 실장되어지는 IC 모듈이 적어도 한 쌍의 외장 필름으로 삽입되어지는 IC 카드에 있어서,상기 IC 칩은 수지에 의해서 그 외측이 밀봉됨과 동시에, 상기 수지 상에 배치된 IC 칩의 가장 긴 치수 값보다도 큰 직경의 대략 원형의 보강재에 의해서 보강되어 있고,상기 보강재의 표면에서의 형상의 고저 변화량이 20μm 이하의 범위이며,상기 기판의 IC 칩이 밀봉된 면과 반대측의 면이고, 상기 IC 칩에 대응하는 부분도 수지에 의해서 밀봉됨과 동시에, 상기 수지 상에 보강재가 배치되어 있는 것을 특징으로 하는, 비접촉 IC 카드.
- 제 1 항에 있어서,상기 보강재는 금속판으로 이루어지는 것을 특징으로 하는, 비접촉 IC 카드.
- 제 1 항에 있어서,상기 보강재는 비커스(Vickers) 경도가 200 이상, 580 미만의 범위인 것을 특징으로 하는, 비접촉 IC 카드.
- 제 3 항에 있어서,상기 보강재는 비커스 경도가 200 이상, 580 미만의 범위이고, 또한, 두께가 50μm 이상, 100μm 이하의 범위인 것을 특징으로 하는, 비접촉 IC 카드.
- 제 3 항에 있어서,상기 보강재는 비커스 경도가 300 이상, 580 미만의 범위이고, 또한, 두께가 30μm 이상, 100μm 이하의 범위인 것을 특징으로 하는, 비접촉 IC 카드.
- 삭제
- 제 1 항에 있어서,적어도 한쪽의 상기 외장 필름 상에 접착층을 개재하여 가역성 감열 기록 시트가 배치되어 있고,상기 가역성 감열 기록 시트는 플라스틱 시트와 상기 플라스틱 시트 상에 형성되어 가시 정보의 재기록이 가능한 가역성 감열 기록층과, 상기 가역성 감열 기록층 상에 형성된 투명한 보호층을 구비하는 것을 특징으로 하는, 비접촉 IC 카드.
- 제 1 항에 있어서,상기 외장 필름은 비염소 함유 재료로 이루어지는 것을 특징으로 하는, 비접촉 IC 카드.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000365967A JP4873776B2 (ja) | 2000-11-30 | 2000-11-30 | 非接触icカード |
JPJP-P-2000-00365967 | 2000-11-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020081283A KR20020081283A (ko) | 2002-10-26 |
KR100859105B1 true KR100859105B1 (ko) | 2008-09-18 |
Family
ID=18836652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020027009761A KR100859105B1 (ko) | 2000-11-30 | 2001-11-22 | 비접촉 ic 카드 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6942156B2 (ko) |
EP (1) | EP1243442B1 (ko) |
JP (1) | JP4873776B2 (ko) |
KR (1) | KR100859105B1 (ko) |
CN (1) | CN1264697C (ko) |
TW (1) | TW561415B (ko) |
WO (1) | WO2002043967A1 (ko) |
Families Citing this family (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6615189B1 (en) | 1998-06-22 | 2003-09-02 | Bank One, Delaware, National Association | Debit purchasing of stored value card for use by and/or delivery to others |
US7809642B1 (en) | 1998-06-22 | 2010-10-05 | Jpmorgan Chase Bank, N.A. | Debit purchasing of stored value card for use by and/or delivery to others |
US8793160B2 (en) | 1999-12-07 | 2014-07-29 | Steve Sorem | System and method for processing transactions |
WO2003010701A1 (en) | 2001-07-24 | 2003-02-06 | First Usa Bank, N.A. | Multiple account card and transaction routing |
US8020754B2 (en) | 2001-08-13 | 2011-09-20 | Jpmorgan Chase Bank, N.A. | System and method for funding a collective account by use of an electronic tag |
US7899753B1 (en) | 2002-03-25 | 2011-03-01 | Jpmorgan Chase Bank, N.A | Systems and methods for time variable financial authentication |
AU2003230751A1 (en) | 2002-03-29 | 2003-10-13 | Bank One, Delaware, N.A. | System and process for performing purchase transaction using tokens |
KR100467634B1 (ko) * | 2002-07-16 | 2005-01-24 | 삼성에스디에스 주식회사 | 스마트 카드 및 그의 제조방법 |
US6726099B2 (en) * | 2002-09-05 | 2004-04-27 | Honeywell International Inc. | RFID tag having multiple transceivers |
US7809595B2 (en) | 2002-09-17 | 2010-10-05 | Jpmorgan Chase Bank, Na | System and method for managing risks associated with outside service providers |
