KR100790671B1 - 전기 장치 제조 방법 - Google Patents
전기 장치 제조 방법 Download PDFInfo
- Publication number
- KR100790671B1 KR100790671B1 KR1020037011127A KR20037011127A KR100790671B1 KR 100790671 B1 KR100790671 B1 KR 100790671B1 KR 1020037011127 A KR1020037011127 A KR 1020037011127A KR 20037011127 A KR20037011127 A KR 20037011127A KR 100790671 B1 KR100790671 B1 KR 100790671B1
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- South Korea
- Prior art keywords
- adhesive
- temperature
- semiconductor chip
- electric device
- pressing
- Prior art date
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- Engineering & Computer Science (AREA)
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Abstract
Description
Claims (15)
- 기판의 접속 단자와 반도체 칩의 접속 단자가 서로 대향하도록 위치 맞춤하고, 상기 기판 상에 배치된 접착제에 상기 반도체 칩을 밀어 붙여 상기 반도체 칩을 압박하면서 가열하고, 상기 접속 단자끼리를 접촉시키는 접착 공정을 갖고,상기 접착 공정은 상기 접착제를 제1 온도로 가열한 상태에서 상기 접착제에 상기 반도체 칩을 밀어 붙이는 임시 압착 공정과,상기 반도체 칩을 압박하면서, 상기 접착제를 상기 제1 온도보다도 높은 제2 온도로 가열하는 본압착 공정을 갖는 전기 장치의 제조 방법이며,상기 임시 압착 공정은 상기 반도체 칩을 상기 접착제에 밀어 붙일 때에, 상기 대향하는 접속 단자끼리가 서로 접촉하지 않을 정도로 상기 반도체 칩을 압박하는 것을 특징으로 하는 전기 장치 제조 방법.
- 제1항에 있어서, 상기 제1 온도는 상기 접착제의 반응 개시 온도 이상이며, 또한 상기 접착제의 반응 피크 온도 미만인 것을 특징으로 하는 전기 장치 제조 방법.
- 제1항에 있어서, 상기 제2 온도는 상기 접착제의 반응 피크 온도 이상인 것을 특징으로 하는 전기 장치 제조 방법.
- 제1항에 있어서, 상기 임시 압착 공정은 상기 기판을 제1 적재대 상에 배치하고, 상기 제1 적재대를 상기 제1 온도로 가열하는 것을 특징으로 하는 전기 장치 제조 방법.
- 제2항에 있어서, 상기 임시 압착 공정은 상기 기판을 제1 적재대 상에 배치하고, 상기 제1 적재대를 상기 제1 온도로 가열하는 것을 특징으로 하는 전기 장치 제조 방법.
- 제1항에 있어서, 상기 임시 압착 공정은 상기 위치 맞춤을 행한 후, 상기 반도체 칩을 상기 접착제에 밀어 붙이는 것을 특징으로 하는 전기 장치 제조 방법.
- 제2항에 있어서, 상기 임시 압착 공정은 상기 위치 맞춤을 행한 후, 상기 반도체 칩을 상기 접착제에 밀어 붙이는 것을 특징으로 하는 전기 장치 제조 방법.
- 삭제
- 삭제
- 제1항에 있어서, 상기 본압착 공정은 상기 제1 적재대와는 다른 제2 적재대에 상기 기판을 옮겨 적재하여 행하는 것을 특징으로 하는 전기 장치 제조 방법.
- 제3항에 있어서, 상기 본압착 공정은 상기 제1 적재대와는 다른 제2 적재대에 상기 기판을 옮겨 적재하여 행하는 것을 특징으로 하는 전기 장치 제조 방법.
- 제1항에 있어서, 상기 본압착 공정은 가열 가능한 압박 헤드를 상기 제2 온도로 가열하고, 상기 압박 헤드를 상기 반도체 칩에 밀어 붙이는 것을 특징으로 하는 전기 장치 제조 방법.
- 제3항에 있어서, 상기 본압착 공정은 가열 가능한 압박 헤드를 상기 제2 온도로 가열하고, 상기 압박 헤드를 상기 반도체 칩에 밀어 붙이는 것을 특징으로 하는 전기 장치 제조 방법.
- 제1항에 있어서, 상기 본압착 공정은 상기 대향하는 접속 단자끼리를 서로 접촉시킨 후, 상기 접착제를 상기 제2 온도로 가열하는 것을 특징으로 하는 전기 장치 제조 방법.
- 제3항에 있어서, 상기 본압착 공정은 상기 대향하는 접속 단자끼리를 서로 접촉시킨 후, 상기 접착제를 상기 제2 온도로 가열하는 것을 특징으로 하는 전기 장치 제조 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00049615 | 2001-02-26 | ||
JP2001049615A JP3665579B2 (ja) | 2001-02-26 | 2001-02-26 | 電気装置製造方法 |
PCT/JP2002/001284 WO2002071469A1 (fr) | 2001-02-26 | 2002-02-15 | Procede de production de dispositifs electriques |
Publications (2)
Publication Number | Publication Date |
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KR20030080035A KR20030080035A (ko) | 2003-10-10 |
KR100790671B1 true KR100790671B1 (ko) | 2007-12-31 |
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KR1020037011127A KR100790671B1 (ko) | 2001-02-26 | 2002-02-15 | 전기 장치 제조 방법 |
Country Status (7)
Country | Link |
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US (1) | US7341642B2 (ko) |
JP (1) | JP3665579B2 (ko) |
KR (1) | KR100790671B1 (ko) |
CN (1) | CN100392832C (ko) |
HK (1) | HK1064804A1 (ko) |
TW (1) | TW523885B (ko) |
WO (1) | WO2002071469A1 (ko) |
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Also Published As
Publication number | Publication date |
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WO2002071469A1 (fr) | 2002-09-12 |
CN100392832C (zh) | 2008-06-04 |
HK1064804A1 (en) | 2005-02-04 |
JP2002252254A (ja) | 2002-09-06 |
CN1505835A (zh) | 2004-06-16 |
US20040079464A1 (en) | 2004-04-29 |
JP3665579B2 (ja) | 2005-06-29 |
KR20030080035A (ko) | 2003-10-10 |
US7341642B2 (en) | 2008-03-11 |
TW523885B (en) | 2003-03-11 |
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