JP2015517584A - 触媒濃度の最適化により低分散を有する高解像度導電パターン - Google Patents
触媒濃度の最適化により低分散を有する高解像度導電パターン Download PDFInfo
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- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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Abstract
Description
本出願は、参照により本明細書に組み込まれる2012年5月4日に出願された米国特許仮出願第61/642,500号(代理人整理番号2911−03900)の優先権を主張する。
フレキソ印刷は、レリーフプレートが印刷シリンダ上に搭載された回転式ウェブ凸版印刷の一形態である。マスタプレートまたはフレキソプレートとも称されるこれらのレリーフプレートは、アニロックスなどの2つのローラインキングシステムから供給されるインクと組み合わせて使用することもできる。アニロックスロールは、印刷プレートに対するインクの測定量を提供するために使用されるシリンダとすることができる。インクは熱硬化性または紫外線(UV)硬化性のインクとすることができる。一例において、第1のローラは、インクをインクパンまたは計量システムからメーターローラまたはアニロックスロールに移す。インクがアニロックスローラから版胴に移されると、インクは均一な厚さに計量される。基板がロールツーロール処理システムを介して版胴から圧胴に移動するとき、圧胴は、画像をレリーフプレート上に、その後透明な可撓性の基板に移す版胴に圧力を加える。実施例によっては、版胴の代わりに壷ローラが存在し得、ドクターブレードは、ローラにわたるインクの分布を改善するために使用することもできる。
上側と下側(すなわち第1と第2の)面に印刷された第1パターンと第2パターンは、透明な可撓性の基板の上側(第1)の表面に印刷された単一ループアンテナ、および基板の下側(第2)の表面に印刷された複数のループを有するアンテナとすることができる。ひとつの例として、両方のパターンは、パラジウムなどの触媒性インクの有機金属化合物を用いて印刷することもできる。パラジウム、ロジウム、白金、銅、またはニッケルの酢酸塩またはシュウ酸塩である他の有機金属触媒が使用することもできる。ここでいうインク中の触媒は、HRPの無電解めっきを支援するために使用される。しかし、加えて、触媒はまた、粘度安定化、および印刷された線幅のばらつきを低減するのに役立ち得る。
Claims (20)
- フレキソ印刷用のインク組成物であって、粘度100cpsから10000cpsのアクリル系ポリマーと、濃度1重量%から12重量%の有機金属触媒とを含むことを特徴とするインク組成物。
- アクリル系ポリマーの粘度が200cpsから2000cpsである、請求項1に記載のインク。
- インク中の有機金属触媒の濃度が3重量%から7重量%である、請求項1に記載のインク。
- 有機金属触媒がパラジウムの有機金属化合物である、請求項1に記載のインク。
- 粘度が1200cpsである、請求項1に記載のインク。
- 有機金属触媒が銅含有化合物である、請求項1に記載のインク。
- 高解像度導電パターンを印刷するための方法であって、
アクリル系樹脂および有機金属触媒を含む粘度10cpsから2000cpsのインクを用い、フレキソ印刷プロセスによって基板の少なくとも1つの側面に複数の線を印刷する過程と、
インクを硬化させる過程と、
無電解塩でインクをめっきする過程とを含むことを特徴とする方法。 - インク中の有機金属触媒の濃度が1重量%から8重量%である、請求項7に記載の方法。
- 有機金属触媒がパラジウムの有機金属化合物である、請求項7に記載の方法。
- インクの粘度が200cpsである、請求項7に記載の方法。
- インクの粘度が1200cpsである、請求項7に記載の方法。
- 複数の線の各線の幅が1ミクロンから100ミクロンである、請求項7に記載の方法。
- 複数の線の各線の高さが0.2ミクロンから2ミクロンである、請求項7に記載の方法。
- 無電解塩が銅含有溶液である、請求項7に記載の方法。
- 無電解塩がニッケル含有溶液である、請求項7に記載の方法。
- 高解像度導電パターンを印刷するためのインクであって、
アクリル系ポリマーと、濃度3重量%から12重量%の有機金属触媒とを含み、
インクの粘度が200cpsから10000cpsであることを特徴とするインク。 - 粘度が1200cpsであり、有機金属触媒の濃度が3重量%から7重量%である、請求項16に記載のインク。
- 有機金属触媒がパラジウムの有機金属化合物である、請求項16に記載のインク。
- 有機金属触媒が銅化合物である、請求項16に記載のインク。
- 有機金属触媒がニッケル化合物である、請求項16に記載のインク。
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US201261642500P | 2012-05-04 | 2012-05-04 | |
US61/642,500 | 2012-05-04 | ||
PCT/US2013/036636 WO2013165681A1 (en) | 2012-05-04 | 2013-04-15 | High resolution conductive patterns having low variance through optimization of catalyst concentration |
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GB (1) | GB2514738A (ja) |
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JP6161699B2 (ja) * | 2012-07-30 | 2017-07-12 | イーストマン コダック カンパニー | 高精細導電性パターンのフレキソ印刷向けのインク組成 |
US9207533B2 (en) | 2014-02-07 | 2015-12-08 | Eastman Kodak Company | Photopolymerizable compositions for electroless plating methods |
US9188861B2 (en) | 2014-03-05 | 2015-11-17 | Eastman Kodak Company | Photopolymerizable compositions for electroless plating methods |