US20040122736A1 (en) | 2002-10-11 | 2004-06-24 | Bank One, Delaware, N.A. | System and method for granting promotional rewards to credit account holders |
FI20022070A (fi) * | 2002-11-20 | 2004-05-21 | Rafsec Oy | Transponderi |
JP2004185208A (ja) | 2002-12-02 | 2004-07-02 | Sony Corp | Icカード |
JP4365326B2 (ja) | 2003-01-03 | 2009-11-18 | アメリカン エクスプレス トラベル リレイテッド サービシーズ カンパニー, インコーポレイテッド | 金属を包含したトランザクションカード及びそれを作成する方法 |
US7823777B2 (en) * | 2003-01-03 | 2010-11-02 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making same |
US8033457B2 (en) | 2003-01-03 | 2011-10-11 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making the same |
US7588184B2 (en) | 2003-01-03 | 2009-09-15 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making the same |
FR2853115B1 (fr) * | 2003-03-28 | 2005-05-06 | A S K | Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede |
JP2004348590A (ja) * | 2003-05-23 | 2004-12-09 | Konica Minolta Photo Imaging Inc | Icカード及びicカード製造方法 |
US8306907B2 (en) | 2003-05-30 | 2012-11-06 | Jpmorgan Chase Bank N.A. | System and method for offering risk-based interest rates in a credit instrument |
JP2005014302A (ja) * | 2003-06-24 | 2005-01-20 | Sony Corp | 合成樹脂カード及びその製造方法 |
US7237719B2 (en) * | 2003-09-03 | 2007-07-03 | Stmicroelectronics, Inc. | Method and apparatus for a USB and contactless smart card device |
JP3803097B2 (ja) | 2003-10-07 | 2006-08-02 | 株式会社日立製作所 | 無線通信媒体の製造方法 |
JP4504693B2 (ja) * | 2004-01-30 | 2010-07-14 | トッパン・フォームズ株式会社 | スレッド、icチップ入りシート及びその製造方法 |
JP2005234683A (ja) * | 2004-02-17 | 2005-09-02 | Matsushita Electric Ind Co Ltd | Icカード |
US7154170B2 (en) * | 2004-03-31 | 2006-12-26 | Intel Corporation | Semiconductor package security features using thermochromatic inks and three-dimensional identification coding |
KR100602621B1 (ko) * | 2004-06-16 | 2006-07-19 | 한국조폐공사 | 조립식 콤비카드 및 이의 제조방법 |
JP2006024087A (ja) * | 2004-07-09 | 2006-01-26 | Nec Corp | 無線デバイス、その製造方法、その検査方法及び検査装置並びに無線装置及びその製造方法 |
CN100469591C (zh) * | 2004-09-14 | 2009-03-18 | 株式会社理光 | 可逆型热敏记录介质、图像处理方法以及图像处理装置 |
US7401731B1 (en) | 2005-05-27 | 2008-07-22 | Jpmorgan Chase Bank, Na | Method and system for implementing a card product with multiple customized relationships |
JP4815891B2 (ja) * | 2005-06-22 | 2011-11-16 | 株式会社日立製作所 | 無線icタグ及びアンテナの製造方法 |
TWI339358B (en) * | 2005-07-04 | 2011-03-21 | Hitachi Ltd | Rfid tag and manufacturing method thereof |
EP1780662A1 (fr) * | 2005-10-27 | 2007-05-02 | Axalto SA | Module renforcé pour carte à puce et procédé de fabrication dudit module |
US7595732B2 (en) * | 2006-03-31 | 2009-09-29 | Broadcom Corporation | Power generating circuit |
JP2007261121A (ja) | 2006-03-29 | 2007-10-11 | Ricoh Co Ltd | 可逆性感熱記録媒体用洗浄方法 |
US20070290048A1 (en) * | 2006-06-20 | 2007-12-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
TWI584199B (zh) * | 2006-08-07 | 2017-05-21 | 江國慶 | 具有非接觸式儲值卡之手持通訊裝置及其方法 |
TWI506560B (zh) * | 2006-08-07 | 2015-11-01 | Kuo Ching Chiang | Non - contact credit card and financial card trading device and its non - contact transaction method |
