KR100529371B1 - 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법 - Google Patents
촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법 Download PDFInfo
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- KR100529371B1 KR100529371B1 KR10-2003-0052425A KR20030052425A KR100529371B1 KR 100529371 B1 KR100529371 B1 KR 100529371B1 KR 20030052425 A KR20030052425 A KR 20030052425A KR 100529371 B1 KR100529371 B1 KR 100529371B1
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- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/44—Optical arrangements or shielding arrangements, e.g. filters or lenses
- H01J2211/446—Electromagnetic shielding means; Antistatic means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Abstract
Description
Claims (13)
- (a) 아크릴레이트 또는 메타크릴레이트 작용기를 가지고, 분자량이 500 내지 5000인 것을 특징으로 하는 반응성 저중합체(reactive oligomer);(b) 아크릴레이트 또는 메타크릴레이트 작용기를 가지고, 분자량이 100 내지 600인 것을 특징으로 하는 반응성 단위체(reactive monomer);(c)α-하이드록시케톤(α-hydroxyketone), 페닐글리옥시레이트(phenylglyoxylate), 벤질 디메틸 케탈(benzil dimethyl ketal), α-아미노케톤(α-aminoketone), 모노 아실포스핀(mono acylphosphine) 및 비스 아실 포스핀(bis acylphosphine)으로 이루어진 군으로부터 선택된 것을 특징으로 하는 광경화 개시제(photoinitiator);(d) Ⅷ족 또는 ⅠB 족 금속의 유기화합물인 것을 특징으로 하는 무전해도금 촉매 전구물질; 및(e) 클로로포름(chloroform), 아세토니트릴(acetonitrile), 메틸 에틸 케톤(methyl ethyl ketone) 및 에틸 아세테이트(ethyl acetate)로 이루어지는 군으로부터 선택된 것을 특징으로 하는 용매를 포함하는 촉매전구체 수지조성물.
- 삭제
- 제1항에 있어서,상기 (a) 반응성 저중합체는 우레탄 아크릴레이트(urethane acrylate), 우레탄 디아크릴레이트(urethane diacrylate), 우레탄 트리아크릴레이트(urethane triacrylate), 우레탄 메타크릴레이트(urethane methacrylate), 에폭시 아크릴레이트(epoxy acrylate), 에폭시 디아크릴레이트(epoxy diacrylate), 폴리에스테르 아크릴레이트(polyester acrylate) 및 아크릴릭 아크릴레이트(acrylic acrylate)로 이루어진 군으로부터 선택된 것을 특징으로 하는 촉매전구체 수지조성물.
- 삭제
- 제1항에 있어서,상기 (b) 반응성 단위체는 이소보닐 아크릴레이트(isobornyl acrylate), 옥틸 아크릴레이트(octyl acrylate), 데실 아크릴레이트(decyl acrylate), 1,6-헥산디올 디아크릴레이트(1,6-hexanediol diacrylate), 디프로필렌 글리콜 디아크릴레이트(dipropylene glycol diacrylate), 트리프로필렌 글리콜 디아크릴레이트(tripropylene glycol diacrylate), 트리에틸렌 글리콜 디아크릴레이트(triethylene glycol diacrylate), 테트라에틸렌 글리콜 디아크릴레이트(tetraethylene glycol diacrylate), 에톡실레이티드 네오펜틸 글리콜 디아크릴레이트(ethoxylated neopentyl glycol diacrylate), 프로폭실레이티드 네오펜틸 글리콜 디아크릴레이트(propoxylated neopentyl glycol diacrylate), 2-펜옥시에틸 아크릴레이트(2-phenoxyethyl acrylate), 프로폭실레이티드 글리세릴 트리아크릴레이트(propoxylated glyceryl triacrylate), 에톡실레이티드 트리메틸올프로판 트리아크릴레이트(ethoxylated trimethylolpropane triacrylate) 및 펜타에리트리톨 트리아크릴레이트(pentaerythritol triacrylate)로 이루어진 군으로부터 선택된 것을 특징으로 하는 촉매전구체 수지조성물.
- 삭제
- 삭제
- 제1항에 있어서,상기 (d) 무전해도금 촉매 전구물질은 팔라듐 2가 양이온(Pd2+)과 카르보닐기 또는 올레핀기를 포함하는 유기 화합물의 염(salt)인 것을 특징으로 하는 촉매전구체 수지조성물.
