HK1064804A1 - Electric device producing method - Google Patents
Electric device producing methodInfo
- Publication number
- HK1064804A1 HK1064804A1 HK04107600.3A HK04107600A HK1064804A1 HK 1064804 A1 HK1064804 A1 HK 1064804A1 HK 04107600 A HK04107600 A HK 04107600A HK 1064804 A1 HK1064804 A1 HK 1064804A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electric device
- producing method
- device producing
- electric
- producing
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/812—Applying energy for connecting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001049615A JP3665579B2 (ja) | 2001-02-26 | 2001-02-26 | 電気装置製造方法 |
PCT/JP2002/001284 WO2002071469A1 (fr) | 2001-02-26 | 2002-02-15 | Procede de production de dispositifs electriques |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1064804A1 true HK1064804A1 (en) | 2005-02-04 |
Family
ID=18910693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK04107600.3A HK1064804A1 (en) | 2001-02-26 | 2004-10-04 | Electric device producing method |
Country Status (7)
Country | Link |
---|---|
US (1) | US7341642B2 (xx) |
JP (1) | JP3665579B2 (xx) |
KR (1) | KR100790671B1 (xx) |
CN (1) | CN100392832C (xx) |
HK (1) | HK1064804A1 (xx) |
TW (1) | TW523885B (xx) |
WO (1) | WO2002071469A1 (xx) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4206320B2 (ja) * | 2003-09-19 | 2009-01-07 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
US20080055581A1 (en) * | 2004-04-27 | 2008-03-06 | Rogers John A | Devices and methods for pattern generation by ink lithography |
US7943491B2 (en) * | 2004-06-04 | 2011-05-17 | The Board Of Trustees Of The University Of Illinois | Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp |
US8217381B2 (en) | 2004-06-04 | 2012-07-10 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
US7521292B2 (en) | 2004-06-04 | 2009-04-21 | The Board Of Trustees Of The University Of Illinois | Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
JP2008502151A (ja) | 2004-06-04 | 2008-01-24 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | 印刷可能半導体素子を製造して組み立てるための方法及びデバイス |
US7799699B2 (en) * | 2004-06-04 | 2010-09-21 | The Board Of Trustees Of The University Of Illinois | Printable semiconductor structures and related methods of making and assembling |
CH697279B1 (de) * | 2004-12-06 | 2008-07-31 | Oerlikon Assembly Equipment Ag | Verfahren für die Montage eines Halbleiterchips auf einem Substrat. |
US7935892B2 (en) * | 2005-04-14 | 2011-05-03 | Panasonic Corporation | Electronic circuit device and method for manufacturing same |
JP4621595B2 (ja) * | 2006-01-11 | 2011-01-26 | 株式会社東芝 | 半導体装置の製造方法 |
JP2009528254A (ja) | 2006-03-03 | 2009-08-06 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | 空間的に配列したナノチューブ及びナノチューブアレイの作製方法 |
JP5020629B2 (ja) * | 2006-12-28 | 2012-09-05 | パナソニック株式会社 | 電子部品の接続方法 |
CN105826345B (zh) | 2007-01-17 | 2018-07-31 | 伊利诺伊大学评议会 | 通过基于印刷的组装制造的光学*** |
JP2008209961A (ja) * | 2007-02-23 | 2008-09-11 | Fujitsu Ltd | 電子装置の製造方法、電子装置が実装された電子機器の製造方法、および、電子装置が装着された物品の製造方法 |
WO2009001605A1 (ja) * | 2007-06-26 | 2008-12-31 | Sony Chemical & Information Device Corporation | 異方性導電材料、接続構造体及びその製造方法 |
JP5093482B2 (ja) * | 2007-06-26 | 2012-12-12 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電材料、接続構造体及びその製造方法 |
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-
2001
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2002
- 2002-02-15 CN CNB028087933A patent/CN100392832C/zh not_active Expired - Lifetime
- 2002-02-15 KR KR1020037011127A patent/KR100790671B1/ko active IP Right Grant
- 2002-02-15 WO PCT/JP2002/001284 patent/WO2002071469A1/ja active Application Filing
- 2002-02-19 TW TW091102771A patent/TW523885B/zh not_active IP Right Cessation
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US20040079464A1 (en) | 2004-04-29 |
JP3665579B2 (ja) | 2005-06-29 |
KR20030080035A (ko) | 2003-10-10 |
KR100790671B1 (ko) | 2007-12-31 |
US7341642B2 (en) | 2008-03-11 |
CN100392832C (zh) | 2008-06-04 |
TW523885B (en) | 2003-03-11 |
CN1505835A (zh) | 2004-06-16 |
WO2002071469A1 (fr) | 2002-09-12 |
JP2002252254A (ja) | 2002-09-06 |
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