JP4382783B2 (ja) | 2006-08-09 | 2009-12-16 | 富士通株式会社 | Rfidタグ |
JP2009178843A (ja) | 2006-08-22 | 2009-08-13 | Rynne Group Llc | 識別カードおよびその識別カードを使用した識別カード取引システム |
KR20090086404A (ko) * | 2006-11-07 | 2009-08-12 | 토판.폼즈 컴퍼니 리미티드 | 창 기재, 모듈 내장형 카드 및 모듈 내장형 카드의 제조 방법 |
JP4860436B2 (ja) | 2006-11-07 | 2012-01-25 | トッパン・フォームズ株式会社 | Icカードおよびその製造方法 |
JP2008210032A (ja) * | 2007-02-23 | 2008-09-11 | Fujitsu Ltd | Rfidタグ |
JP2008204139A (ja) * | 2007-02-20 | 2008-09-04 | Toppan Forms Co Ltd | 非接触型データ受送信体 |
JP5145881B2 (ja) | 2007-11-07 | 2013-02-20 | 富士通株式会社 | Rfidタグ |
USD636021S1 (en) | 2008-07-17 | 2011-04-12 | Jpmorgan Chase Bank, N.A. | Eco-friendly transaction device |
USD620975S1 (en) | 2009-02-12 | 2010-08-03 | Jpmorgan Chase Bank, N.A. | Transaction device |
USD617378S1 (en) | 2009-02-12 | 2010-06-08 | Jpmorgan Chase Bank, N.A. | Transaction device with a gem-like surface appearance |
US8725589B1 (en) | 2009-07-30 | 2014-05-13 | Jpmorgan Chase Bank, N.A. | Methods for personalizing multi-layer transaction cards |
USD623690S1 (en) | 2010-03-05 | 2010-09-14 | Jpmorgan Chase Bank, N.A. | Metal transaction device with gem-like surface |
CA2792405C (en) * | 2010-03-08 | 2020-08-25 | Sensormatic Electronics, LLC | System and method for security tag deployment using reversible adhesives |
USD643064S1 (en) | 2010-07-29 | 2011-08-09 | Jpmorgan Chase Bank, N.A. | Metal transaction device with gem-like surface |
KR101275983B1 (ko) | 2010-09-01 | 2013-06-14 | 현대카드 주식회사 | 메탈 결제카드 및 그 제작 방법 |
US10032099B2 (en) | 2012-07-20 | 2018-07-24 | CPI Card Group—Colorado, Inc. | Weighted transaction card |
US8857722B2 (en) | 2012-07-20 | 2014-10-14 | CPI Card Group—Colorado, Inc. | Weighted transaction card |
CN103996351B (zh) * | 2013-02-20 | 2020-01-21 | 泰科消防及安全有限公司 | 粘合剂结合的物品保护标签 |
USD854083S1 (en) | 2013-03-27 | 2019-07-16 | Jpmorgan Chase Bank, N.A. | Hybrid transaction device |
DE102013109976B4 (de) * | 2013-09-11 | 2017-06-22 | Infineon Technologies Ag | Chipkartenmodul-Anordnung, Chipkarte, Verfahren zum Herstellen einer Chipkartenmodul-Anordnung und Verfahren zum Herstellen einer Chipkarte |
US9442662B2 (en) * | 2013-10-18 | 2016-09-13 | Sandisk Technologies Llc | Device and method for managing die groups |
US9070053B2 (en) | 2013-10-25 | 2015-06-30 | CPI Card Group—Colorado, Inc. | Multi-metal layered card |
JP6280014B2 (ja) * | 2014-09-30 | 2018-02-14 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
JP6353763B2 (ja) * | 2014-09-30 | 2018-07-04 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
US20160232438A1 (en) | 2015-02-06 | 2016-08-11 | American Express Travel Related Services Company, Inc. | Ceramic-containing transaction cards |
US10089568B2 (en) | 2016-06-01 | 2018-10-02 | CPI Card Group—Colorado, Inc. | IC chip card with integrated biometric sensor pads |
WO2018152218A1 (en) | 2017-02-14 | 2018-08-23 | Cpi Card Group - Colorado, Inc. | Edge-to-edge metal card and production method |
KR102242063B1 (ko) | 2019-11-04 | 2021-05-12 | (주)비티비엘 | 품질이 우수한 휴대용 카드 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10203059A (ja) | 1997-01-20 | 1998-08-04 | Toshiba Corp | 無線カード |