- 제8항에 있어서,상기 팔라듐 2가 양이온(Pd2+)과 카르보닐기 또는 올레핀기를 포함하는 유기 화합물의 염(salt)은 팔라듐 아세테이트(palladium acetate), 팔라듐 트리플루오로아세테이트(palladium trifluoroacetate), 팔라듐 옥살레이트(palladium oxalate) 및 팔라듐 아세틸아세토네이트(palladium acetylacetonate)로 이루어진 군으로부터 선택된 것을 특징으로 하는 촉매전구체 수지조성물.
- 삭제
- (a) 반응성 저중합체(reactive oligomer); (b) 반응성 단위체(reactive monomer); (c) 광경화 개시제(photoinitiator); (d) 무전해도금 촉매 전구물질; 및(e) 용매를 포함하는 촉매전구체 수지조성물을 투명기재에 격자상 패턴으로 인쇄하고, 자외선을 조사하여 경화시킨 후 경화물 표면에 무전해도금을 실시하는 투광성 전자파 차폐재 제조방법.
- 제11항 기재의 방법으로 제조된 투광성 전자파 차폐재.
- 제12항에 있어서,상기 투광성 전자파 차폐재는 아래서부터 기재, 자외선 경화물층 및 도금층으로 적층된 것을 특징으로 하는 투광성 전자파 차폐재.
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0052425A KR100529371B1 (ko) | 2003-07-29 | 2003-07-29 | 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법 |
AT04748475T ATE411412T1 (de) | 2003-07-29 | 2004-07-23 | Katalysatorvorluuferzusammensetzung f r die stromlose metallabscheidung und verfahren zur herstellung von transparentem material zur abschirmung gegen elektromagnetische interferenz unter verwendung davon |
CNB2004800009320A CN100427643C (zh) | 2003-07-29 | 2004-07-23 | 无电镀用催化剂前体组合物和用该组合物制备透明的电磁干扰屏蔽材料的方法 |
DE200460017183 DE602004017183D1 (de) | 2003-07-29 | 2004-07-23 | KATALYSATORVORLuUFERZUSAMMENSETZUNG F R DIE STROMLOSE METALLABSCHEIDUNG UND VERFAHREN ZUR HERSTELLUNG VON TRANSPARENTEM MATERIAL ZUR ABSCHIRMUNG GEGEN ELEKTROMAGNETISCHE INTERFERENZ UNTER VERWENDUNG DAVON |
PCT/KR2004/001860 WO2005010234A1 (en) | 2003-07-29 | 2004-07-23 | Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same |
EP04748475A EP1649077B1 (en) | 2003-07-29 | 2004-07-23 | Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same |
JP2005518227A JP4160598B2 (ja) | 2003-07-29 | 2004-07-23 | 触媒前駆体樹脂組成物及びこれを利用した透光性電磁波遮蔽材の製造方法 |
TW93122464A TWI267531B (en) | 2003-07-29 | 2004-07-27 | Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same |
US10/900,622 US7378478B2 (en) | 2003-07-29 | 2004-07-28 | Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same |
US12/102,095 US8053540B2 (en) | 2003-07-29 | 2008-04-14 | Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR10-2003-0052425A KR100529371B1 (ko) | 2003-07-29 | 2003-07-29 | 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법 |
Publications (2)
Publication Number | Publication Date |
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KR20050013842A KR20050013842A (ko) | 2005-02-05 |
KR100529371B1 true KR100529371B1 (ko) | 2005-11-21 |
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KR10-2003-0052425A KR100529371B1 (ko) | 2003-07-29 | 2003-07-29 | 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법 |
Country Status (9)
Country | Link |
---|---|
US (2) | US7378478B2 (ko) |
EP (1) | EP1649077B1 (ko) |
JP (1) | JP4160598B2 (ko) |
KR (1) | KR100529371B1 (ko) |
CN (1) | CN100427643C (ko) |
AT (1) | ATE411412T1 (ko) |
DE (1) | DE602004017183D1 (ko) |
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JP4160598B2 (ja) | 2008-10-01 |
US20080213506A1 (en) | 2008-09-04 |
DE602004017183D1 (de) | 2008-11-27 |
CN1701135A (zh) | 2005-11-23 |
EP1649077A1 (en) | 2006-04-26 |
ATE411412T1 (de) | 2008-10-15 |
CN100427643C (zh) | 2008-10-22 |
WO2005010234A1 (en) | 2005-02-03 |
KR20050013842A (ko) | 2005-02-05 |
JP2006510809A (ja) | 2006-03-30 |
US7378478B2 (en) | 2008-05-27 |
TWI267531B (en) | 2006-12-01 |
US8053540B2 (en) | 2011-11-08 |
EP1649077B1 (en) | 2008-10-15 |
US20050022692A1 (en) | 2005-02-03 |
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