WO2009001605A1 - 異方性導電材料、接続構造体及びその製造方法 - Google Patents

異方性導電材料、接続構造体及びその製造方法 Download PDF

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Publication number
WO2009001605A1
WO2009001605A1 PCT/JP2008/057317 JP2008057317W WO2009001605A1 WO 2009001605 A1 WO2009001605 A1 WO 2009001605A1 JP 2008057317 W JP2008057317 W JP 2008057317W WO 2009001605 A1 WO2009001605 A1 WO 2009001605A1
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WIPO (PCT)
Prior art keywords
anisotropic
connection structure
melt viscosity
elctroconductive
producing
Prior art date
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PCT/JP2008/057317
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English (en)
French (fr)
Inventor
Yoshito Tanaka
Jun Yamamoto
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Sony Chemical & Information Device Corporation
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Publication date
Priority claimed from JP2008037781A external-priority patent/JP5093482B2/ja
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to KR1020097026599A priority Critical patent/KR101196684B1/ko
Priority to CN2008800217976A priority patent/CN101689409B/zh
Priority to US12/451,501 priority patent/US8148641B2/en
Publication of WO2009001605A1 publication Critical patent/WO2009001605A1/ja
Priority to HK10106279A priority patent/HK1140307A1/xx

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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001—Core members of the layer connector
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

　ＩＣチップやフレキシブル配線を配線基板に異方性導電材料を介して接続する際に、各バンプ間やライン状端子間で導通抵抗を相違させないような異方性導電材料は、導電性粒子が絶縁性バインダに分散されてなるものであって、最低溶融粘度［η０］が１．０×１０２～１．０×１０６ｍＰａ・ｓｅｃであり、且つ以下の式（１）を満足するものである。　１＜［η１］／［η０］≦３　（１）　 式（１）において、［η０］は異方性導電材料の最低溶融粘度であり、［η１］は最低溶融粘度を示す温度Ｔ０より３０°C低い温度Ｔ１における溶融粘度である。
PCT/JP2008/057317 2007-06-26 2008-04-15 異方性導電材料、接続構造体及びその製造方法 WO2009001605A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097026599A KR101196684B1 (ko) 2007-06-26 2008-04-15 이방성 도전 재료, 접속 구조체 및 그 제조 방법
CN2008800217976A CN101689409B (zh) 2007-06-26 2008-04-15 各向异性导电材料、连接结构体及其制造方法
US12/451,501 US8148641B2 (en) 2007-06-26 2008-04-15 Anisotropic conductive material, connected structure, and production method thereof
HK10106279A HK1140307A1 (en) 2007-06-26 2010-06-25 Anisotropic electroconductive material, connection structure, and process for producing the connection structure

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007167479 2007-06-26
JP2007-167479 2007-06-26
JP2008037781A JP5093482B2 (ja) 2007-06-26 2008-02-19 異方性導電材料、接続構造体及びその製造方法
JP2008-037781 2008-02-19

Publications (1)

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WO2009001605A1 true WO2009001605A1 (ja) 2008-12-31

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013258139A (ja) * 2012-05-18 2013-12-26 Sekisui Chem Co Ltd 導電材料、接続構造体及び接続構造体の製造方法
JP2015091957A (ja) * 2009-11-17 2015-05-14 日立化成株式会社 回路接続材料、それを用いた接続構造体及び仮圧着方法
US9427545B2 (en) 2009-11-20 2016-08-30 Resmed Limited Mask system

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757805A (ja) * 1993-08-10 1995-03-03 Shin Etsu Polymer Co Ltd 熱圧着性接続部材
WO2002054476A1 (fr) * 2000-12-28 2002-07-11 Toray Engineering Co., Ltd. Procede de montage de puce
JP2002252254A (ja) * 2001-02-26 2002-09-06 Sony Chem Corp 電気装置製造方法
WO2003001586A1 (en) * 2001-06-20 2003-01-03 Toray Engineering Co., Ltd. Mounting method and device
JP2004335916A (ja) * 2003-05-12 2004-11-25 Toshiba Corp 半導体装置の製造方法
JP2004363167A (ja) * 2003-06-02 2004-12-24 Nippon Steel Chem Co Ltd 配線板の相互接続方法
JP2005200521A (ja) * 2004-01-15 2005-07-28 Sony Chem Corp 接着フィルム、接着フィルムの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757805A (ja) * 1993-08-10 1995-03-03 Shin Etsu Polymer Co Ltd 熱圧着性接続部材
WO2002054476A1 (fr) * 2000-12-28 2002-07-11 Toray Engineering Co., Ltd. Procede de montage de puce
JP2002252254A (ja) * 2001-02-26 2002-09-06 Sony Chem Corp 電気装置製造方法
WO2003001586A1 (en) * 2001-06-20 2003-01-03 Toray Engineering Co., Ltd. Mounting method and device
JP2004335916A (ja) * 2003-05-12 2004-11-25 Toshiba Corp 半導体装置の製造方法
JP2004363167A (ja) * 2003-06-02 2004-12-24 Nippon Steel Chem Co Ltd 配線板の相互接続方法
JP2005200521A (ja) * 2004-01-15 2005-07-28 Sony Chem Corp 接着フィルム、接着フィルムの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015091957A (ja) * 2009-11-17 2015-05-14 日立化成株式会社 回路接続材料、それを用いた接続構造体及び仮圧着方法
US9427545B2 (en) 2009-11-20 2016-08-30 Resmed Limited Mask system
JP2013258139A (ja) * 2012-05-18 2013-12-26 Sekisui Chem Co Ltd 導電材料、接続構造体及び接続構造体の製造方法

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