GB2524327A (en) * | 2014-03-21 | 2015-09-23 | Nokia Technologies Oy | Flexible electronics apparatus and associated methods |
US9637659B2 (en) | 2014-06-23 | 2017-05-02 | Eastman Kodak Company | Latex primer composition and latex primed substrates |
US9606652B2 (en) | 2014-06-23 | 2017-03-28 | Eastman Kodak Company | Electronic devices and precursor articles |
US9205628B1 (en) | 2014-06-23 | 2015-12-08 | Eastman Kodak Company | Patterned and primed transparent articles |
US9505942B2 (en) | 2014-06-23 | 2016-11-29 | Eastman Kodak Company | Preparation of patterned or electrically-conductive articles |
JP6676620B2 (ja) * | 2014-08-15 | 2020-04-08 | アトテック・ドイチュラント・ゲーエムベーハーAtotech Deutschland Gmbh | 銅回路、銅合金回路、およびタッチスクリーンデバイスの光反射率の低減方法 |
EP3010315A1 (en) | 2014-10-16 | 2016-04-20 | Nokia Technologies OY | A deformable apparatus and method |
CN107742776B (zh) * | 2017-08-25 | 2020-07-10 | 捷开通讯(深圳)有限公司 | 一种天线的制备方法 |
KR102193013B1 (ko) * | 2018-06-22 | 2020-12-18 | 김동철 | Uv잉크 인쇄유닛을 이용하여 투명글라스에 문양을 인쇄하는 방법 |
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JP2006510809A (ja) * | 2003-07-29 | 2006-03-30 | エルジー・ケム・リミテッド | 触媒前駆体樹脂組成物及びこれを利用した透光性電磁波遮蔽材の製造方法 |
JP2011251534A (ja) * | 2003-12-05 | 2011-12-15 | Conductive Inkjet Technology Ltd | 基板上の固体層の形成 |
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US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
US6772683B2 (en) * | 2002-02-19 | 2004-08-10 | Sun Chemical Corporation | Method and apparatus for wet trapping with energy-curable flexographic liquid inks |
US8435603B2 (en) * | 2003-12-05 | 2013-05-07 | Conductive Inkjet Technology Limited | Formation of solid layers on substrates |
US7255782B2 (en) * | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
JP2011094192A (ja) * | 2009-10-29 | 2011-05-12 | Fujifilm Corp | 被めっき層形成用組成物、金属パターン材料の作製方法、及び金属パターン材料 |
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- 2013-04-15 GB GB201417520A patent/GB2514738A/en not_active Withdrawn
- 2013-04-15 WO PCT/US2013/036636 patent/WO2013165681A1/en active Application Filing
- 2013-04-15 US US14/398,657 patent/US20150107474A1/en not_active Abandoned
- 2013-04-15 CN CN201380023488.3A patent/CN104334654A/zh active Pending
- 2013-04-15 JP JP2015510298A patent/JP2015517584A/ja active Pending
- 2013-04-15 KR KR1020147034161A patent/KR20150006055A/ko not_active Application Discontinuation
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JP2006510809A (ja) * | 2003-07-29 | 2006-03-30 | エルジー・ケム・リミテッド | 触媒前駆体樹脂組成物及びこれを利用した透光性電磁波遮蔽材の製造方法 |
JP2011251534A (ja) * | 2003-12-05 | 2011-12-15 | Conductive Inkjet Technology Ltd | 基板上の固体層の形成 |
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CN104334654A (zh) | 2015-02-04 |
US20150107474A1 (en) | 2015-04-23 |
WO2013165681A1 (en) | 2013-11-07 |
KR20150006055A (ko) | 2015-01-15 |
GB201417520D0 (en) | 2014-11-19 |
TW201402721A (zh) | 2014-01-16 |
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