JP2000048151A (ja) * | 1998-07-30 | 2000-02-18 | Toppan Printing Co Ltd | 非接触icカード |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61123990A (ja) * | 1984-11-05 | 1986-06-11 | Casio Comput Co Ltd | Icカ−ド |
JPH0823149A (ja) * | 1994-05-06 | 1996-01-23 | Seiko Epson Corp | 半導体装置及びその製造方法 |
DE4443980C2 (de) * | 1994-12-11 | 1997-07-17 | Angewandte Digital Elektronik | Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren |
US5975420A (en) * | 1995-04-13 | 1999-11-02 | Dai Nippon Printing Co., Ltd. | Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
JPH09156267A (ja) * | 1995-12-06 | 1997-06-17 | Watada Insatsu Kk | プラスチックカード |
DE19632813C2 (de) * | 1996-08-14 | 2000-11-02 | Siemens Ag | Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte |
JPH1076779A (ja) * | 1996-09-04 | 1998-03-24 | Toppan Printing Co Ltd | 可逆性感熱記録カード及びその製造方法 |
JPH10198950A (ja) * | 1996-11-18 | 1998-07-31 | Dainippon Printing Co Ltd | 磁気カード |
KR100330651B1 (ko) * | 1997-06-23 | 2002-03-29 | 사토 게니치로 | Ic카드용 모듈, ic카드, 및 ic카드용 모듈의 제조방법 |
JP2000090229A (ja) * | 1998-07-13 | 2000-03-31 | Minolta Co Ltd | 情報記録表示カ―ド及びそれを用いた情報記録表示システム |
JP2000057295A (ja) * | 1998-08-14 | 2000-02-25 | Hitachi Maxell Ltd | 非接触icカード及びその製造方法 |
JP3340076B2 (ja) * | 1998-10-16 | 2002-10-28 | スター精密株式会社 | 可視表示カードおよびカード処理システム |
JP4215886B2 (ja) * | 1999-02-03 | 2009-01-28 | ソニー株式会社 | 半導体集積回路チップの封止方法、半導体集積回路カードの製造方法 |
JP2000137781A (ja) | 1998-10-30 | 2000-05-16 | Hitachi Ltd | カード型電子回路基板及びその製造方法 |
JP4284750B2 (ja) * | 1999-04-26 | 2009-06-24 | 凸版印刷株式会社 | カード及びカードの製造方法 |
JP4649688B2 (ja) * | 1999-04-28 | 2011-03-16 | 凸版印刷株式会社 | 非接触式icカード |
JP2001351076A (ja) * | 2000-06-05 | 2001-12-21 | Toppan Printing Co Ltd | 非接触icカード及び補強板搭載方法 |
-
2000
- 2000-11-30 JP JP2000365967A patent/JP4873776B2/ja not_active Expired - Lifetime
-
2001
- 2001-11-22 WO PCT/JP2001/010246 patent/WO2002043967A1/ja active Application Filing
- 2001-11-22 EP EP01998452.5A patent/EP1243442B1/en not_active Expired - Lifetime
- 2001-11-22 US US10/182,085 patent/US6942156B2/en not_active Expired - Lifetime
- 2001-11-22 CN CNB018042899A patent/CN1264697C/zh not_active Expired - Fee Related
- 2001-11-22 KR KR1020027009761A patent/KR100859105B1/ko active IP Right Grant
- 2001-11-27 TW TW090129290A patent/TW561415B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10203059A (ja) | 1997-01-20 | 1998-08-04 | Toshiba Corp | 無線カード |
JP2000048151A (ja) * | 1998-07-30 | 2000-02-18 | Toppan Printing Co Ltd | 非接触icカード |
Also Published As
Publication number | Publication date |
---|---|
JP4873776B2 (ja) | 2012-02-08 |
KR20020081283A (ko) | 2002-10-26 |
CN1396869A (zh) | 2003-02-12 |
US20030062420A1 (en) | 2003-04-03 |
CN1264697C (zh) | 2006-07-19 |
EP1243442B1 (en) | 2015-11-11 |
JP2002170087A (ja) | 2002-06-14 |
US6942156B2 (en) | 2005-09-13 |
EP1243442A4 (en) | 2006-03-29 |
TW561415B (en) | 2003-11-11 |
WO2002043967A1 (fr) | 2002-06-06 |
EP1243442A1 (en) | 2002-09-25 |
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